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CTi Cable, Taiwan to invest in the Czech Republic for cables and assembly parts
On January 30, CzechInvest announced that Ching Tai Electric Wire & Cable (CTi Cable) is planning to invest in the Czech Republic. It will invest USD 4 to 5 million. It will create more than 50 new jobs. It will establish highly automated production of key components such as cables and assembly parts for the AI, auto
Nissan, SK On sign battery supply deal for U.S. production in 2028
On January 24, SK On signed a deal to supply batteries to Nissan Motor Company’s vehicle assembly plants in the U.S., according to local industry reports.
The deal, estimated to be worth USD 1.8 billion, is for 20 GWh of batteries, enough to power 300,000 battery electric vehicles, to be delivered beginning in 2028.
ProLogium, Taiwan secures environmental, and construction permits for battery gigafactory in France
On January 23, ProLogium Technologies announced that its Gigafactory in Dunkirk, France, obtained a construction permit on December 16, 2024, and an environmental permit on December 18, 2024.
Since announcing its site selection in May 2023, the company has completed 13 public hearings in the first phase within six mo
IEAT: Taiwanese firms encouraged to make new investments in Thailand’s industrial estates
Announced on January 13, 2025, the “Taiwan-Thailand Economics and Trade Exchange Forum” was held in Tainan, Taiwan from January 9 -10. The target was to attract new investments, which would boost FDI in Thailand. The number of participants on both days was over 200.
At the event, the Industrial Estate Authority of Th

MediaTek, Taiwan and Audio Foundry, UK collaborate on automotive audio technology
On January 14, MediaTek joined Audio Foundry as part of the company’s forward-thinking and innovation-centric approach. As a new member, MediaTek will explore avenues in the automotive audio realm and bring its expertise in developing innovative systems-on-chip (SoC).
The Audio Foundry is a technology collaborative,
Alps Alpine completes transfer of power inductor business
Alps Alpine Co., Ltd. (Alps Alpine) announced that it has completed the transfer of its power inductor business to Delta Electronics, Inc. of Taiwan, as of January 6, 2025. Alps Alpine concluded an absorption-type company split agreement for the business in September 2024. (From a press release dated January 6, 2025)
TSMC now producing 4-nanometer semiconductor chips in Arizona
On January 10, U.S. Commerce Secretary Gina Raimondo announced that Taiwan Semiconductor Manufacturing Co. (TSMC) has begun producing advanced four-nanometer chips for U.S. customers at its Fab 21, in Phoenix, Arizona, representing a milestone in the Biden administration's semiconductor efforts.
In November, the Comm
CES 2025: Himax, Taiwan and AUO present AmLED integrated automotive display platform
On January 8, Himax Technologies, Inc. and AUO Corporation announced a collaboration to showcase AUO’s AmLED integrated automotive display platform, featuring Himax’s advanced automotive IC solutions at CES 2025.
One demo features a 16-inch AmLED display that incorporates Himax’s local dimming Tcon with bridge featur
CES 2025: AUO, Taiwan to provide Micro LED Media Bar solution for Sony Honda Mobility’s AFEELA
On January 9, AUO announced that it is collaborating with Sony Honda Mobility to showcase the world’s first Micro LED Media Bar Solution mounted on the exterior of the AFEELA at CES 2025.
The new solution brings groundbreaking applications to human-machine engagement, and connects the cockpit to the world outside th

CES 2025: ProLogium, Taiwan presents fourth-generation lithium-ceramic battery
On January 7, ProLogium Technologies announced the debut of its fourth-generation lithium-ceramic battery (LCB) system at CES 2025. It features a fully inorganic electrolyte that eliminates all organic materials and increases the inorganic content from 90% to 100%.
It enhances energy density, charging speed, low-temp
CES 2025: Himax, Taiwan to present automotive OLED and LCD technologies
On December 26, Himax Technologies, Inc. announced that it will showcase the industry’s most comprehensive automotive display solutions, featuring image processing and touch IC functionalities for LCD and OLED technologies at CES 2025.
The HX8530 series automotive OLED on-cell touch IC features a proprietary design
CES 2025: Primax Group to unveil audio-vision-HMI solutions for next generation vehicles
On January 6, Primax Group announced that it would present its innovative solutions at CES 2025, through Audio Foundry, an automotive audio technology collaboration launched by Tymphany.
The group will present its next-generation, integrated audio-vision-HMI solutions, highlighting its X-IN-1 Sensory Fusion technolog
CES 2025: AUO, Taiwan to present Micro LED display HMI solutions with BHTC
On January 3, AUO announced that it will debut Smart Cockpit at CES 2025 with its subsidiary BHTC. The new Smart Cockpit 2025 incorporates an array of automotive Micro LED Display HMI solutions that extend across the sunroof, side windows, center console, and steering wheel.
It integrates seamless tiled Micro LED tra

ENEOS, Japan partners with XING Mobility, Taiwan to develop immersion cooling battery systems
On December 23, ENEOS Corporation announced that it has signed a memorandum of understanding (MoU) with XING Mobility Inc., for a strategic partnership aimed at the joint business development of immersion cooling battery systems.
ENEOS has launched advanced immersion cooling fluids to improve thermal management in d
Taiwan-based PCB manufacturer Compeq officially opens plant in Thailand
Reported on December 17, 2024, Compeq, the world's 5th largest printed circuit board (PCB) manufacturer from Taiwan, held an opening ceremony for its factory in Thailand on December 16.
According to the Thailand Board of Investment (BOI), with an investment of around THB 10.4 billion, this plant is set to become Co
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Inventec and NXP build new lab in Taoyuan, Taiwan for developing UWB solutions
Inventec Corporation (Inventec) and NXP Semiconductors N.V. (NXP) announced a new laboratory at the Inventec's facility in Taoyuan, Taiwan.
The new lab will design and develop Ultra-Wideband (UWB) based systems for the automotive industry by leveraging NXP’s solutions including the NXP Trimension UWB portfolio. It wi

Wistron and NXP establish joint lab to develop E/E architectures for SDVs
Wistron announced the establishment of a joint laboratory with NXP Semiconductors N.V. (NXP) to develop next-generation electrical and electronic (E/E) architectures for software-defined vehicles (SDV).
The joint lab integrates NXP's automotive networking solutions including the S32J, S32G vehicle network processors

Telechips to use ROHM PMICs in next-generation cockpit processors
On December 12, ROHM announced that its PMICs will be used in power reference designs for Telechips' next-generation cockpit SoCs, 'Dolphin3' and 'Dolphin5'. The designs, meant for European automakers, are set for mass production in 2025.
The Dolphin3 processor uses the BD96801Qxx-C main PMIC for SoCs. While the Dolp