BAIC Group, Tsinghua Unigroup to jointly accelerate large-scale application of Chinese chips to BAIC vehicle models
On May 18, BAIC Group signed three strategic cooperation agreements with Tsinghua Unigroup for in-depth cooperation on automotive-grade chips, intelligent cockpits, autonomous driving, industrial investment, and a vehicle-cloud ecosystem.
BAIC Group will leverage Tsinghua Unigroup’s core strengths in chip design, com



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