On October 27, Infineon Technologies AG introduced a high-voltage battery management system (BMS) reference design that enables computationally intensive battery models to run directly on the Battery Management Unit (BMU). The solution integrates an AURIX TC4x microcontroller with its parallel processing unit (PPU).

On November 4, Infineon Technologies AG introduced a new MCU platform within its AURIX series. AURIX RC1 is its first MCU platform that leverages the benefits of RISC-V. Infineon will present it at the electronica trade fair in Germany. It will provide samples of AURIX RC1 in the first half of 2027.
AURIX RC1 integra

On October 27, Infineon Technologies AG introduced ENDOPACK, a new brand for advanced chip-embedding solutions. ENDOPACK Cell is the industry's first automotive-qualified, high-voltage chip-embedding solution designed for PCB integration. ENDOPACK CELL is ready for mass production. Vehicles powered by ENDOPACK Cell a

On October 27, Infineon Technologies AG introduced new OptiMOS 7 automotive MOSFETs. By combining OptiMOS 7 semiconductor technology with a clip-based interconnection concept, Infineon has achieved ultra-low on-resistance in the proven 10 × 12 mm² TOLL footprint.
The new 40 V, 80 V, and 100 V MOSFETs achieve RDS(on)

On November 2, Infineon Technologies announced that it is working with Qualcomm Technologies to accelerate the development and deployment of central car computers in software-defined vehicles (SDVs). 
The companies have signed a technology agreement to have a microcontroller-based subsystem for Qualcomm Technologies’

On October 27, Infineon Technologies AG announced that it is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe. As part of the project, Infineon will invest around EUR 1.1 billion in its existing cleanroo

On October 27, Infineon Technologies AG introduced LinearFET, a new MOSFET technology designed to simplify the development of next-generation solid-state power distribution systems for electric and software-defined vehicles.
The technology integrates current sharing, inrush current control, and short-circuit protect

Infineon Technologies AG (Infineon) announced that it has jointly established an Innovation Application Center in Hefei with R&D teams from CARIAD SE (CARIAD) and Volkswagen Group (China) Technology Co., Ltd. (VCTC), both part of Volkswagen Group China. The parties signed the agreement and officially unveiled the cen

On October 15, Wolfspeed, a leader in silicon carbide technology, and Infineon Technologies announced the expansion of their existing long-term silicon carbide (SiC) wafer supply agreement by adding 200 mm silicon carbide wafers to the existing 150 mm supply agreement.
The agreement extension builds on a supply relat

On October 1, 2026, Infineon Technologies officially opened its new backend semiconductor production site in Samut Prakan, Thailand. 
The greenfield facility currently has a workforce of around 350 employees. Infineon expects staffing to increase to about 1,000 during the ramp-up of Module A. The site has been config

On September 28, Infineon Technologies AG presented the XENSIV TLx49012, a family of four digital angle sensors based on Hall technology, designed for demanding motor control applications in automotive and industrial markets.
It has a unique system self-calibration function that eliminates the need for customer-devel

Announced on September 24, 2026, Thailand’s BOI said investment applications in the semiconductor and advanced electronics sectors totaled 879 projects worth approximately USD 27.2 billion (THB 909 billion) between 2023 and the first half of 2026.
The investments span a broad range of activities, including semiconduc

Luxshare Automotive (Luxshare Precision Industry Co., Ltd.) announced that it had held a signing and unveiling ceremony with Infineon Technologies AG (Infineon) for a joint Innovation Application Center. Through the center, the two companies will collaborate on automotive electronics applications, reference designs a

On September 16, Infineon Technologies AG entered into a definitive agreement under which Winbond Electronics Corporation will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at USD 1.12 billion on a cash- and debt-free basis. The business comprises a portfolio of NOR Flash memory as

On September 8, Infineon Technologies introduced the OPTIREG PMIC TLE9744QK, a fully integrated Power Management IC (PMIC) specifically designed for high-voltage traction inverter applications in electric and hybrid vehicles. It consolidates complete power-supply functions, resolver excitation, and a dedicated safety

Vector Informatik GmbH (Vector) has launched two new DRIVECORE bundles with Infineon Technologies AG (Infineon), Intron, and TASKING to accelerate evaluation and prototyping on the Infineon AURIX TC4xx platform.
The DRIVECORE TC4 IT2 combines AURIX TC4xx, Intron OpenECU, Vector software components, and TASKING tools,

On August 19, Eatron Technologies announced that the ZENBMS (Zonal-End Node Battery Management System) project has been selected as one of ten automotive projects to receive grant funding through the UK Government’s latest DRIVE35 Demonstrate competition. The 12-month project brings together Eatron, Infineon, and WMG

On August 6, Infineon Technologies announced a partnership with MediaTek to enable advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash for use in its Dimensity Auto Cockpit Platform C-X1. This turns the Infineon device into an approved and easil

On July 29, Infineon Technologies AG presented the SPOC Wire Guard BTS80009 SWPx 1ES, a 12 V automotive eFuse with SPI interface. It combines a protected high-side switch with integrated I²t wire protection, software configurability, and advanced diagnosis. It is designed for new E/E architectures that support softwa

On July 8, Infineon Technologies AG announced that it will supply CoolSiC MOSFETs 1200 V and matching dual-channel EiceDRIVER 2EDB9259Y gate drivers to ADVANTICS for its new line of liquid-cooled power converters. The solutions enhance efficiency, power density, and reliability in applications such as megawatt chargi