On February 26, Arbe Robotics Ltd. announced that it is increasing its focus on the Chinese automotive market, where it has demonstrated traction and where it believes market timing is more immediate. These initiatives are expected to begin contributing to revenue in 2026, alongside its ongoing long-term initiatives
NXP Semiconductors N.V. (NXP) announced the release of the industry-first production released 10BASE T1S Physical Medium Dependent (PMD) transceivers, the TJA1410, designed for automotive use.
The new transceivers enable automakers to extend low cost, multi drop Single Pair Ethernet (SPE) connectivity to the network
On February 25, KD, a Spanish optical networking technology supplier, announced a distribution agreement with Hitachi High-Tech Corporation.
Under the agreement, Hitachi High-Tech Corporation will support market expansion and customer engagement in Japan for KD’s optoelectronic devices. The partnership will help auto
On February 24, Infineon Technologies AG announced that it will present microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026. Infineon will demonstrate its comprehensive MCU portfolio through live demos.
For mobility, it will present demos targeting software-de
On February 18, MCNEX and Valens Semiconductor announced the joint development and availability of a new family of high resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels.
It is powered by Valens’ VA7000 A PHY chipsets. The came
On February 18, fabless semiconductor startup Vervesemi Microelectronics raised USD 10 million in a Series A round led by Ashish Kacholia and Unicorn India Ventures, with participation from Roots Ventures, Caperize Fina, MAIQ Growth Scheme, and several HNIs.
The funds will be used to commercialise its machine‑learni
GlobalFoundries (GF) and Renesas Electronics Corporation announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas' access to GF technologies including its differentiated technology platforms. This agreement reflects a shared commitment to secure, res
On February 16, Infineon Technologies AG announced its role in supporting the software-defined vehicle architecture of BMW’s Neue Klasse platform. The company will also showcase the BMW iX3, the first Neue Klasse model, at its Annual General Meeting.
The Neue Klasse platform features a scalable electronic architectur
On February 12, TTTech Auto announced that it is joining CHASSIS, a three-year CHIPS JU initiative, bringing together 18 leading organizations across Europe. TTTech Auto is dedicated to supporting the development of an open ecosystem that accelerates the adoption and harmonization of secure, scalable chiplet technolo
On February 11, Nexperia B.V. announced that, following the public hearing of January 14, 2026, the Dutch Enterprise Chamber ruled that there are valid reasons to doubt proper management at Nexperia under the company's previous governance and given certain actions taken by Wingtech Technology Co. Ltd. ("Wingtech") si
CATL (Shanghai) Intelligent Technology Co., Ltd. (CATL Intelligent), a subsidiary of Contemporary Amperex Technology Co., Ltd. (CATL), signed a strategic cooperation agreement on New Energy Vehicle (NEV) intelligentization with Beijing Horizon Information Technology Co., Ltd. (Horizon Robotics) to promote the applica
On February 9, the European Union launched its largest Chips Act pilot line, NanoIC, at IMEC Leuven. With a total investment of EUR 2.5 billion, the facility has received EUR 700 million in EU funding, EUR 700 million from national and regional governments, and the remainder from ASML and other industry partners.
Nan
On February 10, STMicroelectronics announced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive edge intelligence. It is designed for future software-defined vehicles. It has an integrated ST Neural-ART Accelerator for real-time AI efficiency. The start of product
On February 6, Axcelis Technologies and Veeco Instruments announced they have both secured stockholder approval for their previously announced merger, aimed at establishing a major entity in the semiconductor equipment industry, valued at approximately USD 4.4 billion.
Initially announced in October 2025, the all-sto
On February 9, Infineon Technologies announced that CoolSiC MOSFETs (silicon carbide (SiC) power MOSFETs) have been adopted in the new bZ4X model from Toyota. Integrated into the on-board charger (OBC) and DC/DC converter, it leverages the material's advantages of low losses, high thermal resistance, and high voltage
Samsung Electronics has secured temporary certificates of occupancy (TCOs) for a portion of its semiconductor fab in Taylor, Texas that should allow the facility to start operations ahead of full completion later in 2026, marking a key step towards production of Tesla’s next-gen AI5 chips in the U.S.
Taylor city offi
On February 5, Infineon Technologies AG introduced the EiceDRIVER 1ED301xMC12I product family, a series of high-performance isolated gate driver ICs with opto-emulator input. The devices are pin-compatible with existing opto-emulators and optocouplers, offering high common-mode transient immunity (CMTI), a robust out
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