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Toposens uses Infineon’s MEMS microphone in new ultrasonic 3D sensor
On November 12, Toposens announced that it has partnered up with Infineon Technologies AG to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology.
Toposens GmbH was founded in Munich in 2015 and is built up of experts in embedded systems, ha....
Toposens GmbH was founded in Munich in 2015 and is built up of experts in embedded systems, ha....
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