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Denso to collaborate with USJC in onboard power semiconductors to produce IGBTs in 300mm wafer fab
Denso Corporation (Denso) announced that it has agreed to collaborate on the production of power semiconductors in a 300mm wafer fab with United Semiconductor Japan Co., Ltd. (USJC). USCJ is a Japanese subsidiary of United Microelectronics Corporation (UMC), a major Taiwanese semiconductor fabrication company. Denso ....
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