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Soitec, France and PSMC, Taiwan partner on ultra-thin TLT technology for nm-scale 3D stacking
On June 3, Soitec announced a collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at the wafer level. This marks the first....
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