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Resonac, Japan and Soitec, France to develop 200mm SmartSiC SiC wafers
On September 24, Resonac Corporation (formerly Showa Denko K.K.) and Soitec signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other int....
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