On August 6, Tesla and SpaceX announced that the Terafab, advanced chip factory they are jointly developing will be built in Grimes County, Texas, outside of Houston, with an initial investment of USD 16.8 billion, and potential future expansion phases bringing total investment much higher. The facility is expected t
On August 6, Infineon Technologies announced a partnership with MediaTek to enable advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash for use in its Dimensity Auto Cockpit Platform C-X1. This turns the Infineon device into an approved and easil
Brewer Science completed its acquisition of Heraeus Epurio’s semiconductor chemicals business. The acquisition includes Heraeus Epurio’s production facility in Dayton, Ohio, and related sales and technical support teams in Asia.
The acquisition expands Brewer Science’s capabilities by bringing ultrapure semiconductor
On July 31, JOYNEXT and NEXTCHIP announced a partnership to develop integrated ADAS solutions as well as next-generation Software-Defined Vehicle (SDV) architectures for global vehicle programs. The collaboration focuses on integrating NEXTCHIP's new automotive platform, APACHE6, into JOYNEXT's vehicle platforms. The
On July 29, Infineon Technologies AG presented the SPOC Wire Guard BTS80009 SWPx 1ES, a 12 V automotive eFuse with SPI interface. It combines a protected high-side switch with integrated I²t wire protection, software configurability, and advanced diagnosis. It is designed for new E/E architectures that support softwa
Beijing Horizon Information Technology Co., Ltd (Horizon Robotics) announced that it showcased its Journey series of chips, the Horizon SuperDrive (HSD) full-scenario assisted driving system, the Horizon Starry integrated cockpit-driving chip, and its vehicle intelligence solutions at the 8th China FAW Supply Chain I
According to multiple media reports on July 24, Xinchuang Zhihe (Shanghai) Technology Co., Ltd was registered on July 13, 2026, with a registered capital of CNY 100,000. The company is wholly owned by Shanghai Li Auto Technology Co., Ltd, a wholly owned subsidiary of Beijing Li Auto Co., Ltd.
Its business scope inclu
According to XPeng Inc.(Xpeng) on July 16, the company’s CEO said at Xpeng Brand Day in Munich, Germany, that as the AI era unfolds, XPENG will continue to increase its investment in research and development, bringing Physical AI from technological exploration into real-world applications.
Built on its Physical AI pl
NXP Semiconductors N.V. (NXP) has introduced the SAF9800, a new automotive audio and radio processor for next-generation vehicle infotainment systems.
The processor integrates analog radio (AM and FM) reception and AI/ML-enabled audio processing into a flexible single-chip solution, supporting software-defined archit
On July 16, 2026, the U.S. White House and Department of Commerce announced that Taiwan Semiconductor Manufacturing Co. (TSMC) will invest an additional USD 100 billion to develop new manufacturing facilities in Arizona. The investment is expected to result in four additional advanced semiconductor manufacturing faci
On July 17, 2026, SK Siltron, a semiconductor manufacturer, announced plans to close its manufacturing facility in Bay County, Michigan, due to shifting demand in the electric vehicle market. With the closure of the plant, SK Siltron also plans to wind down the operations of its U.S.-based SK Siltron CSS subsidiary.
On July 15, the Union Cabinet of India approved Semicon 2.0 with a budget outlay of INR 1,275 billion. Semicon 2.0 is structured around six areas: design, machines and materials, fabrication plants, ATMP/OSAT units, R&D, and talent development. On design, the government plans to build on work by 105 startups already
On July 16, Boise, Idaho-based Micron Technology announced it has completed strategic customer agreements (SCAs) with key Tier 1 suppliers and ecosystem partners, including Qualcomm, Visteon, HARMAN, JOYNEXT, DENSO, Astemo and Hyundai Mobis.
The SCAs provide Micron, as well as these partners, with greater visibility
On July 15, NextGO Epi secured a EUR 2 million pre-seed funding round. The company has developed a process producing a breakthrough semiconductor material that could reduce EV charging times from 60 to just 10 minutes, while reducing power semiconductor manufacturing costs by up to 75%.
NextGO Epi is the only Europe
On July 12, 2026, a Thailand Board of Investment (BOI) delegation visited Analog Devices (Thailand) Ltd. (ADI)'s new facility at Amata City Industrial Estate in Chonburi to review the progress of the company's investment expansion worth over THB 19 billion and discuss global semiconductor industry trends.
According t
On July 14, the European Commission (EC) approved EUR 659 million in German State aid to support the establishment of four first-of-a-kind facilities in the semiconductor value chain.
SME Element 3-5 GmbH will receive EUR 353 million to establish a first-of-a-kind factory for SiC epi-wafers in Baesweiler, North Rhine
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