On October 7, rFpro announced that Sony Semiconductor Solutions Corporation (Sony) will showcase its next-generation camera sensor technologies for ADAS and AV applications using its AV elevate simulation platform. Sony will use AV elevate to demonstrate the performance and capabilities of its technologies before any
Announced on October 1, 2025, U.S.-based semiconductor giant Lumentum is expanding its photonics chip manufacturing and establishing a new research and design center in Thailand. The investment will produce advanced, energy-efficient chips for high-performance computing, AI, and smart vehicle applications.
Its latest
On September 29, JOYNEXT announced that it will present its latest solutions for automated driving and central vehicle architectures at AutoSens in Barcelona from October 7 to 9, 2025. It will present the nDrive 1H domain controller and the nCCU2 central computing unit.
The nDrive 1H is a domain controller based on
On September 25, Melexis presented the MLX81339, a new embedded motor driver with PWM/Serial interface. This integrated circuit (IC) is designed for compact 3-phase BLDC and stepper motor control up to 40 W. It offers Flash programmability while maintaining a small footprint. It supports smart industrial and consumer
On September 26, Mercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).
This partnership accelerates the adoption and scaling of advanced chiplet architectur
On September 25, Infineon Technologies AG and ROHM Co., Ltd. signed a memorandum of understanding (MoU) to collaborate on packages for silicon carbide (SiC) power semiconductors. The partners aim to enable each other as second sources of selected packages for SiC power devices.
In the future, customers will be able t
On September 18, STMicroelectronics presented SPSA068, a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameters and qualified to AEC-Q100, it supports ISO 26262 functional safety (FuSa) approval up to ASIL-B.
It is designed for use with microcontro
On September 23, STMicroelectronics announced that it is leading the STARLight project. The project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, develop
On September 19, Nexperia launched its new AEC-Q101 qualified 100 V MOSFETs, in compact CCPAK1212 (12 x 12 mm) copper-clip packaging. These devices deliver ultra-low conduction losses with on-resistance (RDS(on)) as low as 0.99 mΩ, and enable safe current above 460 A.
This makes them ideally suited for thermally dem
On September 18, Wayve signed a letter of intent with NVIDIA to evaluate a USD 500 million strategic investment in Wayve’s next funding round. This investment builds on NVIDIA’s participation in Wayve’s Series C funding round. Wayve’s foundation model approach, combined with NVIDIA’s automotive-grade accelerated comp
On September 18, 2025, Infineon Technologies AG announced it will transfer its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to long-time supplier Malaysian Pacific Industries Berhad (MPI).
The Bangkok site, which serves automotive, connectivity, and IoT packages, will retain all current production emp
On September 18, NVIDIA and Intel Corp. announced a collaboration to jointly develop multiple generations of custom data center and PC products that accelerate applications and workloads across hyperscale, enterprise and consumer markets.
With NVIDIA agreeing to invest USD 5 billion in Intel’s common stock, the two c
On September 17, STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology
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