Cadence, Samsung Foundry join on SoC, 3D-IC, chiplets for AI automotive, data centers
On June 16, California-based Cadence announced an expanded collaboration with Samsung Foundry, focusing on accelerating SoC, 3D-IC, and chiplet design for AI data centers, automotive (including ADAS), and RF connectivity.
Highlights include:
• A new multi-year IP agreement to expand Cadence’s memory and interface