login
Cadence and TSMC advance AI and 3D-IC chip design
On April 24, Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cad....
This news is for paid members only.
If you register as a free member, you can read the rest of this article for a limited time.
In addition, you can also enjoy the following content for free:
- Market & Tech Reports
- Global automotive production/sales
- Launch schedule forecasts
- Latest news on the automotive industry
- Market share and supply information of 300 automotive parts (Who Supplies Whom)
Japan
+81-3-4241-3907
USA
Mexico
Germany
China (Shanghai)
Thailand
India