On April 28, Sondrel announced its new name, “Aion Silicon”. Aion Silicon is a trusted partner in high-performance semiconductor design for advanced System-on-Chip (SoC) solutions and tailored ASICs for AI, automotive, 5G, networking, and other applications.
Based on Aion Silicon social media updates 

On April 29, BASF announced that it will expand its production capacity for semiconductor-grade sulfuric acid (H2SO4) at its Ludwigshafen site in Germany. It will start operations in 2027. The BASF investment will be in a high double-digit million-euro range.
A close cooperation partner of BASF is currently building

On April 28, Cambridge GaN Devices (CGD) announced that it will present its ICeGaN technology at PCIM 2025. It will display world-first Combo ICeGaN innovation, which pairs the company’s ICeGaN GaN ICs with IGBTs to address electric vehicle inverters at 100kW+, improving efficiency over traditional silicon solutions

On April 22, Valens Semiconductor announced its partnership with ESWIN Computing, China to bring MIPI A-PHY solutions to the Chinese market. The collaboration offers Chinese automakers access to locally made, production-ready MIPI A-PHY chipsets for sensor and display connectivity. The companies will showcase their s

On April 25, Invest Estonia announced that Estonia will launch a new chip center.
The EUR 2.4 million initiative, jointly funded by the EU’s Digital Europe program and Estonia’s Ministry of Economic Affairs, brings together AS Metrosert, Enterprise Estonia, and the Estonian Electronics Industry Association in a strat

On April 24, Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cad

NOVOSENSE Microelectronics, and Continental's Automotive business sector expanded their strategic cooperation to work together in system basis chips (SBCs) and low-side switches to further improve safety and efficiency in modern vehicle systems.
NOVOSENSE and Continental will also partner to develop and integrate SBC

On April 23, Infineon Technologies AG (Infineon) announced that it will present its latest semiconductor, software, and tooling solutions at PCIM Europe 2025 (5/6-8 Nuremberg).
Its solutions accelerate the transition to e-mobility by enabling efficient traction inverters, onboard chargers, DC-DC converters, and batte

On April 16, STMicroelectronics announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, simplifying software-defined vehicle (SDV) development and electrification platforms. It will be first available on the Stellar P6 MCUs, which target t

On April 15, STMicroelectronics N.V. (ST) announced that it will exhibit at electronica China 2025 on April 15-17, 2025. It will present a wide array of innovative solutions for automotive and industrial applications. 
ST will present the recently announced Teseo VI automotive-grade GNSS chip, supporting advanced cap

On April 16, Infineon Technologies AG introduced EDT3 (Electric Drive Train, third generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. The new generation EDT3 achieves up to 20% lower total losses at high loads while maintaining efficiency at low lo

Canatu Plc signed a one-year joint development agreement (JDA) with DENSO Corporation to improve the performance of Canatu carbon nanotubes (Canatu CNTs). DENSO is one of Canatu’s largest shareholders.
This JDA builds on the MoU signed by Canatu and DENSO last year for enhancing CNT performance, developing advanced r

On April 14, NVIDIA announced that its Blackwell chips have begun production at a factory operated in partnership with TSMC in Phoenix, Arizona, while it also continues to work on the construction of two future factories to be operated in Texas, in partnership with Foxconn in Houston and Wistron in Dallas. Mass produ

On April 11, Weebit Nano Limited completed AEC-Q100 150°C operation qualification of its Resistive Random-Access Memory (ReRAM) module in semiconductor manufacturer SkyWater Technology’s 130nm CMOS process.
This achievement confirms the quality and reliability of Weebit’s embedded ReRAM non-volatile memory (NVM) tech

On March 11, NXP Semiconductors N.V. unveiled its new S32K5 family of automotive microcontrollers (MCU), the automotive industry's first 16nm FinFET MCU with embedded magnetic RAM (MRAM). The S32K5 MCU family will extend the NXP CoreRide platform with pre-integrated zonal and electrification system solutions for scal

On April 9, Nexperia announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimized for protecting and filtering high-speed data communication links, which are increa

Beijing SemiDrive Technology Co., Ltd. (SemiDrive) will deepen technical cooperation with Bosch on automotive semiconductors by comprehensively escalating strategic cooperation on core automotive semiconductor technology.
The following three areas will be covered. IP integration and innovation: Bosch’s latest CAN IP