On July 16, Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering, released as the MJPE-series, addresses the ongoing industry demand for more power-efficient and cost-effective designs i

On July 17, onsemi announced plans to invest USD 8 million at Stony Brook University in New York to establish a wide band gap research center that will advance innovation in power semiconductors and foster the next generation of skilled professionals in this field. 
The center aims to advance foundational research in

On July 3, multiple sources reported that Taiwan Semiconductor Manufacturing Co (TSMC) will gradually shut down its gallium nitride (GaN) compound semiconductor business within two years. TSMC is cooperating with its customers to ensure a smooth transition. The decision was made after reviewing market conditions and

On July 7, VisIC Technologies announced that it had proactively addressed recent changes in the GaN supply landscape following TSMC’s notification of a last-time buy for its GaN product line. VisIC’s new foundry partners have already begun production ramp-up, with the first products available for customer evaluation

On July 17, Tata Electronics and Robert Bosch GmbH signed a memorandum of understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test u

Horizon Robotics successfully brought up the Journey 6B chip, a next-generation intelligent in-vehicle computing solution for entry-level active safety.
The Journey 6B, with an AI computing power of 18 TOPS, efficiently supports mainstream algorithms such as Transformer to perform full-stack computing tasks with more

On July 11, IC’Alps joined GlobalFoundries’ (GF) GlobalSolutions ecosystem. This collaboration aims to streamline ASIC development and accelerate time-to-market for advanced semiconductor solutions. It will benefit customers targeting GF’s CMOS technologies by providing optimized design and manufacturing support.
By

On July 10, STMicroelectronics (ST) and Metalenz announced a new license agreement. The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s technology and manufacturing platform, combining 300mm semiconductor and optics production, test, and qualification

Reported on July 8, 2025, beginning August 1, the U.S. will impose a 25% tariff on Malaysian-made goods as part of a broader policy targeting countries with trade imbalances. This follows an Executive Order signed by President Trump on July 7, which postpones the expiration of certain tariff rates from July 9 to Augu

On July 3, Calterah Semiconductor announced a new office in Munich to enhance on-site engineering support and address the needs of European OEMs and Tier-1 suppliers in the automotive sector. Calterah has already cooperated with several European Tier-1 players, with radar chips supplied for different vehicle models.

On July 2, the Minister of Enterprise and Made in Italy met with the Malaysian Minister of Investment, Trade and Industry. They discussed opportunities for collaboration in the rare earth sector. They also shared their interest in strengthening cooperation in the field of applied research in semiconductor design, rec

On July 2, Infineon Technologies AG announced that its scalable GaN manufacturing on 300-millimeter wafers is on track, with first samples available for customers as of the fourth quarter of 2025. The fully scaled-up 300-millimeter GaN manufacturing will allow it to deliver the highest value to customers while moving

NXP Semiconductors N.V. (NXP) introduced its new 18-channel BMx7318/7518 Li-ion battery cell controller integrated circuit (IC) family, designed to enhance performance and safety in EVs, energy storage systems, and 48V battery management systems.
Built on NXP's new architecture with dedicated analog-to-digital conver

On July 2, Nota AI announced a collaboration with Renesas Electronics Corporation to deliver an optimized driver monitoring system (DMS) on Renesas' RA8P1 MCU (Microcontroller Unit). Powered by NetsPresso, Nota AI's proprietary AI model optimization platform, the company delivers lightweight, deployment-ready models

On June 30, Infineon Technologies AG completed the sale of its 200 mm fab in Austin, Texas. As announced in February 2025, SkyWater Technology will assume operations with current employees and further develop the site to support multiple customers. 
As such, SkyWater and Infineon have also entered into a long-term su

On June 23, STMicroelectronics announced the expansion of ISO 26262-compliant automotive family L9800 with an 8-channel low-side driver in a space-saving leadless package. It saves space in body-control modules, HVAC and climate controls, and power-domain controls. 
The L9800 outputs can drive resistive, capacitive,

On June 26, KD, a Spanish semiconductor company, partnered with with Leopard Imaging, a leader in high-definition embedded cameras, and Corning Incorporated, a leading innovator in materials science, for IEEE 802.3cz-compliant Multigigabit Vision System Solution.
KD integrated its 10GBASE-AU KD7251 optical transceive

Beijing SemiDrive Technology Co., Ltd. (SemiDrive) developed the REF68003 reference design for intelligent cockpits with Rohm Co., Ltd. (Rohm).
REF68003 is mainly developed for X9SP, a SemiDrive intelligent cockpit SoC (system-on-a-chip) that uses Rohm PMICs (power management integrated circuits) and was exhibited at