On July 14, FocalPoint, a UK-based provider of GNSS (Global Navigation Satellite System) software, announced a commercial agreement with STMicroelectronics to deliver highly reliable vehicle positioning in challenging GNSS environments.
The joint solution significantly improves GNSS reliability in challenging enviro
On June 12, Renault’s Software République introduced “cleveR insights”.
cleveR insights offer cities a clear and real-time view of what is happening on the ground, helping them make faster and better decisions. The solution helps local authorities better understand and manage their areas.
The system uses a flexible
On June 1, Point One Navigation announced that it is presenting a joint precise positioning solution at AutoSens 2026 in Detroit with STMicroelectronics (ST). Point One Navigation’s software platform integrates seamlessly with ST’s new Teseo6 family of GNSS receiver chipsets and module solutions to deliver a complete
On March 10, STMicroelectronics presented an ultra-wideband (UWB) chip family “ST64UWB”, which combines extended range with greater processing power and robustness to enable new and improved automotive, consumer, and industrial use cases.
The emerging standard builds on the IEEE 802.15.4z UWB wireless technology. New
On February 10, STMicroelectronics announced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive edge intelligence. It is designed for future software-defined vehicles. It has an integrated ST Neural-ART Accelerator for real-time AI efficiency. The start of product
NXP Semiconductors N.V. (NXP) has completed the sale of its MEMS sensors business to STMicroelectronics for USD 900 million in cash, subject to closing adjustments, with potential additional consideration of up to USD 50 million linked to technical milestones.
The transaction strengthens STMicroelectronics’ sensor po
On December 11, the European Investment Bank (EIB) and STMicroelectronics signed a EUR 500 million financing agreement. This represents the first tranche of a broader EUR 1 billion credit line recently approved by the EIB in favour of STMicroelectronics.
The tranche will support acceleration of R&D and high-volume c
On November 12, STMicroelectronics presented the VNF1248F automotive e-fuse MOSFET controller, which combines ST’s fast-acting, advanced e-fuse features for harness protection and enhanced flexibility, enabling power saving and advanced performance in automotive functional-safety systems. The VNF1248F reacts within 1
On October 8, STMicroelectronics (ST) presented a new automotive 8-channel gate driver delivering 48V mild-hybrid efficiency. The L98GD8 driver has eight fully configurable channels for driving MOSFETs in flexible high-side and low-side configurations. Able to operate from a 58V supply, the L98GD8 provides rich diagn
On October 2, Tobii and STMicroelectronics (ST) started mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide field-of-view camera able to see in daylight and at night with next-level driver and occupant monitoring.
Tobii’s and ST’s integrated approach allows aut
On September 18, STMicroelectronics presented SPSA068, a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameters and qualified to AEC-Q100, it supports ISO 26262 functional safety (FuSa) approval up to ASIL-B.
It is designed for use with microcontro
On September 23, STMicroelectronics announced that it is leading the STARLight project. The project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, develop
On September 22, STMicroelectronics announced that its General Manager of the Company’s Range and Connectivity Division has joined the board of directors of the FiRa Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.
ST is actively driving the de
On September 17, STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology
On July 24, STMicroelectronics (ST) announced that it is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ MEMS sensors business. The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dyna
On July 10, STMicroelectronics (ST) and Metalenz announced a new license agreement. The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s technology and manufacturing platform, combining 300mm semiconductor and optics production, test, and qualification
On June 23, STMicroelectronics announced the expansion of ISO 26262-compliant automotive family L9800 with an 8-channel low-side driver in a space-saving leadless package. It saves space in body-control modules, HVAC and climate controls, and power-domain controls.
The L9800 outputs can drive resistive, capacitive,
On June 10, STMicroelectronics announced new Class-D automotive audio amplifiers for smart cockpit applications. The new HFDA80D and HFDA90D extend ST’s family of high-frequency automotive amplifiers, complementing the HFA80A analog-input IC. All devices operate at a switching frequency of 2 MHz to conserve PCB space
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