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Cadence and TSMC advance AI and 3D-IC chip design
On April 24, Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cad....
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