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NXP Semiconductors N.V.
thstand the challenging automotive environment; a key to unleashing the full capabilities and benefits of SiC MOSFETs. To attain optimal performance, the power module is paired with NXP’s GD3160 high-voltage, isolated gate driver which enables fast and reliable switching and fault protection. The 1200V RoadPak half-bridge SiC module is available now in 580A, 780A, and 980A options. (From a press release on March 21, 2022) NXP Semiconductors N.V...
Major Suppliers Updated at: 2025/07/04
Bosch (Robert Bosch GmbH)
: Automotive traction inverters, system power supplies, airbags, other chips various inertial sensors, acceleration sensors, pressure sensors, and SiC power modules for traction inverters. The company's next-generation SiC power modules, the CSL (Compact SiC line) and LSL (Lead Frame SiC line), use 1200V, 9mΩ second-generation SiC to achieve higher power density and efficiency. Improved body diodes have been used to increase switching speed. The...
Major Suppliers Updated at: 2025/05/29
MAHLE GmbH
rt, Germany, specifically to serve its European clients. The new 1,300 sqm facility supports all aspects from initial prototyping through to small-scale production. It covers applications from small e-bikes to large electric trucks. The center can test low- and high-voltage packs up to a maximum of 1200V, 2000A, or 550kW. It also contains 2 climatic chambers that operate from 40°C to over 90°C for a full scope of aging, electrical, and thermal ...
Major Suppliers Updated at: 2025/05/15
Hella GmbH & Co. KGaA (FORVIA HELLA)
Hella GmbH & Co. KGaA (FORVIA HELLA) Germany Bernard Schäferbarthold (CEO) -As part of the FORVIA Group, the Company develops and manufactures components and systems for automotive lighting and electronics. In addition, it also produces complete vehicle modules.-The Company is organized into three business groups: Lighting: Focused on headlamps, combination rear lamps, body lighting and interior lighting systems. Electronics: Focused on automat...
Major Suppliers Updated at: 2025/05/15
Mitsubishi Electric Corporation
pace of 46,500 square meters and conduct wafer processing for power semiconductors from November 2021. The company will invest approximately JPY 20 billion in total. (From a press release dated June 11, 2020) Mitsubishi Electric Corporation (Mitsubishi Electric) announced the launch of its N-series 1200V SiC MOSFET and will start sample shipment of six product types in July 2020. By utilizing this newly developed SiC MOSFET, which adopts junction...
Major Suppliers Updated at: 2024/12/24
Toyoda Gosei Co., Ltd.
Toyoda Gosei Co., Ltd. Japan Katsumi Saito (President, CEO) -A leader in the area of rubber and plastics polymer and LED products. -Segments among the Automotive Parts Business: (Breakdown of revenues for FY ended March 2024) Interior and Exterior Parts: 34% Safety System Products: 38% Functional Parts: 17% Weatherstrips: 11% -Sales to the Toyota Group accounted for 65.9% of the Company's overall revenue (FY ended March 2024). -Listed on...
Major Suppliers Updated at: 2024/07/22