Ceva, Inc. announced at CES 2026 that NXP Semiconductors N.V. (NXP) has integrated Ceva’s SensPro AI DSP into its S32Z2 and S32E2 processors for the next generation of real-time domain and zonal control modules in software-defined vehicles (SDVs).
The integration enables real-time AI inference, predictive analytics,
NXP Semiconductors N.V. (NXP) unveiled a new S32N7 processor series designed for SDVs at CES 2026. The S32N7 digitizes and centralizes core vehicle functions, including propulsion, vehicle dynamics, body, gateway and safety domains. This accelerates development and reduces total cost of ownership.
The series offers 3
On December 11, TTTech Auto announced the launch of MotionWise Communication, a new software product designed to unify and simplify automotive communication across all vehicle domains. The middleware is the next modular solution from the MotionWise family. It enables OEMs and Tier-1 suppliers to implement all relevan
On December 2, TTTech Auto announced that it has secured a significant expansion of its collaboration with a major Korean OEM. The extended agreement includes a substantial increase in production volume for TTTech Auto’s MotionWise safety middleware.
MotionWise acts as the safety mastermind within the vehicle archit
NXP Semiconductors N.V. (NXP) unveiled the industry’s first Electrochemical Impedance Spectroscopy (EIS) battery management chipset featuring hardware-based nanosecond-level synchronization of all cell measurements within a single high-voltage battery pack.
The solution integrates EIS measurement directly into three
Nexperia was created in 2017 when NXP sold its Standard Products division to two Chinese investor Groups, JAC Capital and Wise Road Capital, for $2.75 billion. Towards the end of 2019, a Chinese electronics and computer equipment producer called Wingtech Technology acquired a controlling stake in Nexperia for $3.6 bi
On October 24, 2025, NXP Semiconductors N.V. (NXP) closed the previously announced acquisition of Aviva Links for USD 243 million in cash before closing adjustments. Aviva Links is a provider of Automotive SerDes Alliance (ASA) compliant-in-vehicle connectivity solutions. This acquisition complements and expands NXP’
eInfochips, an Arrow Electronics company, and a leading provider of product engineering services, announced a multi-year collaboration with NXP Semiconductors N.V. (NXP) focused on software distribution and customer services.
The collaboration aims to accelerate the development of software-defined vehicles (SDVs). eI
NXP Semiconductors N.V. (NXP) announced the i.MX 952 applications processor, part of its i.MX 9 series, designed for AI-powered vision, human-machine interfaces (HMIs) and in-cabin sensing applications.
The i.MX 952 features an integrated eIQ Neutron Neural Processing Unit (NPU) for use with multiple camera sensors a
NXP Semiconductors N.V. (NXP) announced plans to relocate its Germany headquarters from Lokstedt, where it has been based for 100 years, to Tasköprüstraße in Hamburg-Bahrenfeld. The move-in is planned for early 2031.
The new site will accommodate over 800 employees and house research, development, testing, and market
On August 25, TTTech Auto and Hyundai AutoEver signed a letter of intent (LoI) to accelerate DDS-based software integration for next-generation vehicles. Under this LoI, the two companies will jointly evaluate the DDS-integrated software platform, align technology development with Hyundai AutoEver, and explore potent
NXP Semiconductors N.V. (NXP) has partnered with Kodiak Robotics, Inc. (Kodiak), a leader in AI-powered autonomous freight transport, to develop a scalable, safety-critical computing platform for driverless trucks.
The platform powers the Kodiak Driver, a virtual driver combining advanced AI-powered software with mod
On July 24, STMicroelectronics (ST) announced that it is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ MEMS sensors business. The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dyna
On July 4, Geely Auto announced the recent establishment of a joint innovation lab between the Geely Automobile Research Institute (GRI) and NXP. The two parties will focus on deepening cooperation on intelligent automotive technologies.
The GRI, in the process of comprehensively advancing the establishment of an “ec
NXP Semiconductors N.V. (NXP) introduced its new 18-channel BMx7318/7518 Li-ion battery cell controller integrated circuit (IC) family, designed to enhance performance and safety in EVs, energy storage systems, and 48V battery management systems.
Built on NXP's new architecture with dedicated analog-to-digital conver
NXP Semiconductors N.V. has completed the acquisition of TTTech Auto, a leader in safety-critical systems and middleware for SDVs.
The integration of TTTech Auto’s MotionWise safety middleware with NXP’s CoreRide platform will help simplify software and hardware integration, while reducing development complexity, and
NXP Semiconductors N.V. (NXP) has collaborated with Rimac Technology to develop a centralized vehicle architecture for advanced domain and zonal control in SDVs, leveraging NXP’s S32E2 real-time processors, designed to address current and future automotive connectivity, security, and safety.
The solution consolidates
NXP Semiconductors N.V. (NXP) has unveiled the second generation of its OrangeBox automotive-grade development platform, designed to simplify and secure automotive communication between the vehicle’s gateway and its wireless technologies.
The OrangeBox 2.0 incorporates AI capabilities, post-quantum cryptography, an A
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