The Trump administration is considering a new round of tariffs on semiconductors despite warnings from tech companies, according to a new media report.
People familiar with the matter said that one approach being discussed could see a large expansion of the products subjected to tariffs, including not just chips, but
Robert Bosch GmbH (Bosch) announced that it is collaborating with MacMic Science & Technology Co., Ltd (MacMic) on silicon carbide (SiC) power modules. Under a “Chip+” model, the two companies are expanding their cooperation beyond chip supply to include product collaboration, quality optimization, and expansion into
On August 21, Taiwanese firm Pegatron Corp. announced it will expand its operations in Chihuahua with a USD 330 million investment to build a new specialized plant in Ciudad Juárez.
The plant, which will focus on components for electromobility and technological infrastructure for data centers, will be developed betw
On August 25, KD announced that it will take part in AutoSens Europe 2026 in Barcelona, Spain, from September 22 - 24, 2026. KD will showcase its 10GBASE-AU automotive optical camera demo, developed together with Leopard Imaging and Corning. The real-world camera implementation integrates the KD7251 optical transceiv
On August 25, Melexis signed a master purchase agreement (MPA) with BYD. It elevates Melexis to a direct supplier within BYD’s global procurement ecosystem, formalizing and deepening a long-standing collaboration to drive the next generation of electric vehicles (EVs). For Melexis, this agreement solidifies Melexis'
On August 21, Porsche announced that it is introducing the world's first production-ready high-end automotive audio system using gallium nitride (GaN) technology. GaN is more efficient and has higher power density than traditional silicon, allowing smaller and lighter electronic systems.
Developed with the University
On August 13, TrustMotion announced the completion of EcoMobility, a European initiative funded under the Chips Joint Undertaking (Chips JU) in collaboration with the Horizon Europe Framework Program. Coordinated by TrustMotion, the project brought together 47 partners from across Europe over 38 months to develop and
On August 12, Valens Semiconductor, in an investor update, announced that it has secured 4 design wins with leading OEMs, making it the first A-PHY silicon provider with multiple design wins. The start of production is expected in 2026/2027. Valens chips will form the connectivity infrastructure for a variety of Mobi
On August 20, Waymo revealed the compute technology that underpins its Driver autonomous platform, noting that it has built a custom chip that will improve robotaxi performance, while also diversifying chip supply beyond third-party companies including Nvidia Corp.
Waymo's 5nm application-specific integrated circuit
On August 18, Sumitomo Bakelite announced that it had developed a 3D SiC-MOSFET power module with a resin-insulated dual-layer structure that achieves both a compact size and high power density through joint research with Tohoku University. By optimizing the thermal expansion characteristics and elastic modulus of th
On August 19, Eatron Technologies announced that the ZENBMS (Zonal-End Node Battery Management System) project has been selected as one of ten automotive projects to receive grant funding through the UK Government’s latest DRIVE35 Demonstrate competition. The 12-month project brings together Eatron, Infineon, and WMG
Announced on August 12, 2026, NXP Semiconductors has broken ground on an expansion of its assembly and test (A&T) facility in Petaling Jaya, Malaysia, adding about 500,000 sq ft of production space and bringing the site's total production area to around 900,000 sq ft.
The company said the highly automated facility is
Beijing Horizon Information Technology Co., Ltd (Horizon Robotics) announced that its ecosystem partner PATEO CONNECT Technology (Shanghai) Corporation (PATEO) has secured a project nomination from a leading Chinese new energy vehicle (NEV) manufacturer and will serve as a supplier for the automaker’s new vehicle pla
On August 4, Ceva, Inc. and Actions Technology Co., Ltd. announced the introduction of the Actions Technology ATS296X-series Bluetooth audio series of chips, powered by the Ceva-Waves Bluetooth High Data Throughput (HDT) platform. The new family represents one of the industry’s earliest commercial implementations of
On August 6, Tesla and SpaceX announced that the Terafab, advanced chip factory they are jointly developing will be built in Grimes County, Texas, outside of Houston, with an initial investment of USD 16.8 billion, and potential future expansion phases bringing total investment much higher. The facility is expected t
On August 6, Infineon Technologies announced a partnership with MediaTek to enable advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash for use in its Dimensity Auto Cockpit Platform C-X1. This turns the Infineon device into an approved and easil
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