Osram AG Business Report FY ended Sep. 2012

Business Highlights

Financial Overview

(in million euros)
  FY ended Sept. 30, 2012 FY ended Sept. 30, 2011 Rate of Change (%) Factors
Revenue 5,400 5,000 8.0 -

Business overview

-In Sept. 2011, the parent company Siemens is firmly holding to its plans to list its subsidiary Osram. However, Osram is to be listed at a later date. It was previously planned for the fall of 2011. Preparations are on track and will be continued. The parent company remains committed to retaining a minority stake in Osram AG as an anchor shareholder over the long term.
-In Jun. 2012, Siemens classifies Osram again as held for disposal and discontinued oeperations in fiscal year ends Sept. 2013.


-In July 2010, "JOULE LED" module for the automobile has been accepted for fog lighting applications of a Japanese vehicle for the first time. It will be installed in the 2011 Mitsubishi "RVR" compact crossover vehicle.

-In 2010, in the new version of the Audi "A8" light emitting diodes from OSRAM Opto Semiconductors are responsible for the dipped and full beams as well as for other specific lighting functions.


-The expenditure for research and development is at approximately 5.5% of turnover.

Product Development

Organic light-emitting diodes (OLEDs)
-The Company has taken a step toward organic light-emitting diodes (OLEDs) that are suitable for automotive applications. The company has developed an OLED that proved capable of withstanding temperatures of up to 85 degrees Celsius for several hundred hours in a laboratory long-term test. The Company has already come up with specific designs in collaboration with UnternehmerTUM at the Technische Universitat Munchen. (From a press release on June 27, 2012)

Infrared chip

The infrared chip prototype has achieved a new record with a wall plug efficiency of up to 72 percent and an external quantum efficiency of 67 percent. The wavelength of the chip prototype of 850 nanometers is perfect for infrared illumination, particularly for surveillance tasks. There are also potential safety applications in the automotive sector, such as pre-crash sensors and illumination sources for night vision systems. The new chip is expected to go into series production between the start and middle of next year. (From a press release on December 5, 2012)

LED Headlight OSLON Series
-In Sept. 2011, OSRAM Opto Semiconductors developed the OSLON Black Flat. OSLON Black Flat is the latest addition to the OSLON Black Series and is equipped with a ceramic converter and a QFN package (Quad Flat No Leads). With a typical thermal resistance of 5K/W is it 20% better than the other member of the Black Series. Market launch of this application is scheduled for the third quarter of 2012. (From a press release on September 22, 2011)

LED Headlight OSTAR series
-In Sept. 2011, OSRAM Opto Semiconductors developed the OSRAM OSTAR Headlamp Pro. The OSRAM OSTAR Headlamp Pro is able to meet a wide range of requirements in terms of output and adaptability to ambient conditions. It offers a more uniform light pattern, better thermal stability and greater brightness than its predecessor. Market launch of this application is scheduled for the third quarter of 2012. (From a press release on September 22, 2011)

Investment Activities

Investment Outside Germany

-In 2012, the company inaugurated a new halogen production line at its Eichstatt location with construction of a second line already underway. The Company also developed a future concept at its Augsburg site. Key aspects of this concept are the development of the location into a center of excellence for manufacturing processes of LED-based products or the expansion of the fluorescent lamp production.

Investment Outside Germany

-In 2012, the Company will invest a low three-digit million euro figure over the coming years in its LED assembly plant in the Chinese province of Jiangsu.

-In May 2012, the Company announced that it will set up a new assembly plant in Wuxi, Jiangsu Province, China to augment the capacity of its LED chip plants in Regensburg, Germany and Penang, Malaysia. LED chips will be packaged in housings at the new facility starting in late 2013; with the Regensburg in Germany and Penang in Malaysia (frontend) plants exclusively continuing to make the actual LED chips. It will be able to accommodate up to 1,600 employees when fully operational. (From a press release on May 25, 2012)