Renesas Electronics Corporation

Company Profile



Toyosu Foresia, 3-2-24, Toyosu Koto-ku, Tokyo 135-0061, Japan

Business Overview

-The Company is a Japanese semiconductor manufacturer with the highest global share of automotive micro-computers. Its automotive business delivers semiconductors that control automotive engines and bodies (automotive control segment), as well as semiconductors for automotive information equipment and devices (automotive information segment) such as car-navigation products. This business also delivers micro-controllers, SoCs (systems-on-a-chip), analog semiconductors, and power semiconductors.



-Listed on the First section of the Tokyo Stock Exchange  (As of Dec. 31, 2022)
Shareholder Investment Ratio (%)
Innovative Network Corporation of Japan 12.43
The Master Trust Bank of Japan, Ltd. (Trust Account) 10.52
Denso Corporation 8.52
Toyota Motor Corporation 4.17
Custody Bank of Japan, Ltd. 3.99
Hitachi, Ltd. 3.44
Custody Bank of Japan, Ltd. (Trust Account) 3.17
Mitsubishi Electric Corporation 2.82
Total 52.94


Advanced Driver Assistance Systems (ADAS) and Automated Driving (AD)
-SoC for Smart cameras, LiDAR: R-Car V3M, V3H
-SoC for Surround-view System: R-Car V3M, V3H
-SoC for AD: R-Car Gen3
-MCU for AD: RH850P1H-C
-SoC for Driver / Passenger Monitoring System: R-Car V3M, V3H
-CPU for Satellite Radar System of AD / ADAS: R-Car V4H
-Imaging radar System for AD / ADAS
-ADAS front camera solution
-NVM (Non-volatile memory) programmable device CMIC GreenPAK
-Power management IC for Onboard camera application: RAA271082

-In-vehicle sensor solution

  • Sensor Signal Conditioner
  • Back Controller
  • Micro Controller

-Device for compact motors

  • For Wiper
  • For AFS (Adaptive Front-lighting System)
  • For Power Window
  • For Radiator Cooling fan
  • For Water Pump

Chassis & Safety
-Electric power steering (EPS) devices

  • Power Management IC (PMIC) RAA270005
  • Micro Controller (MCU) RH850 / P1x

-Brake system devices
-Airbag system devices

Connected Infotainment
-Instrument Panel for Light Electrified Vehicles

  • Power Management Unit (PMU)
  • Graphical Processor
  • Bluetooth LE (Low Energy) Device
  • Highly Integrated SoC

-Automotive Cockpit Solution with Haptics
-In-Cabin Air Quality Sensor Solution
-Low-Cost Digital Instrument Cluster

  • RH850/D1M microcontroller (MCU)
  • RAA27884x VSP LCD controller

Electrified Drivetrain -xEV
-12V/48V Bidirectional DC/DC Converter 
-12V/48V Bidirectional DC/DC Converter with GaN HEMT
-xEV Inverter Solution with Inductive Position Sensor (IPS)

Automotive Gateway & Domain Control
-Car Telematics Box Module

-MCU Device RH850
-Analog Powertrain Components

  • Gate driver
  • Bridge driver
  • Solenoid
  • Power management IC
  • Discrete MOSFET


Nov. 2002 NEC Electronics Corporation was established in Kawasaki, Kanagawa Prefecture. It was formed as a wholly owned subsidiary of NEC Corporation, which spun off its semiconductor operations except its general-purpose DRAM business.
April 2003 Renesas Technology Corporation was established by Hitachi, Ltd., which owned a 55% stake, and Mitsubishi Electric Corporation, which owned a 45% stake.
July 2003 NEC Electronics was listed on the first section of the Tokyo Stock Exchange.
April 2010 Renesas Electronics was established through the integration of NEC Electronics Corporation and Renesas Technology Corporation.
Sep. 2013 The Company issued third-party shares to be bought by Innovative Network Corporation of Japan, Toyota Motor Corporation, Nissan Motor Co., Ltd., Keihin Corporation, Denso Corporation, Canon Inc., Nikon Corporation, Panasonic Corporation, and Yasukawa Electric Corporation.
Feb. 2017 Acquired all stock shares in Intersil Corporation based in the USA, turning it into a
Jan. 2018 Intersil Corporation absorbed the business operations of Renesas Electronics America Inc., adopting the company name Renesas Electronics America Inc.
Oct. 2018 Transferred the operations of the Kochi Plant of Renesas Semiconductor Manufacturing to Marusan Sangyo Co., Ltd.
Jan. 2019 Absorbed the operations of Renesas Semiconductor Parts and Test Solutions through a simple merger transaction.
Mar. 2019 Acquired all shares of Integrated Device Technology, Inc.
Jan. 2020 IDT merges with Renesas Electronics America, Inc. and changes its name to Renesas Electronics America, Inc.
Aug. 2021 Acquired and consolidated Dialog Semiconductor Plc.
Dec. 2021 Acquired and consolidated Celeno Communications Inc.
Apr. 2022 Moved to the Prime Market of the Tokyo Stock Exchange due to a review of the Tokyo Stock Exchange's market classification.
Jul. 2022 Acquired all shares of Reality Analytics, Inc. and made it a subsidiary.
Oct. 2022 Acquired all shares of Steradian Semiconductors Private Limited and made it a subsidiary.

Supplemental Information 1

Technology Licensing Agreement

(As of Dec. 31, 2022)
Partner Item of Contract Contract date
Texas Instruments Incorporated
Cross-licenses for semiconductor patents (includes subsidiaries) Mar. 02, 2011
ARM Limited

Licensing-in of semiconductor designing technology

Dec. 22, 2015

>>>IR Information on Renesas Electronics

>>>Financial Forecast for the Next Fiscal Year (Sales, Operating Income etc.)

Note: A figure in brackets ( ) indicates a loss