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Infineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high power applications
Infineon Technologies AG (Infineon) registered its QDPAK and DDPAK top-side cooling (TSC) packages as a JEDEC standard for high voltage MOSFETs for industrial and automotive applications. With this registration, Infineon aims to help establish a broad adoption of TSC technology in new designs with one standard packag....
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