On September 25, Infineon Technologies AG and ROHM Co., Ltd. signed a memorandum of understanding (MoU) to collaborate on packages for silicon carbide (SiC) power semiconductors. The partners aim to enable each other as second sources of selected packages for SiC power devices.
In the future, customers will be able t

On September 18, 2025, Infineon Technologies AG announced it will transfer its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to long-time supplier Malaysian Pacific Industries Berhad (MPI). 
The Bangkok site, which serves automotive, connectivity, and IoT packages, will retain all current production emp

On September 16, Infineon Technologies AG expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water

On September 5, Rightware announced that Kanzi Micro achieved technical certification through Infineon Technologies’ HMI Tool Certification Program. It confirms Kanzi Micro’s seamless integration with Infineon’s TRAVEO T2G series microcontrollers, enabling high-performance, memory-efficient HMI solutions for automoti

On September 9, Infineon Technologies AG and Lingji Innovation Technology Co., Ltd., a subsidiary of Ninebot, signed a memorandum of understanding (MoU) to further drive gallium nitride (GaN) technology in light electric vehicles (LEV). Infineon provides GaN products supporting Lingji to develop high-performance elec

On September 4, Infineon Technologies AG launched a comprehensive software portfolio designed specifically for the latest AURIX TC4x microcontroller (MCU) family. It enables automotive safety applications. The portfolio includes the production-grade MC-ISAR AUTOSAR MCAL, safety software (SafeTlib), complex device dri

Reported on September 2, 2025, ARAYA – The Eastern Gateway is emerging as Thailand’s first fully integrated smart industrial estate. The 4,600-rai (736-hectare) project in Samut Prakan has welcomed its first anchor tenants, including Infineon Technologies Manufacturing (Thailand), which signed a land purchase agreeme

On September 1, Infineon Technologies AG announced that it has expanded its OptiMOS 6 portfolio by introducing the Automotive 150 V MOSFET family. These new devices are available in three advanced package options: TOLL, TOLG, and TOLT. It offers two different drain-source resistance levels across all device variants.

On August 15, Gapwaves announced that it is initiating a collaboration with Infineon Technologies for the initial development of Gapwaves Multi-Layer Waveguide (MLW) antennas. The order value amounts to SEK 600 thousand, and the antennas are expected to be delivered during Q3 of 2-25. 
The antenna will be based on Ga

On August 14, 2025, Infineon Technologies AG completed the acquisition of Marvell Technology, Inc’s Automotive Ethernet business. The acquisition will improve Infineon’s expertise and market positioning for software-defined vehicles as well as microcontrollers for automotive applications. The acquisition also provide

On August 1, Infineon Technologies AG announced that the District Court of Munich, Germany, ruled in favor of Infineon in a first-instance patent infringement case concerning gallium nitride (GaN) technology between Infineon and Innoscience. The case centers on the unauthorized use of Infineon’s patented GaN technolo

On July 23, Infineon Technologies AG announced a partnership with UL Solutions to accelerate the implementation of ISO 26262 functional safety compliance for Infineon’s automotive customers. ISO 26262 provides a process for managing and reducing safety risks associated with the integration of electrical and electroni

On July 11, Infineon presented the third generation of the XENSIV 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functi

On July 2, Infineon Technologies AG announced that its scalable GaN manufacturing on 300-millimeter wafers is on track, with first samples available for customers as of the fourth quarter of 2025. The fully scaled-up 300-millimeter GaN manufacturing will allow it to deliver the highest value to customers while moving

On June 30, Infineon Technologies AG completed the sale of its 200 mm fab in Austin, Texas. As announced in February 2025, SkyWater Technology will assume operations with current employees and further develop the site to support multiple customers. 
As such, SkyWater and Infineon have also entered into a long-term su

On June 25, IDEMIA Secure Transactions, a global leader in connectivity solutions, partnered with Infineon Technologies AG, a leading semiconductor company, to address the challenges of next-generation car access.
The partnership supports automotive safety, quality, and cybersecurity, by combining Infineon’s electro

On June 18, Tata Elxsi and Infineon Technologies signed a memorandum of understanding (MoU) to jointly develop application-ready electric vehicle (EV) solutions. The collaboration aims to deliver ready-to-deploy EV systems based on Infineon technologies, targeting key mobility segments including two-wheelers, three-w

On June 12, Infineon Technologies AG expanded its PSOC 4 HV microcontroller (MCU) platform by introducing the PSOC 4 HVMS product family. Designed for space-constrained sensing and actuator applications, the new MCUs integrate high-voltage functionality and advanced analog sensing.
It supports a broad range of automo

On June 10, Infineon Technologies AG launched the XENSIV TLE4802SC16-S0000, an inductive sensor designed to enhance performance in automotive chassis applications. The sensor enables high-precision torque and angle measurements with robust stray field robustness, supporting digital output via SENT or SPC protocols. 

On June 5, Infineon Technologies collaborated with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide a fully integrated, real-time development and test environment for key elements of xEV powertrain systems. 
The solution enables automotive engineers using Infineon’s AURIX