On February 12, TTTech Auto announced that it is joining CHASSIS, a three-year CHIPS JU initiative, bringing together 18 leading organizations across Europe. TTTech Auto is dedicated to supporting the development of an open ecosystem that accelerates the adoption and harmonization of secure, scalable chiplet technolo
NXP Semiconductors N.V. (NXP) has completed the sale of its MEMS sensors business to STMicroelectronics for USD 900 million in cash, subject to closing adjustments, with potential additional consideration of up to USD 50 million linked to technical milestones.
The transaction strengthens STMicroelectronics’ sensor po
ETAS GmbH, a wholly owned subsidiary of Robert Bosch GmbH, announced that its RTA-CAR AUTOSAR automotive runtime platform is now available for NXP Semiconductors’ new S32N7 processor series, accelerating the development of software-defined vehicle (SDV). The milestone follows over 12 months of close collaboration bet
Hella GmbH & Co. KGaA (FORVIA HELLA) announced, at CES 2026, a collaboration with NXP Semiconductors N.V. (NXP) to develop and industrialize ForWave7HD high-resolution radar sensors, with up to 32 transmission and receive channels each.
Leveraging NXP's third-generation imaging radar chipset, with the S32R47 radar pr
At the CES 2026, Neusoft Reach Automotive Technology (Shanghai) Co., Ltd. (Neusoft Reach) launched an Agentic AI solution for next-generation intelligent vehicles with NXP Semiconductors N.V. (NXP). By deeply integrating Neusoft Reach’s NeuSAR OS and NXP’s S32N7 high-performance heterogeneous computing architecture,
Ceva, Inc. announced at CES 2026 that NXP Semiconductors N.V. (NXP) has integrated Ceva’s SensPro AI DSP into its S32Z2 and S32E2 processors for the next generation of real-time domain and zonal control modules in software-defined vehicles (SDVs).
The integration enables real-time AI inference, predictive analytics,
NXP Semiconductors N.V. (NXP) unveiled a new S32N7 processor series designed for SDVs at CES 2026. The S32N7 digitizes and centralizes core vehicle functions, including propulsion, vehicle dynamics, body, gateway and safety domains. This accelerates development and reduces total cost of ownership.
The series offers 3
On December 11, TTTech Auto announced the launch of MotionWise Communication, a new software product designed to unify and simplify automotive communication across all vehicle domains. The middleware is the next modular solution from the MotionWise family. It enables OEMs and Tier-1 suppliers to implement all relevan
On December 2, TTTech Auto announced that it has secured a significant expansion of its collaboration with a major Korean OEM. The extended agreement includes a substantial increase in production volume for TTTech Auto’s MotionWise safety middleware.
MotionWise acts as the safety mastermind within the vehicle archit
NXP Semiconductors N.V. (NXP) unveiled the industry’s first Electrochemical Impedance Spectroscopy (EIS) battery management chipset featuring hardware-based nanosecond-level synchronization of all cell measurements within a single high-voltage battery pack.
The solution integrates EIS measurement directly into three
Nexperia was created in 2017 when NXP sold its Standard Products division to two Chinese investor Groups, JAC Capital and Wise Road Capital, for $2.75 billion. Towards the end of 2019, a Chinese electronics and computer equipment producer called Wingtech Technology acquired a controlling stake in Nexperia for $3.6 bi
On October 24, 2025, NXP Semiconductors N.V. (NXP) closed the previously announced acquisition of Aviva Links for USD 243 million in cash before closing adjustments. Aviva Links is a provider of Automotive SerDes Alliance (ASA) compliant-in-vehicle connectivity solutions. This acquisition complements and expands NXP’
eInfochips, an Arrow Electronics company, and a leading provider of product engineering services, announced a multi-year collaboration with NXP Semiconductors N.V. (NXP) focused on software distribution and customer services.
The collaboration aims to accelerate the development of software-defined vehicles (SDVs). eI
NXP Semiconductors N.V. (NXP) announced the i.MX 952 applications processor, part of its i.MX 9 series, designed for AI-powered vision, human-machine interfaces (HMIs) and in-cabin sensing applications.
The i.MX 952 features an integrated eIQ Neutron Neural Processing Unit (NPU) for use with multiple camera sensors a
NXP Semiconductors N.V. (NXP) announced plans to relocate its Germany headquarters from Lokstedt, where it has been based for 100 years, to Tasköprüstraße in Hamburg-Bahrenfeld. The move-in is planned for early 2031.
The new site will accommodate over 800 employees and house research, development, testing, and market
On August 25, TTTech Auto and Hyundai AutoEver signed a letter of intent (LoI) to accelerate DDS-based software integration for next-generation vehicles. Under this LoI, the two companies will jointly evaluate the DDS-integrated software platform, align technology development with Hyundai AutoEver, and explore potent
NXP Semiconductors N.V. (NXP) has partnered with Kodiak Robotics, Inc. (Kodiak), a leader in AI-powered autonomous freight transport, to develop a scalable, safety-critical computing platform for driverless trucks.
The platform powers the Kodiak Driver, a virtual driver combining advanced AI-powered software with mod
On July 24, STMicroelectronics (ST) announced that it is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ MEMS sensors business. The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dyna
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