On June 10, NOVOSENSE Microelectronics announced that it had presented IC products for traction inverters, OBCs and DC-DC converters at PCIM Europe 2026 in Nuremberg, Germany. It has presented NSI6911F, an ASIL D isolated gate driver designed for SiC and IGBT power stages, featuring high CMTI, 19 A peak drive capabil
On June 9, Skyworks Solutions, Inc. unveiled its new Si829x isolated safety gate driver for electric vehicle (EV) traction inverters at PCIM 2026. Developed according to ISO 26262 functional safety standards, the Si829x is suitable for use in functional safety systems rated up to ASIL D, delivering the robustness req
On June 9, Nexperia announced the release of 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging. These devices enable the electrical performance of Nexperia’s SiC technology with simplified thermal management and mechanical integration, enabling higher output power, increased efficiency, and improved thermal per
On June 10, Bosch introduced its latest third-generation Silicon Carbide (SiC) semiconductors in India. Bosch’s Gen 3 SiC technology enables more compact and efficient power electronics designs by reducing energy losses, improving thermal performance, and lowering system complexity and cooling requirements.
It deliv
NXP Semiconductors N.V. (NXP) has unveiled the SAF8444, a new radar system-on-chip (SoC) that enables advanced L2 and L2+ ADAS functions across a wide range of vehicles, including economy class and entry-level models.
The chip helps reduce power consumption and overall system costs by simplifying thermal management a
On June 4, Mitsubishi Electric announced that it has developed new SiC-MOSFET chips designed for use in inverters for drive motors and eAxles of electric vehicles (EVs), plug-in hybrid vehicles (PHVs), and other electrified vehicles (collectively referred to as xEVs).
The chips are 5th-generation SiC-MOSFETs featurin
On June 7, NVIDIA and SK Hynix, a part of the SK Group, announced a multiyear partnership for next-gen memory aligned to NVIDIA’s AI infrastructure roadmap. The agreement supports advanced memory, extended development cycles, advanced fabrication and capital investments for the global buildout of AI factories
SK hyni
On June 4, Cambridge GaN Devices (CGD) announced that it has developed a 650V GaN IC for automotive applications. ICeGaN helps designers realise smaller, lighter inverters that help extend EV range. The ICeGaN interface balances the operation of multiple devices without the need to select devices with similar perform
On June 3, automotive OEMs and other industry groups have sent a letter to the U.S. Treasury and Commerce departments warning that the increase in artificial intelligence data centers can result in "an urgent imbalance in the market for memory chips could lead to significant and sustained near-term price increases fo
On June 3, Infineon Technologies introduced its new EiceDRIVER 1EDI3040AS and 1EDI3041AS reinforced isolated gate-driver ICs for battery electric vehicle (BEV) traction inverters.
The new EiceDRIVER family enhances power-stage performance while integrating multiple functions into a single IC, helping OEMs and Tier-1
On May 28, BYD held its Intelligence Strategy Launch Event, unveiling a range of intelligent technologies including the XUANJI A3, China’s first 4nm automotive Driving SoC, an upgraded version of the God's Eye, BYD Intelligent Driving System, and the super intelligent agent named “DiDi Xia”.
At the event, BYD also an
On June 2, Infineon Technologies AG presented silicon carbide (SiC) bidirectional switches (BDS) built on rugged 750 V CoolSiC G2 technology. The 750V CoolSiC BDS delivers the reliability margin that modern grids and energy systems demand, resulting in the lowest Total Cost of Ownership.
The 750 V CoolSiC BDS offers
On June 1, Point One Navigation announced that it is presenting a joint precise positioning solution at AutoSens 2026 in Detroit with STMicroelectronics (ST). Point One Navigation’s software platform integrates seamlessly with ST’s new Teseo6 family of GNSS receiver chipsets and module solutions to deliver a complete
Announced on May 29, 2026, the Department of Trade and Industry highlighted MinebeaMitsumi Inc.’s Philippine operations, which support global semiconductor and electronics supply chains, including components used in vehicles.
The firm has cumulative investments of approximately PHP 53 billion in the Philippines as of
On May 29, Infineon Technologies AG announced a new 1300 V silicon carbide (SiC) power module within its HybridPACK Drive family for electric vehicle inverters.
The company stated that the new module can operate continuously at temperatures of up to 205 °C, higher than the 175 °C limit of current designs, helping au
On May 22, China’s National Development and Reform Commission (NDRC) held a press conference for May, addressing questions on issues including the “AI+” initiative and high-quality development in the Embodied AI sector.
At the press conference, it was noted that both core technologies and application demand in China’
On May 27, Polar Semiconductor, LLC and Nexperia B.V. announced a partnership to manufacture next-generation power MOSFET devices at Polar Semiconductor’s US-based wafer foundry. The partnership will combine Polar’s expertise in power semiconductor manufacturing and ongoing capacity expansion with Nexperia’s power MO
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