On March 3, Infineon Technologies AG presented the 28nm TEGRION SLI22, the latest innovation in automotive security controllers, designed to protect the future of connected systems. It can be deployed across a wide range of security-critical applications, including eSIM, V2X, and car access.
With its Common Criteria

On February 24, Infineon Technologies AG announced that it will present microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026. Infineon will demonstrate its comprehensive MCU portfolio through live demos.
For mobility, it will present demos targeting software-de

On February 16, Infineon Technologies AG announced its role in supporting the software-defined vehicle architecture of BMW’s Neue Klasse platform. The company will also showcase the BMW iX3, the first Neue Klasse model, at its Annual General Meeting.
The Neue Klasse platform features a scalable electronic architectur

On February 9, Infineon Technologies announced that CoolSiC MOSFETs (silicon carbide (SiC) power MOSFETs) have been adopted in the new bZ4X model from Toyota. Integrated into the on-board charger (OBC) and DC/DC converter, it leverages the material's advantages of low losses, high thermal resistance, and high voltage

On February 5, Infineon Technologies AG introduced the EiceDRIVER 1ED301xMC12I product family, a series of high-performance isolated gate driver ICs with opto-emulator input. The devices are pin-compatible with existing opto-emulators and optocouplers, offering high common-mode transient immunity (CMTI), a robust out

ams-OSRAM AG (ams OSRAM) has entered an agreement to sell its non-optical analog/mixed-signal sensor business for automotive, industrial, and medical applications to Infineon Technologies AG (Infineon) for EUR 570 million in cash.
The deal, expected to close in Q2/2026, is structured as a fabless asset transaction an

On February 4, Infineon Technologies completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to Malaysian Pacific Industries Berhad (MPI), a supplier of Infineon. Along with the transition, Infineon secures a long-term supply agreement with MPI. 
MPI is an investment holding company head

On January 12, TASKING, together with Infineon and iSOFT, launched a rapid development bundle for safety-critical automotive control systems based on the AURIX TC4x platform. The solution integrates industry-leading tools, high-performance MCUs, and complete automotive basic software to provide strong foundational su

On January 8, Infineon Technologies and HL Klemove signed a memorandum of understanding (MoU) to combine Infineon’s semiconductor expertise and system understanding with HL Klemove’s capabilities in advanced autonomous driving systems. They will jointly develop zone controller applications using Infineon’s microcontr

On January 2, Infineon Technologies AG and Flex announced that at CES 2026, they will launch a Zone Controller Development Kit, a modular design for Zone Control Units (ZCU) engineered to fast-track the development of SDV-ready E/E architectures. The new development kit follows a scalable approach and is based on reu

Shanghai Baolong Automotive Corporation (Baolong Auto) signed a memorandum of cooperation with Infineon in Shanghai for further strengthening of technological synergy and resource integration as well as collaboration on intelligent automotive solutions. Previously, the two companies partnered for products such as tir

On December 16, Infineon Technologies AG and Lenovo expanded their collaboration to accelerate the next level of autonomous driving. Lenovo’s autonomous driving domain controller units AD1 and AH1 will take advantage of Infineon’s AURIX family of microcontrollers to supportADAS, energy efficiency, and high-speed data

On December 10, Infineon Technologies AG launched new packages for the CoolSiC MOSFET 750 V G2 technology. It is now available in a range of packages, including Q-DPAK and D2PAK, offering a portfolio with typical RDS(on) values up to 60 mΩ at 25°C.
 The portfolio extension includes products for various applications i

On December 4, Infineon Technologies AG announced that it will supply customized silicon carbide (SiC) power modules to Electreon, a leading provider of wireless charging solutions for electric vehicles (EVs), for its dynamic in-road charging technology. 
Infineon's customized SiC modules are at the heart of the appl

On November 13, Infineon Technologies AG presented the PSOC 4 HVPA-SPM 1.0, an advanced microcontroller designed for high-voltage Li-ion battery management in electric vehicles (xEVs). 
The microcontroller combines precision, safety, and programmability, while supporting zonal architectures and the transition to Soft

On November 6, Infineon Technologies AG announced that it is leading a research project called Mannheim-CeCaS (Central Car Server) with its partners. The project was supported by the German Federal Ministry of Research, Technology, and Space (BMFTR), with EUR 88.2 million. The demonstrator was successfully presented

On October 30, Infineon Technologies AG announced that it has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria. Developed in collaboration with Silicon Austria Labs (SAL), the lab focuses on advancing UWB technology, exploring innovative use cases, and delivering real-world applications f

On October 20, Infineon Technologies AG announced the expansion of its XENSIV magnetic current sensor lineup with the introduction of the new TLE4971 and TLI4971 sensors, available in a 300-mil package. These sensors deliver greater accuracy with a total error of just 0.7% over temperature and lifetime, making them i

On October 15, Infineon announced the launch of its CoolGaN Automotive Transistor 100 V G1 family for production and began supplying samples of its pre-production range qualified for automotive use under AEC-Q101 standards. The lineup includes high-voltage CoolGaN Automotive Transistors and bidirectional switches.
Ga

On October 15, imec announced that GlobalFoundries has joined imec’s Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon, Silicon Box, STATS ChipPAC, and TIER IV have also committed to join ACP. Chiplet architectures offer a scalable, flexible, and cost-effective alterna