On May 19, Infineon Technologies AG announced that it will supply Rivian’s R2 platform with power modules for traction inverters. The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026. Additionally, Infineon will supply

On May 15, Infineon Technologies AG announced that the Science Based Targets initiative (SBTi) has approved the company's ambitious greenhouse gas emission reduction targets. The approval spans the company's own emissions (scope 1 and 2) as well as emissions along the supply chain (scope 3). 
The scope 1 and 2 goals

On May 12, Infineon Technologies AG presented the CoolGaN bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a common-drain design and a double-gate structure, it leverages Infineon's gate injection transistor (GIT) techno

Infineon Technologies AG and Visteon Corporation signed a memorandum of understanding (MoU) to advance the development of next-generation electric vehicle powertrains. They will collaborate and integrate power conversion devices based on Infineon semiconductors, with particular emphasis on wideband gap device technol

On May 8, Infineon Technologies AG announced that SGS-TÜV has certified Infineon’s industry-leading SEMPER NOR Flash memory to ASIL-D, the highest certification level for functional safety. Following a detailed analysis of product safety documentation under the ISO 26262:2018 standard, external experts have validated

On May 8, Infineon Technologies AG announced that it has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs. Infineon is expanding the site to meet customer demand, for example, for renewable energies, efficient data centers, and

On May 6, Infineon introduced a trench-based SiC superjunction (TSJ) technology concept to expand the technological capabilities of silicon carbide. The combination of trench and superjunction technology enables higher efficiency and more compact designs. Infineon will gradually expand its CoolSiC product portfolio,

On May 5, Infineon Technologies AG presented the new CoolSiC JFET product family. With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, CoolSiC JFETs enable reliable and efficient system performance in a wide range of industrial and automotive applications, such as a

On April 29, Infineon Technologies AG launched its new CoolSiC MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density. It offers a granular portfolio with typical R DS(on) values up to 60 mΩ at 25°C, making it suitable for a wide range of applications, including on-boar

On April 24, Infineon Technologies AG introduced the XENSIV TLE4960x magnetic switch family, to support functional safety in autonomous driving applications.
These switches are the only ASIL B-compliant devices currently available that can serve a broad range of automotive uses, such as window regulators, sunroof ac

On April 23, Infineon Technologies AG (Infineon) announced that it will present its latest semiconductor, software, and tooling solutions at PCIM Europe 2025 (5/6-8 Nuremberg).
Its solutions accelerate the transition to e-mobility by enabling efficient traction inverters, onboard chargers, DC-DC converters, and batte

On April 22, Infineon Technologies partnered with Marelli to advance automotive display technology using a new MEMS laser beam scanning (LBS) system. The technology, built on Infineon’s LBS technology, allows Marelli to create immersive cockpit experiences beyond traditional displays.
The Infineon MEMS LBS system is

On April 16, Infineon Technologies AG introduced EDT3 (Electric Drive Train, third generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. The new generation EDT3 achieves up to 20% lower total losses at high loads while maintaining efficiency at low lo

On April 7, Infineon Technologies AG announced the acquisition of Marvell Technology’s Automotive Ethernet business for a purchase price of USD 2.5 billion in cash. The transaction is subject to regulatory approvals. 
The planned investment will strengthen Infineon’s already strong footprint in the U.S. Marvell’s lea

Infineon Technologies AG launched the Power PROFET + 24/48V switch family. It is housed in a compact, TO leadless package and includes two high-side switch variants: the BTH50030-1LUA with an R DS(ON) of 3.0 mΩ and the BTH50015-1LUA with an R DS(ON) of 1.5 mΩ, which enables minimal power losses in high-current applic

On March 11, Green Hills Software announced its collaboration with Infineon Technologies and Cetitec in creating an I/O aggregator gateway for vehicle communication networks based on the TRAVEO T2G MCU from Infineon. The safety-certified µ-velOSity RTOS with the MULTI integrated development environment (IDE) from Gre

On March 7, Infineon Technologies AG presented Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO, and PSOC that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready to use under a three-month

On March 6, CDIL Semiconductors, an Indian semiconductor manufacturer, and Infineon Technologies Asia Pacific Pte Ltd., a global semiconductor provider, signed a memorandum of understanding (MoU). Infineon will supply CDIL with bare die wafers, which CDIL will package into semiconductor products for Indian customers.

On March 6, Infineon Technologies Asia Pacific Pte Ltd and the Automotive Research Association of India (ARAI) signed a memorandum of understanding (MoU) to collaborate on developing advanced semiconductor solutions for the Indian automotive sector. The partnership will focus on developing EV inverters and vehicle co