On July 17, 2026, SK Siltron, a semiconductor manufacturer, announced plans to close its manufacturing facility in Bay County, Michigan, due to shifting demand in the electric vehicle market. With the closure of the plant, SK Siltron also plans to wind down the operations of its U.S.-based SK Siltron CSS subsidiary.
On July 15, the Union Cabinet of India approved Semicon 2.0 with a budget outlay of INR 1,275 billion. Semicon 2.0 is structured around six areas: design, machines and materials, fabrication plants, ATMP/OSAT units, R&D, and talent development. On design, the government plans to build on work by 105 startups already
On July 16, Boise, Idaho-based Micron Technology announced it has completed strategic customer agreements (SCAs) with key Tier 1 suppliers and ecosystem partners, including Qualcomm, Visteon, HARMAN, JOYNEXT, DENSO, Astemo and Hyundai Mobis.
The SCAs provide Micron, as well as these partners, with greater visibility
On July 15, NextGO Epi secured a EUR 2 million pre-seed funding round. The company has developed a process producing a breakthrough semiconductor material that could reduce EV charging times from 60 to just 10 minutes, while reducing power semiconductor manufacturing costs by up to 75%.
NextGO Epi is the only Europe
On July 12, 2026, a Thailand Board of Investment (BOI) delegation visited Analog Devices (Thailand) Ltd. (ADI)'s new facility at Amata City Industrial Estate in Chonburi to review the progress of the company's investment expansion worth over THB 19 billion and discuss global semiconductor industry trends.
According t
On July 14, the European Commission (EC) approved EUR 659 million in German State aid to support the establishment of four first-of-a-kind facilities in the semiconductor value chain.
SME Element 3-5 GmbH will receive EUR 353 million to establish a first-of-a-kind factory for SiC epi-wafers in Baesweiler, North Rhine
Tesla's AI5 chip has been taped out and is about to enter mass production at Samsung Foundry in Taylor, Texas using the company's 2nm-class process technology, according to a post by a principal engineer at Samsung Foundry.
"The Tesla-Samsung Al5 chip has reached tape-out," James Kim, a principal engineer at Samsung
On July 13, Bosch announced a definitive agreement with the Trump Administration for up to USD 225 million in direct funding through the Department of Commerce’s CHIPS Program Office. The funding will support Bosch’s planned USD 2 billion investment to transform its Roseville, California, facility into a silicon carb
On July 9, Micron Technology announced it is accelerating its planned U.S. fab and technology investments to more than USD 250 billion through 2035, driven by surging demand for memory in the AI era.
Micron anticipates that the increased investments will support its long-term goal of producing 40% of its DRAM in the
On July 7, POLYN Technology announced a partnership with ALTER TECHNOLOGY France to establish a joint chip-validation lab at ALTER’s Toulouse facilities. The Validation Lab will support work across POLYN’s current and future product portfolio, including solutions for voice interfaces, automotive sensing, and various
On July 8, Infineon Technologies AG announced that it will supply CoolSiC MOSFETs 1200 V and matching dual-channel EiceDRIVER 2EDB9259Y gate drivers to ADVANTICS for its new line of liquid-cooled power converters. The solutions enhance efficiency, power density, and reliability in applications such as megawatt chargi
On July 6, South Korean chipmaker SK Hynix announced in an SEC filing it will launch a U.S. listing on the Nasdaq exchange to raise about USD 28 billion as it seeks to capitalize on the current global AI boom.
The company will sell 17.79 million new shares in the depository receipt listing on the Nasdaq. Ten American
On July 6, Ford Motor and Micron Technology signed a long-term agreement to secure the supply for memory and storage platforms used in the automaker's next-generation vehicle production.
The agreement is supported by Micron’s ongoing investments to expand and localize manufacturing for automotive customers, includin
On July 1, the German Federal Government announced the submission of 14 projects to the European Commission for pre-notification under the Important Project of Common European Interest – Advanced Semiconductor Technologies (IPCEI AST). Germany is coordinating this integrated European project together with the Netherl
On June 30, Allegro DVT announced its contribution to the European CHASSIS program’s implementation of the Automotive Base Die chiplet. The Automotive Base Die acts as the central communication and integration hub for automotive System-on-Chip (SoC) infrastructure, which is designed to enable seamless integration of
On July 2, Infineon Technologies AG opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with an investment of EUR 5 billion, is the largest single investment in Infineon's history. It will create 1,000 new jobs. The new fab doubles Infineon's manufacturing capacities at the Dresden
On July 1, Micron Technology and General Motors announced a Strategic Customer Agreement (SCA) to secure a long-term, reliable supply of memory and storage platforms used in GM’s vehicle production and delivery.
As enhanced in-cabin experiences and advanced driver assistance (ADAS) autonomy are driving the importance
On June 25, onsemi and Synaptics Inc. announced they have entered into a definitive agreement under which onsemi will acquire Synaptics in an all-stock transaction, representing a value of approximately USD 7 billion. The transaction closing is expected in mid-2027.
By adding Synaptics’ differentiated Edge AI compute
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