LTEC Corporation.

Since its founding in 1988, LTEC Corporation has utilized its semiconductor based analysis techniques and experience in research for intellectual property such as patents to provide clients with technological information in the form of reports according to their requests.

The company currently carries out benchmarking activities, from component acquisition to analysis, for a wide variety of products including semiconductors, and also handles a range of projects including patent research. LTEC does research analysis for around 400 items per year, and generates reports for sale that take advantage of this expertise.

Reports for sale

MarkLines offers the following reports analyzing new devices for purchase:

Infineon's power module for Hyundai automotive IONIQ/PHEV structure Analysis, 94 pages
Price : $7,000 USD
Sample : ltec_pdf_060e.pdf
ROHM 1200V SiC MOSFET (SCT3080KLHR) short circuit robustness Analysis, 40 pages
Price : $6,500 USD
Sample : ltec_pdf_056e.pdf
INFINEON 1200V SiC MOSFET(IMW120R045M1) short circuit robustness Analysis, 40 pages
Price : $7,500 USD
Sample : ltec_pdf_057e.pdf
Wolfspeed 900V SiC MOSFET (E3M0065090D) short circuit robustness Analysis, 45 pages
Price : $6,500 USD
Sample : ltec_pdf_042e.pdf
Wolfspeed 1200V SiC MOSFET (C3M0075120K) short circuit robustness Analysis, 34 pages
Price : $5,000 USD
Sample : ltec_pdf_043e.pdf
Rohm SiC Power module Gate Driver circuit Analysis, 25 pages
Price : $7,200 USD
Sample : ltec_pdf_044e.pdf
INFINEON Easy PACKTM 7th GEN. IGBT module Analysis
Structure analysis report, 137 pages
Price : $7,000 USD
Process analysis report, 51 pages
Price : $4,600 USD
Sample : ltec_pdf_045e.pdf
Fuji Electric 6MBI800XV-075V-01 IGBT Module Analysis
Module structure analysis report, 84 pages
Price : $3,500 USD
IGBT die analysis report, 158 pages
Price : $5,800 USD
Process and electrical characteristics analysis report, 61 pages
Price : $4,600 USD
Sample : ltec_pdf_047e.pdf
ON Semiconductor SiC MOSFET (NVHL080N120) Analysis
Structure analysis report, 97 pages
Price : $6,000 USD
Process and electrical characteristics analysis report, 36 pages
Price : $4,600 USD
Sample : ltec_pdf_048e.pdf
ON Semiconductor SiC MOSFET (NVHL080N120) short circuit robustness Analysis, 41 pages
Price : $6,500 USD
Sample : ltec_pdf_049e.pdf
GaN Systems 100V high current GaN FET (GS61008T) Analysis
Structure analysis report, 66 pages
Price : $7,000 USD
Process analysis report, 33 pages
Price : $4,600 USD
Sample : ltec_pdf_050e.pdf
1200V SiC MOSFETs Short-Circuit Robustness Benchmark, 62 pages
Price : $9,500 USD
Sample : ltec_pdf_030e.pdf

Teardown Analysis report

DELPHI INVERTER for GEELY AUTOMOTIVE Bo Rui/PHV
78 pages report includes the images of teardown process and BOM list of each PCBs.
Price : $3,000 USD
Sample : ltec_pdf_051e.pdf
DELPHI INVERTER for GEELY AUTOMOTIVE Bo Rui/PHV POWER CARD structure analysis
87 pages report include IGBT power module structure and IGBT structure analysis.
Price : $7,200 USD
Sample : ltec_pdf_052e.pdf
ENPOWER INVERTER for BAIC Motor EC180/EV
50 pages report include the images of teardown process and BOM list of each PCBs.
Price : $3,000 USD
Sample : ltec_pdf_053e.pdf
HANGZHOUEV-TECH OBC(ON Board Charger) for Great Wall Motor ORA-R1/EV
76 pages report includes the images of teardown process and BOM list of each PCBs.
Price : $3,000 USD
Sample : ltec_pdf_054e.pdf
HANGZHOUEV-TECH OBC for Great Wall Motor ORA-R1/EV CIRCUIT analysis
96 pages report includes the PCB outline, layout of each layer, function block diagram,detailed circuit diagram and parts list.
Price : $25,000 USD
Sample : ltec_pdf_055e.pdf
Electric Devices and Components for the 4th-generation Toyota Prius (the following 6 reports)
- Battery supervising circuit board from Denso, circuit analysis, 62 pages
  56 cells are batch-monitored without employing cell supervising units. Direct transmission with DCDC, DC/AC converter, inverter.
  https://www.marklines.com/statics/teardown/ltec_pdf_003.pdf
- Inverter circuit board from Denso, circuit analysis, 95 pages
  Controls motor driven “power guard.” Regulates power, regeneration, two way DC/DC.
  https://www.marklines.com/statics/teardown/ltec_pdf_004.pdf
- DC/AC converter circuit board from Toyota Industries, circuit analysis, 75 pages
  Size reduced 30% from previous generation. Adopts ASIC from the same company. Includes analysis for circuit board structure, circuits, noise, heat dissipation.
  https://www.marklines.com/statics/teardown/ltec_pdf_010.pdf
- DC/DC converter circuit board from Toyota Industries, circuit analysis, 130 pages
  Size reduced 50%, weight by 40% from previous generation. Includes analysis for structure of 3 internal circuit boards, circuits, noise, heat dissipation.
  https://www.marklines.com/statics/teardown/ltec_pdf_011.pdf
- Battery monitoring IC from Denso, circuit analysis, 230 pages
  Of the 3 chips in the package, analysis focuses on the ADC cell balance function, bandgap circuits.
  https://www.marklines.com/statics/teardown/ltec_pdf_012.pdf
- Battery monitoring IC from Denso, structure analysis, 64 pages
  Of the 3 chips in the package, analysis focuses on aspects like area and element cross sections of lower layer chips with functions including ADC cell balance.
  https://www.marklines.com/statics/teardown/ltec_pdf_013.pdf
Battery monitoring unit circuit board for BMW X5 (maker unknown), circuit analysis, 44 pages
Internal circuit board of unit that monitors voltage of 16 cells and regulates cell balance.
https://www.marklines.com/statics/teardown/ltec_pdf_001.pdf
Battery monitoring IC from Denso, circuit analysis, 215 pages
Monitors voltage of 7 cells and regulates cell balance. Employs comparator that doesn't use ADC for voltage measurement.
https://www.marklines.com/statics/teardown/ltec_pdf_002.pdf
Battery monitoring LSI from Linear Technologies, structure analysis, 40 pages
Linear Technologies' general purpose monitoring LSI. The price was reduced 25% from the previous generation and functionality improved.
https://www.marklines.com/statics/teardown/ltec_pdf_005.pdf
DC/DC converter for Nissan X-Trail hybrid, thermal analysis, 44 pages
Heat transfer analysis model for heat generation and emission (use thermal equivalent circuits to measure from power loss).
https://www.marklines.com/statics/teardown/ltec_pdf_006.pdf
DC/DC converter for Nissan X-Trail hybrid, thermal analysis, 113 pages
Report covers areas including circuit board layout, component size, component level circuits, integrated circuit board transistors, and more.
https://www.marklines.com/statics/teardown/ltec_pdf_007.pdf
Power semiconductor from Panasonic, structural analysis, 90 pages
Observation of Gallium material semiconductor (all-purpose power type) cross-section with SEM and TEM, membrane excluded structure and material analysis, etc.
https://www.marklines.com/statics/teardown/ltec_pdf_008.pdf
ADAS component for Nissan Serena ProPILOT, circuit board circuit analysis, 2 reports (91 and 30 pages, respectively)
Layout of each layer in the ECU that regulates the camera and ADAS, circuit diagrams, cross-section diagram, component chart, etc.
https://www.marklines.com/statics/teardown/ltec_pdf_014.pdf

LTEC's analysis track record => Around 400 components analyzed yearly!

2016 results

Electric regulation devices for powertrains
E.g.: All kinds of ECUs, controllers for EVs and HVs, idling stop devices, batteries, a variety of internal elements
Systems and devices for driving safety
E.g.: Steering, lighting, ad airbag systems, devices for ADAS
Devices for vehicle bodies
E.g.: Meters, displays such as navigation systems, heater units, power windows, audio tuners

Analysis report – battery cell supervisory unit circuit board

	Product overview Use: In-vehicle Cell Monitoring Unit Size: 116 mm x 75 mm No. of lamination layers: 4 No. of components: 445 No. of terminals: 1,174
	Installed components (BOM) Components are separated from the circuit board and analyzed to determine their type and constant elements. It is also possible to make orders for component charts only for the purpose of cost analysis.
	Circuit board layer removal observation X-ray images (image above) indicate that there are 4 laminated layers and wiring is done via through holes. Based on this information, wiring information can be extracted by excluding membranes on each layer.
	Layout wiring The image above shows a photo of the wiring on a particular layer. Everything down to spots can be identified clearly. Wiring data was automatically extracted from this photo as can be seen in the image below, and a pattern can be established with pictures that do not have fluctuation. This is highly reliable information as no human processing was carried out.
	Circuit diagrams Flat circuit diagrams are created from the extracted wiring information, and along with providing a clear view of components like the power nodes and main routing, information is arranged functionally so that operations are easy to understand. Library data for the output based on the PDF circuit diagram and EDIF are available. Separate from this, data can also be delivered in CAD format (option).
	Cross probing tool A cross probing tool allows component and wiring layouts to be highlighted on the circuit diagram.
	Optional analysis The analyses mentioned until here show the detailed characteristics of the product. If means including transistor multiplier measurement, provision of layout data, structural analysis (cross-section, composition, etc.), thermal analysis, and noise analysis were used, provision of data attained from these measures is also possible (optional). Cross-section structural analysis Thermal analysis Noise analysis