On April 17, Renault announced that its Emblème demo car focuses on smart, sustainable design—from materials to production, use, and end-of-life recycling. The approach cuts the carbon footprint of parts production by 70%. Half of the car's materials are recycled, and nearly all can be recycled again after use.
Renau

On April 16, STMicroelectronics announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, simplifying software-defined vehicle (SDV) development and electrification platforms. It will be first available on the Stellar P6 MCUs, which target t

On April 15, STMicroelectronics N.V. (ST) announced that it will exhibit at electronica China 2025 on April 15-17, 2025. It will present a wide array of innovative solutions for automotive and industrial applications. 
ST will present the recently announced Teseo VI automotive-grade GNSS chip, supporting advanced cap

On April 14, STMicroelectronics N.V. (ST)  announced two new automotive NFC readers in its ST25R portfolio. The ST25R500 and ST25R501 meet Car Connectivity Consortium (CCC) and Wireless Power Consortium requirements for digital key and center console applications for device pairing and engine start and wireless charg

On April 10, STMicroelectronics N.V. (ST) presented further updates to its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024.
The reshaping and modernization of ST’s manufacturing operations aim to achieve two main objectives: prioritizing planned inves

On March 31, STMicroelectronics, and Innoscience signed an agreement on GaN technology development and manufacturing.  They agreed on a joint development initiative on GaN power technology. The agreement allows Innoscience to utilize ST’s front-end manufacturing capacity outside China for its GaN wafers, while ST can

On March 3, Swift Navigation announced that it has worked with STMicroelectronics (ST) to provide a comprehensive, end-to-end solution for automotive safety and autonomy. This joint offering combines Swift’s Skylark Precise Positioning Service with ST’s new Teseo VI GNSS chipset. The joint solution provides automotiv

On March 3, Trimble, a technology solutions company, partnered with STMicroelectronics to deliver precise positioning solutions for automotive and Internet of Things (IoT) applications.
In the partnership, Trimble's precise positioning engine, Trimble ProPoint Go, will be paired with the STMicroelectronics' Teseo VI

On February 25, STMicroelectronics (ST) introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle sy

On February 4, STMicroelectronics (ST) and HighTec EDV-Systeme GmbH announced a partnership to accelerate the development of safety-critical systems to make software-defined vehicles safer and more affordable. The solution supports the Rust programming language and combines HighTec’s Rust compiler, qualified to ISO 2

On December 3, Ampere announced that it has partnered with STMicroelectronics to supply Silicon Carbide (SiC) power modules for Ampere's ultra-efficient electric powertrain starting in 2026. The collaboration will optimize the power module for Ampere’s electric powertrain inverter.
The partnership also includes the d

On November 20, STMicroelectronics (ST) announced that it is reiterating its USD 20 billion-plus revenue ambition and associated financial model, which it now expects to be reached by 2030. ST is also setting an intermediate financial model with revenues expected around USD 18 billion with an operating margin within

On July 5, STMicroelectronics (ST) announced that it will present innovative solutions for automotive at Electronica China 2024. ST will demonstrate its complete automotive solutions by showcasing two electric-vehicle models. 
ST’s latest automotive-charging solution integrates an onboard charger (OBC) and DC-DC conv

On June 4, STMicroelectronics (ST) and Geely Auto Group signed a long-term Silicon Carbide (SiC) supply agreement.  ST will provide multiple Geely Auto brands with SiC power devices for mid-to-high-end battery electric vehicles (BEVs).
Geely Auto Group has adopted ST’s third-generation SiC MOSFET devices in electric

On May 31, the European Commission approved, under EU State aid rules, a EUR 2 billion Italian measure to support STMicroelectronics (‘ST') in the construction and operation of an integrated chip manufacturing plant for Silicon Carbide (‘SiC') power devices in Catania, Sicily. It is in line with the objectives set ou

On May 31, STMicroelectronics announced a new high-volume 200mm silicon carbide (“SiC”) manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy.
Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form

On May 14, STMicroelectronics introduced new automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio systems, and inverter gate drivers.
The A6983 converters have six non-isolated step-down converters in low-consumption and low

On May 6, STMicroelectronics presented the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety software library that enables a cost-effective solution for functional safety applications. The modules deliver high accuracy and reliability for systems such as vehicle navigation, body el