On January 16, Ireland’s Investment Promotion & Development Agency (IDA Ireland) announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, has announced a EUR 125 million investment in the Cork site. This flagship project, which is supported by the Irish Government through IDA Ir

On January 15, Stellantis officially joined the Italian Institute for Artificial Intelligence (AI4I) in Turin and the Chips-IT Foundation in Pavia, Italy. AI4I focuses on applying AI to the real economy, while Chips-IT supports research and innovation in semiconductors to strengthen Italy’s and Europe’s technological

On January 13, Arm announced that Lenovo has developed L4 Autonomous Driving Domain Controller AD1, a production-ready autonomous driving computing platform powered by dual Arm-based NVIDIA DRIVE AGX Thor chips. WeRide is deploying the platform in its GXR Robotaxi. 
AD1 is powered by NVIDIA DRIVE AGX Thor, a centrali

On January 12, TASKING, together with Infineon and iSOFT, launched a rapid development bundle for safety-critical automotive control systems based on the AURIX TC4x platform. The solution integrates industry-leading tools, high-performance MCUs, and complete automotive basic software to provide strong foundational su

On January 13, Melexis announced that Leapers Semiconductor is incorporating the Melexis MLX91299 silicon-based RC snubber into its next-generation modules. The MLX91299 is an integrated silicon RC device, combining a resistor and a capacitor on a single bare die. Placed close to the switching components, it suppress

Hella GmbH & Co. KGaA (FORVIA HELLA) has launched its next-generation Intelligent Battery Sensor (IBS) in China, with mass production scheduled to begin by mid-2026. The new IBS will be deployed across a range of pure electric vehicle models developed for the Chinese market by both domestic and joint-venture brands.

On January 13, Wolfspeed announced a major semiconductor milestone with the successful production of a 300mm (12-inch) single-crystal silicon carbide (SiC) wafer, marking a first for the industry. Supported by a large SiC intellectual property portfolio (2,300+ patents), this breakthrough advances manufacturing scala

Hella GmbH & Co. KGaA (FORVIA HELLA) announced, at CES 2026, a collaboration with NXP Semiconductors N.V. (NXP) to develop and industrialize ForWave7HD high-resolution radar sensors, with up to 32 transmission and receive channels each.
Leveraging NXP's third-generation imaging radar chipset, with the S32R47 radar pr

On January 8 in Las Vegas, Hyundai Motor Group's Robotics LAB revealed a pivotal accomplishment in physical artificial intelligence, showcasing the outcomes of its three-year partnership with AI semiconductor specialist DEEPX. 
The chip was unveiled at the Fontainebleau Las Vegas as part of the inaugural CES Foundry,

On January 6, STRADVISION announced that it will present software demos centered around FrontVision and SurroundVision from its SVNet family based on Texas Instruments’ (TI) Gen 5 automotive platform at CES 2026. The video-based demo provides intuitive visualizations of recognition results and is designed to serve as

Ceva, Inc. announced at CES 2026 that NXP Semiconductors N.V. (NXP) has integrated Ceva’s SensPro AI DSP into its S32Z2 and S32E2 processors for the next generation of real-time domain and zonal control modules in software-defined vehicles (SDVs).
The integration enables real-time AI inference, predictive analytics,

On January 8, Volkswagen Group and Qualcomm Technologies announced the signing of a Letter of Intent (LOI) for a long-term supply agreement to deliver advanced infotainment and connectivity capabilities powered by Snapdragon Digital Chassis solutions. 
Qualcomm Technologies will serve as Volkswagen Group’s primary te

On January 8, Infineon Technologies and HL Klemove signed a memorandum of understanding (MoU) to combine Infineon’s semiconductor expertise and system understanding with HL Klemove’s capabilities in advanced autonomous driving systems. They will jointly develop zone controller applications using Infineon’s microcontr

On January 7, Rightware announced support for the new AM62P automotive-grade system-on-chip (SoC) from Texas Instruments (TI) in its digital cluster designs. This is showcased by a demonstration of a high-quality cockpit experience created with Kanzi and running on the cost-effective AM62P SoC. The joint demo will be

On January 5, STRADVISION announced that it will collaborate with Renesas Electronics Corporation to demonstrate its SVNet FrontVision solution running on Renesas’ next-generation automotive SoC platform, the R-Car X5H, at CES 2026.
This demo centers around StradVision's front camera-based perception technology optim

Announced on January 8, 2026, Thailand has unveiled a national strategy to strengthen its semiconductor and advanced electronics industry, emphasizing power semiconductors, sensors, photonics, discrete devices, and analog chips to build a complete value chain.
The plan, endorsed on January 7 by the National Semicondu

On January 6, Valens Semiconductor announced a new design win for its VA7000 MIPI A-PHY-compliant chipsets, which will be integrated into the ADAS systems of a premium global automotive OEM serving the Chinese market.
The announcement brings Valens to four A-PHY design wins globally. The carmaker will integrate the V

On January 5, STRADVISION announced a joint demo with AMD at CES 2026. The demo will showcase its SVNet MultiVision perception software running on the AMD Versal AI Edge Series Gen 2 Adaptive system-on-chip (SoC) platform. It enables automotive OEMs and Tier 1 customers to explore scalable cognitive architectures in

On January 5, Leapmotor and Qualcomm Technologies, Inc. introduced the world’s first cross-domain integrated solution powered by Snapdragon Cockpit Elite and Snapdragon Ride Elite automotive platforms at CES 2026. Entering mass production, Leapmotor’s flagship D19 is the first vehicle globally to launch with this hig