On April 27, onsemi announced an expanded strategic collaboration with NIO Inc. to advance next-generation electric vehicle (EV) platforms. onsemi is helping NIO accelerate its move to 900V EV platforms with EliteSiC M3e technology. This transition supports NIO’s latest vehicles, including the ES9 flagship SUV and ne
On April 24, Chery Automobile Co., Ltd. and Qualcomm Technologies, Inc. signed an agreement to collaborate across three core areas, smart cockpits, smart driving, and cockpit-driving integration, to support intelligent upgrades across Chery's multi-brand, multi-tier vehicle lineup.
Under the agreement, Chery will ado
Announced on April 20, 2026, Thailand’s Deputy Prime Minister and BOI led talks in the U.S. to attract semiconductor investment, including applications relevant to the automotive sector (especially EVs and automotive electronics), as well as advanced manufacturing systems.
Discussions with U.S. chip and automation fi
Robert Bosch GmbH (Bosch) has presented the third generation of silicon carbide (SiC) chips and is supplying samples to global automakers. The new chips improve EV performance and increase their range potential. They deliver 20% higher performance and are smaller than the previous generation, increasing overall drive
On April 16, FAW Hongqi R&D Institute announced that Hongqi, in collaboration with ZTE, has successfully developed China’s first automotive-grade advanced-process five-domain integrated SoC chip, Hongqi One.
Hongqi One is a multi-domain integrated processor designed for centralized computing architectures in intellig
Samsung Electronics is ramping up its semiconductor operations in Texas, preparing the new Taylor facility to begin production while upgrading the Austin fab.
Samsung Electronics plans a ceremony on April 24 to mark the arrival of key equipment, including EUV lithography tools, at the Taylor fab as it enters its fin
On April 19, the Ministry of Electronics and IT announced that the foundation stone for India's first advanced 3D chip packaging facility was laid at Info Valley, Bhubaneswar. The project is being implemented by 3D Glass Solutions Inc. (USA) through its wholly owned Indian subsidiary Heterogeneous Integration Packagi
On April 15, Silicon Box formally joined imec’s Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Silicon Box will support the ACP’s research initiative with its end-to-end know-how in
On April 12, at the GAC Tech Day 2026 event in Panyu, GAC Group unveiled the latest proprietary technologies spanning powertrains, body structures, intelligent cockpits, electronic/electrical (E/E) architectures, and automotive-grade chip ecosystems.
Launched at this event were a PHEV system and the HEV+ system after
A joint innovation laboratory between Unisoc (Shanghai) Technologies Co., Ltd. (Unisoc) and Geely Auto was inaugurated in Ningbo. According to the two companies, the laboratory, centering on the needs of the automotive industry for transformation towards electrification, intelligentization, and connectivity, will wor
On April 7, Dongfeng Motor Corporation (DFMC) announced that the mass production and in-vehicle application of the proprietary DF30 chip, China’s first high-performance automotive-grade MCU chip, are proceeding steadily. To date, the chip has been validated in vehicle models such as the eπ007 hatchback, the M-Hero M8
On April 7, Intel said it will join Elon Musk's Terafab AI chip project that Elon Musk had previously announced to make processor chips to power autonomy, robotics and data center ambitions.
The announcement comes after Musk announced plans for Tesla to build a massive artificial-intelligence chip fab to power the EV
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