On September 17, Elmos Semiconductor SE announced that it can access significantly increased capacity through the extension of its supply agreement for the Dortmund wafer manufacturing facility (“Fab”) until 2028, thus securing additional wafer capacity in the current allocation environment.
Elmos is increasing its
ROHM Co., Ltd. announced on September 17 that its silicon carbide (SiC) power devices have been adopted for the electric powertrain of BMW’s next-generation electric vehicle (EV) platform, Neue Klasse. ROHM’s SiC MOSFETs are integrated into BMW’s Gen 6 electric vehicles and support improved efficiency, performance, a
On September 16, Scottsdale, Arizona-based onsemi unveiled the Embedded Power Platform (EPP), an innovative architecture that uses the silicon wafer itself as the foundation of the package, introducing a highly integrated approach to power system design.
In using the silicon wafer itself as the package, EPP enables
On September 16, onsemi announced a strategic technology engagement with Subaru Corp.to evaluate its Embedded Power Platform (EPP). The engagement will give Subaru early access to EPP technology and engineering expertise as the OEM develops power architectures for future electrified vehicles.
The engagement enables S
On September 16, Infineon Technologies AG entered into a definitive agreement under which Winbond Electronics Corporation will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at USD 1.12 billion on a cash- and debt-free basis. The business comprises a portfolio of NOR Flash memory as
Axera Semiconductor Co., Ltd. (Axera) announced that its SoC M57 powers Aptiv PLC’s new-generation integrated front-view ADAS solution.
The unit has entered mass production and started deliveries for EU-market models from a leading Chinese new-energy vehicle (NEV) manufacturer. It was developed by Aptiv’s teams in Ch
Vector Informatik GmbH (Vector) has launched Chiisai, a fully open and royalty-free specification that simplifies the development of hardware abstraction layers (HALs) for small microcontrollers commonly used in sensors, actuators, and other compact embedded systems.
The Chiisai specification defines standardized int
On September 9, SK keyfoundry announced that it has recently signed an agreement with Elmos Semiconductor SE to expand its collaboration on 130nm technology and secure a long-term wafer supply contract. Under the new agreement based on the 130nm platform, SK keyfoundry will provide Elmos with stable wafer production
On September 8, Arbe Robotics and Hirain Technologies announced that one of the world's largest automotive groups has selected Hirain's imaging radar, powered by Arbe's ultra-high-resolution radar chipset, for a Level 3 automated driving passenger vehicle program in China, across multiple brands under the group.
Hira
On September 8, Infineon Technologies introduced the OPTIREG PMIC TLE9744QK, a fully integrated Power Management IC (PMIC) specifically designed for high-voltage traction inverter applications in electric and hybrid vehicles. It consolidates complete power-supply functions, resolver excitation, and a dedicated safety
According to the China Automotive Chip Industry Innovation Strategic Alliance, the 2026 China Automotive Semiconductor Supply Manual and the 2026 Robotics Semiconductor Supply Manual were officially released at the 2026 Automotive Chip Industry Innovation Ecosystem Conference.
The 2026 China Automotive Semiconductor
BYD Semiconductor Co., Ltd (BYD Semiconductor) announced the launch of its in-house-developed automotive-grade 8T8R 4D millimeter-wave radar chip designed for a satellite architecture. The chip has entered mass production and has completed integration and tuning with BYD’s Xuanji A3 intelligent driving chip.
Built on
On August 25, Canatu Plc announced a new strategy designed to transform its established innovation leadership in carbon nanotube (CNT) technology into a scalable, high-margin growth business. It will strengthen the Semiconductor business as its primary growth engine.
It will build Robotics, Mobility and Defence into
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