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Henkel, Germany, launches next-generation thermal gap filler with 6.5W/m∙K conductivity
On July 21, Henkel Adhesive Technologies launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity. This new material enables more effective heat transfer in critical systems. Bergquist Gap Filler TGF 6500LVO extends the range to meet critical thermal managemen....
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