On April 16, STMicroelectronics announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, simplifying software-defined vehicle (SDV) development and electrification platforms. It will be first available on the Stellar P6 MCUs, which target t

On April 15, STMicroelectronics N.V. (ST) announced that it will exhibit at electronica China 2025 on April 15-17, 2025. It will present a wide array of innovative solutions for automotive and industrial applications. 
ST will present the recently announced Teseo VI automotive-grade GNSS chip, supporting advanced cap

On April 16, Infineon Technologies AG introduced EDT3 (Electric Drive Train, third generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. The new generation EDT3 achieves up to 20% lower total losses at high loads while maintaining efficiency at low lo

On April 14, Canatu Plc signed a one-year joint development agreement (JDA) with DENSO Corporation to improve the performance of Canatu carbon nanotubes (Canatu CNTs). DENSO is one of Canatu’s largest shareholders.
This JDA builds on the MoU signed by Canatu and DENSO last year for enhancing CNT performance, developi

On April 14, NVIDIA announced that its Blackwell chips have begun production at a factory operated in partnership with TSMC in Phoenix, Arizona, while it also continues to work on the construction of two future factories to be operated in Texas, in partnership with Foxconn in Houston and Wistron in Dallas. Mass produ

On April 11, Weebit Nano Limited completed AEC-Q100 150°C operation qualification of its Resistive Random-Access Memory (ReRAM) module in semiconductor manufacturer SkyWater Technology’s 130nm CMOS process.
This achievement confirms the quality and reliability of Weebit’s embedded ReRAM non-volatile memory (NVM) tech

On April 11, NXP Semiconductors N.V. unveiled its new S32K5 family of automotive microcontrollers (MCU), the automotive industry's first 16nm FinFET MCU with embedded magnetic RAM (MRAM). The S32K5 MCU family will extend the NXP CoreRide platform with pre-integrated zonal and electrification system solutions for scal

On April 9, Nexperia announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimized for protecting and filtering high-speed data communication links, which are increa

Beijing SemiDrive Technology Co., Ltd. (SemiDrive) will deepen technical cooperation with Bosch on automotive semiconductors by comprehensively escalating strategic cooperation on core automotive semiconductor technology.
The following three areas will be covered. IP integration and innovation: Bosch’s latest CAN IP

On April 10, STMicroelectronics N.V. (ST) presented further updates to its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024.
The reshaping and modernization of ST’s manufacturing operations aim to achieve two main objectives: prioritizing planned inves

On April 10, IQE plc, and X-FAB Silicon Foundries SE, announced a Joint Development Agreement (JDA) to create a European-based GaN Power device platform solution. With an initial two-year scope of work, IQE and X-FAB will collaborate to develop a 650V GaN device. 
The agreement will leverage IQE’s GaN epitaxy design

On April 11, Bosch and Arrow Electronics signed a distribution contract. Arrow now distributes a wide range of Bosch automotive semiconductors on the European market. The two companies already cooperated in North America before.
Arrow Electronics will now also represent Bosch's entire automotive semiconductor portfol

On April 7, Infineon Technologies AG announced the acquisition of Marvell Technology’s Automotive Ethernet business for a purchase price of USD 2.5 billion in cash. The transaction is subject to regulatory approvals. 
The planned investment will strengthen Infineon’s already strong footprint in the U.S. Marvell’s lea

On March 26, Canatu Plc received a positive funding decision from Business Finland, granting it a maximum of EUR 10 million of funding to launch its Carbon Age program. The program aims to drive the development of semiconductor technologies enabled by carbon nanotubes (CNTs) and build a dedicated industry ecosystem.

On April 2, Valens Semiconductor announced that Valens’ VA7000 MIPI A-PHY-compliant chipsets would form the in-car, sensor to compute connectivity infrastructure for Mobileye EyeQ6 High automated and autonomous production programs underway with a group of global automotive brands. 
Mobileye selected the VA7000 for th

On March 27, Black Semiconductor announced the acquisition of Applied Nanolayers (ANL), a strategic move to significantly accelerate the development of its Integrated Graphene Photonics (IGP) technology. The acquisition is expected to speed up Black Semiconductor’s technology development by two years. The acquisition