On August 25, Resonac Holdings Corporation resolved to execute a partial spin-off of Crasus Chemical Inc., its wholly owned subsidiary operating the petrochemical business, effective October 1. The execution of the spin-off is subject to approval for the listing of Crasus Chemical’s common shares being obtained from
Aurelius Investment Lux Sixteen S.à r.l. (AURELIUS) has completed the acquisition of FIAMM Energy Technology S.p.A. (FIAMM) from Resonac Corporation (Resonac), following the completion of all post-signing verifications and regulatory approvals.
As part of the deal, AURELIUS has taken over all employees and business a
FIAMM Energy Technology S.p.A. (FET) (formerly known as FIAMM S.p.A) announced that its parent company, Resonac Corporation (Resonac), has entered into a definitive agreement to sell FET to Aurelius Investment Lux Sixteen S.à r.l. (AURELIUS).
Subject to customary closing conditions, Resonac will transfer all shares o
On September 24, Resonac Corporation (formerly Showa Denko K.K.) and Soitec signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other int
Resonac Corporation (Resonac) announced that it has commenced constructing a manufacturing building for silicon carbide (SiC) wafers (substrates and epitaxial) at its Yamagata Plant in Japan. The building will be 5,832 square meters and is scheduled to be completed in the third quarter of 2025. (From a press release
Resonac Corporation (Resonac) announced that it has developed a high-performance brake pad which utilizes non-asbestos organic (NAO) material for electronic brake systems for electric vehicles (EV). The brake pad offers high-braking performance and wear resistance for use in EVs, which have heavier vehicle weights co
Resonac Corporation (Resonac) announced that it has commenced preparations to establish a new Packaging Solution Center (PSC), a research and development center for advanced semiconductor packaging material technologies, in Silicon Valley, California, USA. The company is currently investigating and preparing the equi
Resonac Corporation (Resonac) announced that it will begin full-scale operation of Power Module Integration Center (PMiC) to strengthen development of power semiconductors and power modules. A power module is a product that packages power semiconductors, which is indispensable for electrified vehicles. On the other h
Showa Denko Materials Co., Ltd. (Showa Denko Materials) announced that it has concluded a share transfer agreement with Certina Automotive Products AG and its related company Certina Holding AG (Certina Group), a German company, for the transfer of Isolite GmbH (Isolite) which manufactures and sells thermal insulatio
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