On June 2, Infineon Technologies AG presented silicon carbide (SiC) bidirectional switches (BDS) built on rugged 750 V CoolSiC G2 technology. The 750V CoolSiC BDS delivers the reliability margin that modern grids and energy systems demand, resulting in the lowest Total Cost of Ownership.
The 750 V CoolSiC BDS offers
On May 29, Infineon Technologies AG announced a new 1300 V silicon carbide (SiC) power module within its HybridPACK Drive family for electric vehicle inverters.
The company stated that the new module can operate continuously at temperatures of up to 205 °C, higher than the 175 °C limit of current designs, helping au
On May 27, Infineon Technologies AG announced that it will present its comprehensive semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics, and electromobility at PCIM Europe 2026. For electromobility, it will present solutions for traction inverters, DC-DC converters, on-board char
On May 20, Infineon Technologies AG announced that it is leading the Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), one of Europe's most ambitious semiconductor R&D projects. This project unites enterprises and research institutes from 15 European countries. With a total project volume
On March 30, Silicon Austria Labs, along with Infineon Technologies Austria and AVL List, developed innovative solutions for modern high- and low-voltage vehicle electrical systems, enabling more compact, reliable, and fault-tolerant architectures for future electric vehicles.
The REDSEL research project focused on d
On March 26, Subaru Corporation (Subaru) and Infineon Technologies AG (Infineon) held a press briefing in Tokyo to announce details of their collaboration on the design of a microcontroller unit (MCU) to be installed in an integrated control ECU for next-generation Subaru vehicles. Subaru has decided to adopt Infineo
On March 19, Infineon Technologies entered a technology partnership with Indian power‑electronics OEM Zenergize to supply wide‑bandgap power semiconductors, including silicon carbide devices, and microcontroller platforms for India‑designed solar inverters, EV fast‑chargers, and energy‑storage systems.
The collabora
On March 6, IDA Ireland, the Irish Government’s inward investment promotion agency, announced that Infineon Technologies AG has officially opened its new Cork office at City Gate Park, Mahon. The new office has capacity for growth as the Cork team expands. This is part of a EUR 60 million investment plan announced in
On March 3, IAR announced it will highlight its collaboration with Infineon Technologies AG across Infineon’s DRIVECORE software evaluation bundle portfolio and preview upcoming debug capabilities for Infineon’s AURIX RISC-V family at Embedded World 2026. In parallel with its DRIVECORE collaboration, IAR is expanding
On March 3, Infineon Technologies AG presented the MOTIX TLE9954QSW40-33, its first fully integrated motor control system-in-package (SiP) for the automotive sector. The new motor driver addresses the industry’s growing challenges related to extreme miniaturization.
The solution supports compact designs for applicat
On March 9, 2026, Subaru announced its collaboration with Infineon Technologies on the design of a microcontroller unit (MCU) to be installed in the integrated ECU that coordinates advanced driver assistance systems (ADAS) and vehicle motion control in future Subaru vehicles.
In pursuit of developing a new E/E archit
On March 3, Infineon Technologies AG presented the 28nm TEGRION SLI22, the latest innovation in automotive security controllers, designed to protect the future of connected systems. It can be deployed across a wide range of security-critical applications, including eSIM, V2X, and car access.
With its Common Criteria
On February 24, Infineon Technologies AG announced that it will present microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026. Infineon will demonstrate its comprehensive MCU portfolio through live demos.
For mobility, it will present demos targeting software-de
On February 16, Infineon Technologies AG announced its role in supporting the software-defined vehicle architecture of BMW’s Neue Klasse platform. The company will also showcase the BMW iX3, the first Neue Klasse model, at its Annual General Meeting.
The Neue Klasse platform features a scalable electronic architectur
On February 9, Infineon Technologies announced that CoolSiC MOSFETs (silicon carbide (SiC) power MOSFETs) have been adopted in the new bZ4X model from Toyota. Integrated into the on-board charger (OBC) and DC/DC converter, it leverages the material's advantages of low losses, high thermal resistance, and high voltage
On February 5, Infineon Technologies AG introduced the EiceDRIVER 1ED301xMC12I product family, a series of high-performance isolated gate driver ICs with opto-emulator input. The devices are pin-compatible with existing opto-emulators and optocouplers, offering high common-mode transient immunity (CMTI), a robust out
ams-OSRAM AG (ams OSRAM) has entered an agreement to sell its non-optical analog/mixed-signal sensor business for automotive, industrial, and medical applications to Infineon Technologies AG (Infineon) for EUR 570 million in cash.
The deal, expected to close in Q2/2026, is structured as a fabless asset transaction an
On February 4, Infineon Technologies completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to Malaysian Pacific Industries Berhad (MPI), a supplier of Infineon. Along with the transition, Infineon secures a long-term supply agreement with MPI.
MPI is an investment holding company head
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