On September 17, STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology

On July 24, STMicroelectronics (ST) announced that it is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ MEMS sensors business. The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dyna

On July 10, STMicroelectronics (ST) and Metalenz announced a new license agreement. The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s technology and manufacturing platform, combining 300mm semiconductor and optics production, test, and qualification

On June 23, STMicroelectronics announced the expansion of ISO 26262-compliant automotive family L9800 with an 8-channel low-side driver in a space-saving leadless package. It saves space in body-control modules, HVAC and climate controls, and power-domain controls. 
The L9800 outputs can drive resistive, capacitive,

On June 10, STMicroelectronics announced new Class-D automotive audio amplifiers for smart cockpit applications. The new HFDA80D and HFDA90D extend ST’s family of high-frequency automotive amplifiers, complementing the HFA80A analog-input IC. All devices operate at a switching frequency of 2 MHz to conserve PCB space

On June 11, Renault announced that in Viva Technology 2025, Software République which is a partnership of seven European companies (i.e., Atos, Dassault Systèmes, JCDecaux, Orange, Renault Group, STMicroelectronics, and Thales)—teamed up with three fire departments to launch “vision 4rescue,” a smart, connected syste

On May 28, Ampere announced that they see power electronics as key to improving vehicle performance and cutting costs.
Ampere uses a smarter, compact design by combining components such as the charger and DC-DC converter. This reduces parts, cost, size, and weight—improving range and cabin space. However, cost saving

On May 20, FocalPoint, a UK-based software company, partnered with STMicroelectronics to offer automotive OEMs an integrated solution that enhances navigation performance by improving GNSS reliability and accuracy — a key factor in making autonomous vehicles safer.
In the partnership, FocalPoint will integrate its S-

On May 7, the Ministry of Business and Made in Italy and STMicroelectronics signed an agreement to support the growth and expansion of the STMicroelectronics site in Catania. 
The implementation of the program includes investments of EUR 5 billion in the period 2023-2037, with public incentives exceeding EUR 2 billio

On April 17, Renault announced that its Emblème demo car focuses on smart, sustainable design—from materials to production, use, and end-of-life recycling. 
Renault Emblème uses a dual-energy electric powertrain i.e., running on both electricity and hydrogen—ideal for low-carbon travel over short and long distances.

On April 16, STMicroelectronics announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, simplifying software-defined vehicle (SDV) development and electrification platforms. It will be first available on the Stellar P6 MCUs, which target t

On April 15, STMicroelectronics N.V. (ST) announced that it will exhibit at electronica China 2025 on April 15-17, 2025. It will present a wide array of innovative solutions for automotive and industrial applications. 
ST will present the recently announced Teseo VI automotive-grade GNSS chip, supporting advanced cap

On April 14, STMicroelectronics N.V. (ST)  announced two new automotive NFC readers in its ST25R portfolio. The ST25R500 and ST25R501 meet Car Connectivity Consortium (CCC) and Wireless Power Consortium requirements for digital key and center console applications for device pairing and engine start and wireless charg

On April 10, STMicroelectronics N.V. (ST) presented further updates to its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024.
The reshaping and modernization of ST’s manufacturing operations aim to achieve two main objectives: prioritizing planned inves

On March 31, STMicroelectronics, and Innoscience signed an agreement on GaN technology development and manufacturing.  They agreed on a joint development initiative on GaN power technology. The agreement allows Innoscience to utilize ST’s front-end manufacturing capacity outside China for its GaN wafers, while ST can

On March 3, Swift Navigation announced that it has worked with STMicroelectronics (ST) to provide a comprehensive, end-to-end solution for automotive safety and autonomy. This joint offering combines Swift’s Skylark Precise Positioning Service with ST’s new Teseo VI GNSS chipset. The joint solution provides automotiv

On March 3, Trimble, a technology solutions company, partnered with STMicroelectronics to deliver precise positioning solutions for automotive and Internet of Things (IoT) applications.
In the partnership, Trimble's precise positioning engine, Trimble ProPoint Go, will be paired with the STMicroelectronics' Teseo VI

On February 25, STMicroelectronics (ST) introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle sy

On February 4, STMicroelectronics (ST) and HighTec EDV-Systeme GmbH announced a partnership to accelerate the development of safety-critical systems to make software-defined vehicles safer and more affordable. The solution supports the Rust programming language and combines HighTec’s Rust compiler, qualified to ISO 2