On August 7, Arbe announced that it has received a strategic order for the use of its chipsets in large-scale data collection projects. These chipsets were shipped and will be deployed on fleets of more than 100 vehicles, operated by multiple leading European automotive manufacturers.
Arbe signed a support and mainte

During a press briefing on August 6, 2025, U.S. President Donald Trump said that he plans to impose a tariff of approximately 100% on semiconductor imports.
President Trump did offer exemptions to companies that are either manufacturing in the U.S. or have committed to do so, saying, “We’ll be putting a tariff of app

indie Semiconductor announced that it signed a definitive agreement to acquire emotion3D GmbH, a developer of advanced perception algorithms and software for automotive applications including in-cabin sensing, ADAS and autonomous driving. The acquisition of emotion3D will help indie create co-optimized hardware and s

On August 1, Infineon Technologies AG announced that the District Court of Munich, Germany, ruled in favor of Infineon in a first-instance patent infringement case concerning gallium nitride (GaN) technology between Infineon and Innoscience. The case centers on the unauthorized use of Infineon’s patented GaN technolo

On July 30, Socionext entered into a license agreement with aiMotive. This agreement grants Socionext access to aiMotive’s aiWare IP and development tools to support the development, including tape-out of next-generation custom SoCs (System-on-Chip) based on chiplet technology for automotive ADAS applications. Socion

Announced on August 1, 2025, Malaysia’s exports to the U.S. will be subject to a reduced 19% tariff, effective at 12:01 a.m. EDT on August 7. The reduction follows a July 31 executive order by President Trump that amended tariff rates under the U.S. reciprocal trade framework for select countries.
The move marks a re

On July 27, Tesla Inc. CEO Elon Musk said his company had signed a USD 16.5 billion deal to source chips from Samsung Electronics. Musk said Samsung’s new chip factory in Taylor, Texas, will make Tesla’s next-generation AI6 chip, potentially re-energizing the project that has faced long delays with Samsung’s difficul

On July 24, onsemi announced an expanded collaboration with Schaeffler through a new design win. It leverages onsemi’s next-generation EliteSiC product line of silicon carbide MOSFETs. The onsemi solution will power the Schaeffler traction inverter for a leading global automaker’s plug-in hybrid electric vehicle (PHE

On July 23, Infineon Technologies AG announced a partnership with UL Solutions to accelerate the implementation of ISO 26262 functional safety compliance for Infineon’s automotive customers. ISO 26262 provides a process for managing and reducing safety risks associated with the integration of electrical and electroni

Beijing Horizon Robotics Technology R&D Co., Ltd.  (Horizon Robotics) announced that GoFurther.AI, a supplier of intelligent logistics products, launched a Level 4 autonomous driving solution for urban last-mile logistics scenarios.
Adopting a fully domestically produced hardware architecture, where dual Journey 6M c

Beijing SemiDrive Technology Co., Ltd. (SemiDrive) participated in the Automotive Engineering Exposition (AEE) 2025 Nagoya in Japan with a range of solutions for intelligent cockpits and intelligent vehicle control.
Showcased at the event was the SemiDrive X9 intelligent cockpit platform integrating P3 Group’s SPARQ

Autolink Information Technology Co., Ltd. (Autolink) participated in the Automotive Engineering Exposition (AEE) 2025 Nagoya in Japan.
At the event, the company’s key exhibits were: the Qualcomm SA8775P chip-based AL-A1 integrated cockpit-driving domain controller slated for mass production this October; the Qualcomm

On July 16, Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering, released as the MJPE-series, addresses the ongoing industry demand for more power-efficient and cost-effective designs i

On July 17, onsemi announced plans to invest USD 8 million at Stony Brook University in New York to establish a wide band gap research center that will advance innovation in power semiconductors and foster the next generation of skilled professionals in this field. 
The center aims to advance foundational research in

On July 3, multiple sources reported that Taiwan Semiconductor Manufacturing Co (TSMC) will gradually shut down its gallium nitride (GaN) compound semiconductor business within two years. TSMC is cooperating with its customers to ensure a smooth transition. The decision was made after reviewing market conditions and

On July 7, VisIC Technologies announced that it had proactively addressed recent changes in the GaN supply landscape following TSMC’s notification of a last-time buy for its GaN product line. VisIC’s new foundry partners have already begun production ramp-up, with the first products available for customer evaluation

On July 17, Tata Electronics and Robert Bosch GmbH signed a memorandum of understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test u