On June 25, TouchNetix announced that it had participated in Car HMI Europe and Automotive Interiors Expo and presented its aXiom family of touch and force sensing ICs, purpose-built to meet the complex requirements of automotive applications.
The aXiom family supports sleek, modern interior designs with integrated
On June 25, Soitec and ZenSemi announced a collaboration to enable high-volume production of 300mm BCD-on-SOI (Bipolar-CMOS-DMOS on Silicon-on-Insulator) technologies for next-generation power electronics. Soitec will supply ZenSemi with its 300mm Power-SOI substrates. They aim to provide fabless companies and integr
On June 24, Infineon Technologies AG started the production of the RASIC CTRX8188F, a next-generation 8Tx8Rx radar transceiver. It is the first MMIC (Monolithic Microwave Integrated Circuit) in the market that enables centralized radar architectures.
The CTRX8188F delivers industry-leading signal-to-noise ratio and n
On June 24, South Korean chipmaker SK Hynix announced it has formally filed with the U.S. Securities and Exchange Commission to list American depositary shares (ADS) on the Nasdaq stock exchange. SK Hynix plans to raise USD 29 billion, though it has not yet determined the number of shares in the IPO, and could go pub
On June 22, Infineon Technologies AG announced a collaboration with Amazon Web Services (AWS) to accelerate microcontroller (MCU) evaluation to shorten development cycles for automotive systems. As part of this collaboration, Infineon is launching a cloud-based platform for virtual evaluation of Infineon automotive M
On June 15, Li Auto held its “Livis Day” software and embodied intelligence launch event.
At the event, Li Auto defined an embodied intelligent vehicle as a combination of an electric vehicle, a professional driver, an AI computer, and a life assistant. It also officially launched its first dynamic dataflow AI chip,
On June 9, KD announced the implementation of its KD7251 optical transceiver by Hinge Technology, a China-based leader in advanced vehicle electronics architecture, into a new automotive camera system for 10 Gb/s data transmission. This validates its applicability in real-world in-vehicle networks. The system leverag
Cambridge GaN Devices (CGD) and NXP Semiconductors N.V. (NXP) have reached a long-term collaboration to develop GaN (Gallium Nitride)-based power conversion solutions for automotive, industrial, and data center applications.
The companies aim to accelerate GaN adoption across these high-growth markets. It will enable
On June 11, IAV and Nexperia presented the “ONE Inverter” concept. It combines Nexperia’s GaN and SiC technologies with IAV’s expertise in software-defined systems and battery engineering to explore a new generation of high-voltage architectures for electric mobility. A laboratory demonstrator has validated the ONE I
On June 10, Aliso Viejo, California-based indie Semiconductor announced it has launched the iND881, a next-generation edge AI system-on-chip (SoC) designed for intelligent cameras in automotive, robotics, and physical AI applications.
Combining a Neural Processing Unit (NPU), Digital Signal Processor (DSP), quad-cor
On June 10, NOVOSENSE Microelectronics announced that it had presented IC products for traction inverters, OBCs and DC-DC converters at PCIM Europe 2026 in Nuremberg, Germany. It has presented NSI6911F, an ASIL D isolated gate driver designed for SiC and IGBT power stages, featuring high CMTI, 19 A peak drive capabil
On June 9, Skyworks Solutions, Inc. unveiled its new Si829x isolated safety gate driver for electric vehicle (EV) traction inverters at PCIM 2026. Developed according to ISO 26262 functional safety standards, the Si829x is suitable for use in functional safety systems rated up to ASIL D, delivering the robustness req
On June 9, Nexperia announced the release of 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging. These devices enable the electrical performance of Nexperia’s SiC technology with simplified thermal management and mechanical integration, enabling higher output power, increased efficiency, and improved thermal per
On June 10, Bosch introduced its latest third-generation Silicon Carbide (SiC) semiconductors in India. Bosch’s Gen 3 SiC technology enables more compact and efficient power electronics designs by reducing energy losses, improving thermal performance, and lowering system complexity and cooling requirements.
It deliv
On June 9, Nexperia signed a memorandum of understanding (MoU) with Semikron Danfoss to collaborate on silicon carbide (SiC)-based power modules for automotive traction inverter applications.
The partnership aims to combine Nexperia’s SiC semiconductor expertise with Semikron Danfoss’ power module integration capabil
NXP Semiconductors N.V. (NXP) has unveiled the SAF8444, a new radar system-on-chip (SoC) that enables advanced L2 and L2+ ADAS functions across a wide range of vehicles, including economy class and entry-level models.
The chip helps reduce power consumption and overall system costs by simplifying thermal management a
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