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Malaysia

NXP to expand semiconductor testing and packaging capacity in Malaysia via USD 250 million EIB loan

Announced on October 13, 2026, NXP Semiconductors will use a USD 250 million loan from EIB Global, the European Investment Bank Group’s international development arm, to expand semiconductor assembly, packaging, and testing capacity at its facility near Kuala Lumpur, Malaysia. 
The semiconductors are used in automoti....

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