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STMicroelectronics, Switzerland, developing new Panel-Level Packaging (PLP) technology
On September 17, STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology....
PLP is an advanced, automated chip packaging and test process technology....
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