On September 19, Nexperia launched its new AEC-Q101 qualified 100 V MOSFETs, in compact CCPAK1212 (12 x 12 mm) copper-clip packaging. These devices deliver ultra-low conduction losses with on-resistance (RDS(on)) as low as 0.99 mΩ, and enable safe current above 460 A.
This makes them ideally suited for thermally dem
On September 18, Wayve signed a letter of intent with NVIDIA to evaluate a USD 500 million strategic investment in Wayve’s next funding round. This investment builds on NVIDIA’s participation in Wayve’s Series C funding round. Wayve’s foundation model approach, combined with NVIDIA’s automotive-grade accelerated comp
On September 18, NVIDIA and Intel Corp. announced a collaboration to jointly develop multiple generations of custom data center and PC products that accelerate applications and workloads across hyperscale, enterprise and consumer markets.
With NVIDIA agreeing to invest USD 5 billion in Intel’s common stock, the two c
On September 17, STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology
Hella GmbH & Co. KGaA (FORVIA HELLA) has begun the world’s first series production of its intelligent Power Distribution Module (iPDM) for a premium car manufacturer.
The iPDM ensures reliable and fail-operational power supply in vehicles by using built-in electronic fuses (eFuses) and the corresponding software. Thi
On September 16, Infineon Technologies AG expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water
On September 15, STRADVISION concluded its IAA Mobility 2025 participation with breakthrough live demonstrations and high-impact partner engagements. At IAA, STRADVISION's live demo running SVNet on advanced SoCs drew strong attention for record-fast integration timelines and consistent, real-world reliability. Atten
On September 8, Autolink announced that it made its European debut at IAA Mobility 2025, showcasing its comprehensive product offerings, including intelligent cockpit domain controllers, converged domain controllers, and in-vehicle intelligent display systems.
Its A1 cockpit and driver fusion domain controller (based
On September 11, Axera, a leading Chinese AI chip developer, made its debut at IAA Mobility, globally launching an ADAS solution based on its M57 SoC. This solution was developed by Axera in collaboration with STRADVISION.
Utilizing the M57 SoC as the main processor, the demo is equipped with an 8-megapixel high-defi
On September 10, 2025, MIC Electronics Limited signed a memorandum of understanding (MoU) with Top2 PTE Limited, a Singapore-based company. The purpose of this agreement is for MIC Electronics, with assistance from Top2, to explore, identify, and finalize a semiconductor fabrication partner from Taiwan. The objective
On September 10, Wolfspeed, Inc., a leader in silicon carbide (SiC) technology, announced the commercial launch of its 200mm SiC materials products.
After initially offering 200mm SiC to select customers, the positive response and benefits warranted a commercial release to the market. Wolfspeed is also offering 200m
On September 5, Rightware announced that Kanzi Micro achieved technical certification through Infineon Technologies’ HMI Tool Certification Program. It confirms Kanzi Micro’s seamless integration with Infineon’s TRAVEO T2G series microcontrollers, enabling high-performance, memory-efficient HMI solutions for automoti
On September 6, CEO Elon Musk confirmed that Tesla had just completed a design review for AI5, which will initially be manufactured by TSMC in Taiwan before production ramps in Arizona.
“Just had a great design review today with the Tesla AI5 chip design team! This is going to be an epic chip. And AI6 to follow has
On September 10, Volkswagen Group announced its new “New Level Procurement Model” with Rivian Automotive and Volkswagen Group Technologies at the 4th Semiconductor Summit during IAA Mobility 2025. The model covers over 50 semiconductor categories, including microcontrollers, power transistors, and circuit boards that
On September 9, Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products in response to strong market demand from global OEMs.
Samsung Foundry will fabricate Va
On September 9, MediaTek presented powerful platforms filled with AI, connectivity, and vision technologies at the IAA Mobility 2025. MediaTek presented Generative and agentic AI that can run securely and seamlessly on the Dimensity Auto platform. It perfectly complements the seamless interactions and multi-screen ve
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