On June 25, IDEMIA Secure Transactions, a global leader in connectivity solutions, partnered with Infineon Technologies AG, a leading semiconductor company, to address the challenges of next-generation car access.
The partnership supports automotive safety, quality, and cybersecurity, by combining Infineon’s electro

On June 18, Tata Elxsi and Infineon Technologies signed a memorandum of understanding (MoU) to jointly develop application-ready electric vehicle (EV) solutions. The collaboration aims to deliver ready-to-deploy EV systems based on Infineon technologies, targeting key mobility segments including two-wheelers, three-w

On June 12, Infineon Technologies AG expanded its PSOC 4 HV microcontroller (MCU) platform by introducing the PSOC 4 HVMS product family. Designed for space-constrained sensing and actuator applications, the new MCUs integrate high-voltage functionality and advanced analog sensing.
It supports a broad range of automo

On June 10, Infineon Technologies AG launched the XENSIV TLE4802SC16-S0000, an inductive sensor designed to enhance performance in automotive chassis applications. The sensor enables high-precision torque and angle measurements with robust stray field robustness, supporting digital output via SENT or SPC protocols. 

On June 5, Infineon Technologies collaborated with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide a fully integrated, real-time development and test environment for key elements of xEV powertrain systems. 
The solution enables automotive engineers using Infineon’s AURIX

On May 28, Ather Energy, a leading electric two-wheeler manufacturer in India, and Infineon Technologies Asia Pacific Pte Ltd signed a memorandum of understanding (MoU) in Seoul, South Korea, to jointly drive innovation in the electric vehicle (EV) industry in India. This collaboration will explore sensing and safety

On May 20, Infineon Technologies AG joined the board of directors of the FiRa (fine-ranging) Consortium. This marks a significant step in the company’s commitment to further shaping the future of Ultra-wideband (UWB) across a wide field of use cases and verticals. 
Having been an active contributor to FiRa since 2021

On May 19, Infineon Technologies AG announced that it will supply Rivian’s R2 platform with power modules for traction inverters. The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026. Additionally, Infineon will supply

On May 15, Infineon Technologies AG announced that the Science Based Targets initiative (SBTi) has approved the company's ambitious greenhouse gas emission reduction targets. The approval spans the company's own emissions (scope 1 and 2) as well as emissions along the supply chain (scope 3). 
The scope 1 and 2 goals

On May 12, Infineon Technologies AG presented the CoolGaN bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a common-drain design and a double-gate structure, it leverages Infineon's gate injection transistor (GIT) techno

Infineon Technologies AG and Visteon Corporation signed a memorandum of understanding (MoU) to advance the development of next-generation electric vehicle powertrains. They will collaborate and integrate power conversion devices based on Infineon semiconductors, with particular emphasis on wideband gap device technol

On May 8, Infineon Technologies AG announced that SGS-TÜV has certified Infineon’s industry-leading SEMPER NOR Flash memory to ASIL-D, the highest certification level for functional safety. Following a detailed analysis of product safety documentation under the ISO 26262:2018 standard, external experts have validated

On May 8, Infineon Technologies AG announced that it has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs. Infineon is expanding the site to meet customer demand, for example, for renewable energies, efficient data centers, and

On May 6, Infineon introduced a trench-based SiC superjunction (TSJ) technology concept to expand the technological capabilities of silicon carbide. The combination of trench and superjunction technology enables higher efficiency and more compact designs. Infineon will gradually expand its CoolSiC product portfolio,

On May 5, Infineon Technologies AG presented the new CoolSiC JFET product family. With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, CoolSiC JFETs enable reliable and efficient system performance in a wide range of industrial and automotive applications, such as a

On April 29, Infineon Technologies AG launched its new CoolSiC MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density. It offers a granular portfolio with typical R DS(on) values up to 60 mΩ at 25°C, making it suitable for a wide range of applications, including on-boar

On April 24, Infineon Technologies AG introduced the XENSIV TLE4960x magnetic switch family, to support functional safety in autonomous driving applications.
These switches are the only ASIL B-compliant devices currently available that can serve a broad range of automotive uses, such as window regulators, sunroof ac

On April 23, Infineon Technologies AG (Infineon) announced that it will present its latest semiconductor, software, and tooling solutions at PCIM Europe 2025 (5/6-8 Nuremberg).
Its solutions accelerate the transition to e-mobility by enabling efficient traction inverters, onboard chargers, DC-DC converters, and batte

On April 22, Infineon Technologies partnered with Marelli to advance automotive display technology using a new MEMS laser beam scanning (LBS) system. The technology, built on Infineon’s LBS technology, allows Marelli to create immersive cockpit experiences beyond traditional displays.
The Infineon MEMS LBS system is

On April 16, Infineon Technologies AG introduced EDT3 (Electric Drive Train, third generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. The new generation EDT3 achieves up to 20% lower total losses at high loads while maintaining efficiency at low lo