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CONTENTS
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About the Information Platform
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Renesas Electronics Corporation

Summary

Covers Renesas Electronics exhibition participation, products, technologies, and major customers. Offers exclusive information available only on MarkLines to support research and analysis in the automotive industry.

Company Profile

■URL

https://www.renesas.com/en

■Address

Toyosu Foresia, 3-2-24, Toyosu Koto-ku, Tokyo 135-0061, Japan

Business Overview

-The Company is a leading Japanese semiconductor manufacturer of automotive micro-computers. 

-In 2002, NEC's semiconductor business, excluding the general-purpose DRAM business, was spun off as NEC Electronics, which merged with Renesas Technology, the semiconductor business of Hitachi, Ltd. and Mitsubishi Electric Corporation, and changed its name to Renesas Electronics in 2010.

-The company's group consists of the following two businesses

Business Contents Details
Automotive business Automotive control segment Semiconductors that control automotive engines and bodies
Micro-controllers, SoCs, analog semiconductors, and power semiconductors
Automotive information segment Semiconductors for interior and exterior sensoring systems and in-vehicle information devices
Micro-controllers, SoCs, analog semiconductors, and power semiconductors
Business for Industry, Infrastructure and IoT Industry Micro-controllers, SoCs, analog semiconductors, and power semiconductors
Infrastructure
IoT

　

Featured report

  

Business Overview of Japanese Suppliers in 2024

 Featured report
 

Shareholders

-Listed on the Prime Market of the Tokyo Stock Exchange  (As of Dec. 31, 2025)
Shareholder Investment Ratio (%)
The Master Trust Bank of Japan, Ltd. (Trust Account) 16.82
Custody Bank of Japan, Ltd. (Trust Account) 6.02
Toyota Motor Corporation 4.13
JP MORGAN CHASE BANK 385864 (Standing proxy Mizuho Bank, Ltd.) 3.37
STATE STREET BANK AND TRUST COMPANY 505001 (Standing proxy Mizuho Bank, Ltd.) 3.35
THE BANK OF NEW YORK MELLON 140040 (Standing proxy Mizuho Bank, Ltd.) 2.98
THE CHASE MANHATTAN BANK, N.A. LONDONSECS LENDING OMNIBUS ACCOUNT (Standing proxy Mizuho Bank, Ltd.) 2.41
STATE STREET BANK AND TRUST COMPANY 505103 (Standing proxy Mizuho Bank, Ltd.) 1.67
BNY GCM CLIENT ACCOUNT JPRD AC ISG (FE-AC)(Standing proxy MUFG Bank, Ltd.) 1.62
GSESL RENESAS CLIENT ASSET ACCOUNT (Standing proxy SMBC Nikko Securities Inc.) 1.41
Total 43.81
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Products

Automotive Products
RL78 Low Power 16-bit MCUs for Automotive

Automotive Photocouplers

RH850 Automotive Microcontrollers (MCUs)

R-Car Automotive System-on-Chips (SoCs)

Automotive Clock Generators, Buffers, Oscillators, AEC-Q100, AEC-Q200

Automotive Sensors
-LiDAR Sensors
-Automotive Ambient Light Sensors
-Automotive Impedance Sensors
-Automotive Sensor Signal Conditioners (SSC/AFE)
-Automotive Inductive Position Sensors Product Selector

Automotive Battery Management
-Automotive Cell Balancing and Safety

Automotive Power Devices
-Automotive Power Diodes
-Automotive IGBT
-Protected & Intelligent Power Devices
-Automotive Thermal Shut Down Functioned MOSFETs
-Automotive Power MOSFETs

Automotive Power Management
-MCU PMIC
-Automotive Switching Regulators
-Motor and Solenoid Drivers
-Linear Regulators
-SoC PMIC

Automotive Video & Display
-Automotive LED Backlight Drivers
-Automotive Display Processors
-Automotive Video Decoders
-Automotive Programmable Gamma

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History

Nov. 2002 NEC Electronics Corporation was established in Kawasaki, Kanagawa Prefecture. It was formed as a wholly owned subsidiary of NEC Corporation, which spun off its semiconductor operations except its general-purpose DRAM business.
April 2003 Renesas Technology Corporation was established by Hitachi, Ltd., which owned a 55% stake, and Mitsubishi Electric Corporation, which owned a 45% stake.
July 2003 NEC Electronics was listed on the first section of the Tokyo Stock Exchange.
April 2010 Renesas Electronics was established through the integration of NEC Electronics Corporation and Renesas Technology Corporation.
Sep. 2013 The Company issued third-party shares to be bought by Innovative Network Corporation of Japan, Toyota Motor Corporation, Nissan Motor Co., Ltd., Keihin Corporation, Denso Corporation, Canon Inc., Nikon Corporation, Panasonic Corporation, and Yasukawa Electric Corporation.
Feb. 2017 Acquired all stock shares in Intersil Corporation based in the USA, turning it into a subsidiary.xxx
Jan. 2018 Intersil Corporation absorbed the business operations of Renesas Electronics America Inc., adopting the company name Renesas Electronics America Inc.
Oct. 2018 Transferred the operations of the Kochi Plant of Renesas Semiconductor Manufacturing to Marusan Sangyo Co., Ltd.
Jan. 2019 Absorbed the operations of Renesas Semiconductor Parts and Test Solutions through a simple merger transaction.
Mar. 2019 Acquired all shares of Integrated Device Technology, Inc.
Jan. 2020 IDT merges with Renesas Electronics America, Inc. and changes its name to Renesas Electronics America, Inc.
Aug. 2021 Acquired and consolidated Dialog Semiconductor Plc.
Dec. 2021 Acquired and consolidated Celeno Communications Inc.
Apr. 2022 Moved to the Prime Market of the Tokyo Stock Exchange due to a review of the Tokyo Stock Exchange's market classification.
Jul. 2022 Acquired all shares of Reality Analytics, Inc. and made it a subsidiary.
Oct. 2022 Acquired all shares of Steradian Semiconductors Private Limited and made it a subsidiary.
Jun. 2023 Acquired all shares of Panthronics AG of Austria and made it a subsidiary
Jun. 2024 Acquired all shares of Transphorm, Inc. and made it a subsidiary
Aug. 2024 Acquired all shares of Altium Limited and made it a subsidiary

Supplemental Information 1

>>>Business Report FY ended Dec. 2022
>>>Business Report FY ended Dec. 2023
>>>Business Report FY ended Dec. 2024

>>>IR Information on Renesas Electronics

Note: A figure in brackets ( ) indicates a loss

×
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
AUTOMOTIVE WORLD / Smart Energy Week September 2026
R-Car Gen5 FUSION Proof of Concept (PoC): Multi-Domain Platform Enabling SDVs, Central Compute Platform
・The 3nm-process automotive multi-domain System-on-a-Chip (SoC) “R-Car Gen5” enables a central ECU for the SDV era.
　-Integrates ADAS, IVI, and gateway functions while achieving low power consumption.
・Up to 400 TOPS (Sparse) AI performance and hardware partitioning (Freedom from Interference (FFI)) enable both high-performance processing and safety.
　-Enables applications with different safety levels to be run in isolation and simultaneously on a single SoC.
・The ROX (R-Car Open Access) platform provides an open and highly scalable development environment.
　-Utilizes the virtual development environment provided by Renesas Electronics to enable parallel hardware and software development. Development by multiple partners can be conducted in parallel, enabling a shorter launch timeline.
CES 2026
R-Car X5H multi-domain SoC demo
5th-generation system that is the first multi-domain automotive SoC manufactured with advanced 3 nm process technology; Representing the high-end (H) version, the system is capable of 400 TOPS of AI performance and 4 TFLOPS equivalent of GPU power; Has a UCIE interface to offer both vertical and horizontal scalability; From right to left, demonstration shows Linux system, 7 camera ADAS perception, 3D instrument cluster, DMS, Unity game engine display, and Android 15 system on the 8k x 2k bottom display; also has an integrated vision language model
CES 2026
Cross-domain fusion demonstration
Demonstration runs on 4th-gen SoC; highlights use of zone controllers across multiple domains including ADAS, infotainment, sensor suite, 3D cluster; Also features use of microcontrollers
CES 2026
Cross-domain fusion demonstration
Demonstration runs on 4th-gen SoC; highlights use of zone controllers across multiple domains including ADAS, infotainment, sensor suite, 3D cluster; Also features use of microcontrollers
CES 2026
Ultra low power sensing system demonstration
Demonstration runs on 4th-gen SoC; Demonstration highlights an application for vehicle sentry modes, such that power consumption is minimized while the car is parked with the capability to still detect people nearby
CES 2026
RoX ADAS platform demonstration
Runs on 4th-gen SoC V4M designed for entry-level markets; Demonstration shows AI application providing a full 360-degree birds-eye view map around a vehicle; Highlights Company's software capabilities with AI software toolchains and AXELL Flow software framework
CES 2026
R-Car ecosystem development display
Company works with customers to develop software within the Company's software development platform; Display shows modified 5th-gen device with edge compute capabilities allowing the customer to make applications in the cloud and then transfer them to the physical hardware; Application is for autonomous vehicle simulation system
CES 2026
Additional R-Car ecosystem development displays
Display highlights Company's support to customer in porting software from 4th-gen device to 5th-gen device; Left application shows perception stack with front camera system running object detection; Right application shows lidar-based perception stack for HD mapping
CES 2026
RH850 microcontroller demonstration
Microcontroller used in demonstration can support a hypervisor; Demonstration shows two virtual machines, one running on three cores as a safety-critical system and the other running on one core for body control (door) and comfort features;
CES 2026
Reference ECU with next-gen RH850 microcontroller
CES 2026
Power management demonstration display
Display highlights Company's capabilities in power management; Demonstration system comprised of memory, microcontroller, motor controller, power supply, e-Fuses among other components connected to a taillight; Customers have flexibility of satisfying various ASIL levels that can be configured to their specific needs; In addition, the e-Fuse can be configured through software as per customer requirements with features such as idle mode, capacitive charging, or overcurrent protection; The system enables the e-Fuse to manage the load while the microcontroller is in operation
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
PCIM Expo & Conference 2025
I2T EFUSE & WIRE Protection in Power Distribution
eFUse control safe power supply and safe isolation
Demostration features: Fuse emulation, Fault injection w/ Fusa features, Curent sensing and Pulsed Switching for Capacitive load
Can be configured and adapted to fit a variety of cables, further reducing wiring harness weight with greatly improved fuse accuracy
Software-based electronic fuses program the MCU to activate from current sensing feedback to the intelligent power device (IPD) MCU
Semicon India 2024 / Electronica India 2024
Digital instrument cluster
This connected cockpit reference provides all the necessary modules and peripherals for complete cockpit application development. The main brain of the reference solution is the R-Car M3e-2G system-on-chip (SoC) powered by a 2xCA57, 4xCA53 and 1xCR7 core.
This custom board comes with wireless connectivity options such as Wi-Fi, Bluetooth, Bluetooth Low Energy (LE), LTE, GPS, etc. All of the outside world information can be fed through a dual CAN/FD communication channel. It supports three display connections and a variety of boot options (user selectable).
It is suitable for Two wheelers, Three wheelers and Four Wheelers.
Semicon India 2024 / Electronica India 2024
TFT instrument cluster
This is an instrument cluster with telematics. It includes connectivity, tell-tale indicators, Wi-fi mirroring of a mobile screen, Bluetooth low-energy connection and brightness control of a TFT and camera image display. It is suitable for Two wheelers, Three wheelers and Four Wheelers.
Semicon India 2024 / Electronica India 2024
Telematics Gateway
The solution demonstrates typical software applications on the gateway ECU, which is a combination of the existing hardware POCs, AS260 VCU and WCU as a dedicated web server. The Showcase includes vehicle real-time data monitoring, FOTA updates, camera playback and diagnostics.
It is ideal for zonal gateway or small center gateway in the new E/E-Architecture.
Semicon India 2024 / Electronica India 2024
E-Bike Cluster Chip
It is a cluster chip termed as DA14706 by Renesas. It is an integrated application processors, 2D graphics processor, Voice Activity Detector (VAD) and Power Management Unit (PMU). With its ultra-low-power radio transceiver offering +6 dBm output power, and -97 dBm sensitivity combined with its software-configurable and upgradeable protocol engine (MAC), the DA14706 is capable of supporting Bluetooth low energy as well as multiple other 2.4 GHz protocols.
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
xEV Solutions
-RAJ2930004AGM - Gate driver for HEV/EV
-Traction Inverter Reference Solution
-IPS2550 Inductive Position Sensor for High-speed Motor Commutation
-Single Chip ASIL-D Steering Angle Sensor
Embedded World 2024
Advanced Motor Control Solutions
Embedded World 2024
E/E Architecture
Solid State Automotive Power Distribution Module with E-Fuse
RH850/U2A Zone/Domain Microcontroller seires: Based on 28 nm process technology, the 32bit RH850/U2A automotive MCU builds on key from RH850/px series for chassis control and RH850/Fx series for body control to deliver improved performance.
R-Car S4 Whitebox SDK: Integrated Development Platform for Connected Services and Gateway Application (Software)
Embedded World 2024
E/E Architecture
Solid State Automotive Power Distribution Module with E-Fuse
RH850/U2A Zone/Domain Microcontroller seires: Based on 28 nm process technology, the 32bit RH850/U2A automotive MCU builds on key from RH850/px series for chassis control and RH850/Fx series for body control to deliver improved performance.
R-Car S4 Whitebox SDK: Integrated Development Platform for Connected Services and Gateway Application (Software)
Embedded World 2024
E/E Architecture
Solid State Automotive Power Distribution Module with E-Fuse
RH850/U2A Zone/Domain Microcontroller seires: Based on 28 nm process technology, the 32bit RH850/U2A automotive MCU builds on key from RH850/px series for chassis control and RH850/Fx series for body control to deliver improved performance.
R-Car S4 Whitebox SDK: Integrated Development Platform for Connected Services and Gateway Application (Software)
Embedded World 2024
E/E Architecture
Solid State Automotive Power Distribution Module with E-Fuse
RH850/U2A Zone/Domain Microcontroller seires: Based on 28 nm process technology, the 32bit RH850/U2A automotive MCU builds on key from RH850/px series for chassis control and RH850/Fx series for body control to deliver improved performance.
R-Car S4 Whitebox SDK: Integrated Development Platform for Connected Services and Gateway Application (Software)
Embedded World 2024
E/E Architecture
Solid State Automotive Power Distribution Module with E-Fuse
RH850/U2A Zone/Domain Microcontroller seires: Based on 28 nm process technology, the 32bit RH850/U2A automotive MCU builds on key from RH850/px series for chassis control and RH850/Fx series for body control to deliver improved performance.
R-Car S4 Whitebox SDK: Integrated Development Platform for Connected Services and Gateway Application (Software)
Embedded World 2024
ADAS Demo
SRIR144V3 - Imaging Radar Module/ Polaris-Satellite Radar Module with 3D Antenna
R-Car-V4H/ Gen5 virtual Platform (Simulator)
Embedded World 2024
ADAS Demo
SRIR144V3 - Imaging Radar Module/ Polaris-Satellite Radar Module with 3D Antenna
R-Car-V4H/ Gen5 virtual Platform (Simulator)
Embedded World 2024
ADAS Demo
SRIR144V3 - Imaging Radar Module/ Polaris-Satellite Radar Module with 3D Antenna
R-Car-V4H/ Gen5 virtual Platform (Simulator)
Embedded World 2024
ADAS Demo
SRIR144V3 - Imaging Radar Module/ Polaris-Satellite Radar Module with 3D Antenna
R-Car-V4H/ Gen5 virtual Platform (Simulator)
electronica China 2023
R-Car V3H Smart Camera
The integrated and scalable front-view camera platform jointly developed by Renesas Electronics and LUPA Corporation can realize functions such as automatic emergency braking, forward collision warning, lane keeping assist, and traffic sign recognition. It can also be extended to functions such as surround view, driver monitoring, etc., supporting perception algorithms, and sensor fusion with radar and/or lidar.
electronica China 2023
Scalable ADAS/AD development platform
A solution jointly provided by Renesas Electronics and Hailo Corporation
electronica China 2023
Scalable ADAS/AD development platform
A solution jointly provided by Renesas Electronics and Hailo Corporation
electronica China 2023
RAA279450 dual wireless charging solution
In-vehicle Dual WPC solution compliant with Qi 1.3 standard
electronica China 2023
RAA279450 dual wireless charging solution
In-vehicle Dual WPC solution compliant with Qi 1.3 standard
electronica China 2023
GreenPAK development kit
electronica China 2023
GreenPAK development kit
electronica China 2023
iW7039A LCD backlight solution
electronica China 2023
iW7039A LCD backlight solution
electronica China 2023
LCD instrumentation and DMS single chip solution
R-Car E3e low-cost high-performance 3D full LCD instrumentation, DMS and audible warning sound/message single-chip solution
electronica China 2023
LCD instrumentation and DMS single chip solution
R-Car E3e low-cost high-performance 3D full LCD instrumentation, DMS and audible warning sound/message single-chip solution
electronica China 2023
R-Car Gen3e smart cockpit
An integrated non-virtualized cockpit solution that uses built-in CPU, GPU, IMR and other units to achieve fast startup
electronica China 2023
R-Car Gen3e smart cockpit
An integrated non-virtualized cockpit solution that uses built-in CPU, GPU, IMR and other units to achieve fast startup
electronica China 2023
Brushless DC motor control solution
electronica China 2023
Brushless DC motor control solution
electronica China 2023
IPS2550 Inductive position sensor
Suitable for high-speed motor commutation
electronica China 2023
IPS2550 Inductive position sensor
Suitable for high-speed motor commutation
electronica China 2023
New energy vehicle motor control solution
electronica China 2023
New energy vehicle motor control solution
electronica China 2023
Automotive battery management system (BMS) solution
electronica China 2023
Automotive battery management system (BMS) solution
electronica China 2023
SFM Application
Renesas Electronics and LACROIX develop based on R-Car V4H development board and R-Car xOS SDK
electronica China 2023
SFM Application
Renesas Electronics and LACROIX develop based on R-Car V4H development board and R-Car xOS SDK
electronica China 2023
RAA270205 Satellite radar system
- Radar system solution for ADAS central computing architecture and supports satellite radar architecture
- Fast ADC sampling up to 112.5MSPS
- 4-channel MIPI-CSI2 interface, output up to 14.4Gbps
electronica China 2023
RAA270205 Satellite radar system
- Radar system solution for ADAS central computing architecture and supports satellite radar architecture
- Fast ADC sampling up to 112.5MSPS
- 4-channel MIPI-CSI2 interface, output up to 14.4Gbps
electronica China 2023
CMS solution for electronic exterior mirrors
electronica China 2023
CMS solution for electronic exterior mirrors
electronica China 2023
CMS solution for electronic exterior mirrors
electronica China 2023
CMS solution for electronic exterior mirrors
electronica China 2023
Automotive ECU virtualization platform
Renesas Electronics Automotive Grade RH850/U2x MCU and ETAS' RTA-HVR Software
electronica China 2023
Automotive ECU virtualization platform
Renesas Electronics Automotive Grade RH850/U2x MCU and ETAS' RTA-HVR Software
electronica China 2023
RH850/U2A vehicle network technology
electronica China 2023
RH850/U2A vehicle network technology
electronica China 2023
Development environment for internet/gateway applications
Renesas Electronics R-Car S4 with security functions of IDS (Intrusion Detection System)/IPS (Intrusion Prevention System)
electronica China 2023
Development environment for internet/gateway applications
Renesas Electronics R-Car S4 with security functions of IDS (Intrusion Detection System)/IPS (Intrusion Prevention System)
electronica China 2023
Development environment for internet/gateway applications
Renesas Electronics R-Car S4 with security functions of IDS (Intrusion Detection System)/IPS (Intrusion Prevention System)
electronica China 2023
R-Car S4 vehicle network technology
Supports new E/E architectures
electronica China 2023
R-Car S4 vehicle network technology
Supports new E/E architectures
electronica China 2023
R-Car S4 vehicle network technology
Supports new E/E architectures
Automotive World 2023
Automotive IPD (Intelligent Power Device)
-40% reduction in mounting area due to miniaturization. Capable of detecting abnormal currents even at low loads.
-Ideal for domain and zoned E/E architectures because it is maintenance-free and has a long life compared to mechanical relays
-Production is scheduled to start in January 2024.
Automotive World 2023
Automotive IPD (Intelligent Power Device)
-40% reduction in mounting area due to miniaturization. Capable of detecting abnormal currents even at low loads.
-Ideal for domain and zoned E/E architectures because it is maintenance-free and has a long life compared to mechanical relays
-Production is scheduled to start in January 2024.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
xEV Inverter Application Model & Software
-Reference Kit for inverter development. This can now handle higher voltages.
Automotive World 2023
Electromagnetic induction type position sensor
-Realizes 30% cost savings over resolvers when combined with the company's xEV (electrified vehicle) inverter solution.
-Indoor positioning system (IPS) enables highly accurate position detection, contributing to higher RPM, smaller size, lighter weight, and thinner profile.
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
Realization of E/E architecture with R-Car S4 and R-Car V4H
--Communication (image transfer) of ADAS, CoGW and IVI for next generation E/E architecture (domain/zone type).
Automotive World 2023
300mm IGBT (Insulated Gate Bipolar Transistor) Wafer
-Wafers used as power semiconductors for inverters for xEVs (electrified vehicles).
-10% improvement in power loss and 10% downsizing while maintaining fracture tolerance.
Automotive World 2023
300mm IGBT (Insulated Gate Bipolar Transistor) Wafer
-Wafers used as power semiconductors for inverters for xEVs (electrified vehicles).
-10% improvement in power loss and 10% downsizing while maintaining fracture tolerance.
Automotive World 2023
Power Modules
-Power modules installed in xEV (electrified vehicle) inverter applications.
Automotive World 2023
Battery Management System (BMS) application model and software
-Solutions for development that provide sample system-level models and enable simulation from the design stage.
-It can control up to 70 lithium-ion battery cells in series.
Automotive World 2023
Battery Management System (BMS) application model and software
-Solutions for development that provide sample system-level models and enable simulation from the design stage.
-It can control up to 70 lithium-ion battery cells in series.
Automotive World 2023
Wireless Battery Management System
Automotive World 2023
Wireless Battery Management System
Automotive World 2023
Wireless Battery Management System
Automotive World 2023
Wireless Battery Management System
Automotive World 2023
Power Management Demonstration with E-Fuse
-E-Fuse interrupts current by current sense instead of fusing. In the demonstration, the current value of the IPD is calculated by the MCU to simulate power fuse characteristics.
-Since it is not fusion protection, it does not require parts replacement.
Automotive World 2023
Power Management Demonstration with E-Fuse
-E-Fuse interrupts current by current sense instead of fusing. In the demonstration, the current value of the IPD is calculated by the MCU to simulate power fuse characteristics.
-Since it is not fusion protection, it does not require parts replacement.
Automotive World 2023
Power Management Demonstration with E-Fuse
-E-Fuse interrupts current by current sense instead of fusing. In the demonstration, the current value of the IPD is calculated by the MCU to simulate power fuse characteristics.
-Since it is not fusion protection, it does not require parts replacement.
Automotive World 2023
Power Management Demonstration with E-Fuse
-E-Fuse interrupts current by current sense instead of fusing. In the demonstration, the current value of the IPD is calculated by the MCU to simulate power fuse characteristics.
-Since it is not fusion protection, it does not require parts replacement.
Automotive World 2023
Power Management Demonstration with E-Fuse
-E-Fuse interrupts current by current sense instead of fusing. In the demonstration, the current value of the IPD is calculated by the MCU to simulate power fuse characteristics.
-Since it is not fusion protection, it does not require parts replacement.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
Front Camera Solutions
-Input information from a monocular camera is used to extract high-density movement vectors. Based on this information, the vehicle's position is measured and the distance information between the vehicle and obstacles is calculated to create a three-dimensional point cloud representation of the vehicle's surrounding environment.
Automotive World 2023
OTA Solutions
Automotive World 2023
OTA Solutions
Automotive World 2023
OTA Solutions
Automotive World 2023
OTA Solutions
Automotive World 2023
Multi-device distributed processing devices
-Demonstration of faster and smoother execution of a large number of devices with high loads.
Automotive World 2023
Zone-ECU Virtualization Solution Platform
-Development platform providing integrated solutions including related software products and tools
Automotive World 2023
Zone-ECU Virtualization Solution Platform
-Development platform providing integrated solutions including related software products and tools
Automotive World 2023
Zone-ECU Virtualization Solution Platform
-Development platform providing integrated solutions including related software products and tools
Automotive World 2023
Zone-ECU Virtualization Solution Platform
-Development platform providing integrated solutions including related software products and tools
Automotive World 2023
Zone-ECU Virtualization Solution Platform
-Development platform providing integrated solutions including related software products and tools
Automotive World 2023
Cooperative Simulation Environment
-Compatibility and cooperation between software for multiple devices can be simulated during the development phase.
-The device software is also compatible with products from other companies.
Automotive World 2023
Cooperative Simulation Environment
-Compatibility and cooperation between software for multiple devices can be simulated during the development phase.
-The device software is also compatible with products from other companies.
CES 2021
Battery Management System reference design kit
-Reference design can monitor and balance cell voltages of up to 70 battery cells
CES 2021
Battery Management System reference design kit
-Reference design can monitor and balance cell voltages of up to 70 battery cells
CES 2021
R-Car SoCs for low-cost integrated cockpit applications
-Can enable multi-domain integration through hypervisor operation or through hardware domain separation with the ARM Cortex-R7 CPU
CES 2021
R-Car SoCs for low-cost integrated cockpit applications
-Can enable multi-domain integration through hypervisor operation or through hardware domain separation with the ARM Cortex-R7 CPU
CES 2021
IDT highly integrated transmitter and receiver ICs for wireless charging
-Compatible with Qi standard, flexibility in providing due to variations in input voltages and coils enable use across variety of applications.
CES 2021
Power management ICs for Renesas R-Car SoCs
-Tailored to support R-Car SoCs; Features single-phase regulators which reduce PCB area due to the elimination of external components
CES 2021
VersaClock timing generators for complex ADAS systems
-Reduces board space usage and provides increased flexibility and performance; can replace multiple crystal oscillators
CES 2021
Inductive position sensor IC for motor commutation
-Contactless system, improving durability and robustness against dust and vibration.
CES 2021
Automotive radar transceiver
-High-performance transceiver utilizing UWB for real-time high-resolution 4D imaging. Low noise helps improve accuracy.
electronica China 2020
Integrated cockpit solution
electronica China 2020
Integrated cockpit solution
electronica China 2020
Battery management system (BMS) solution
High precision, safe, and reliable
electronica China 2020
Battery management system (BMS) solution
High precision, safe, and reliable
electronica China 2020
R-Car V3H starter kit
electronica China 2020
R-Car V3H starter kit
electronica China 2020
R-Car V3H MIPI
ELIV (Electronics In Vehicles) 2019
R-CAR cockpit ECU reference solution
Hardware (engine control unit) and software (on the screen).
ELIV (Electronics In Vehicles) 2019
R-CAR cockpit ECU reference solution
Hardware (engine control unit) and software (on the screen).
ELIV (Electronics In Vehicles) 2019
R-CAR cockpit ECU reference solution
Hardware (engine control unit) and software (on the screen).
ELIV (Electronics In Vehicles) 2019
R-CAR perception quick start software
Software to that uses the unique hardware acceleration in R-Car (camera object detection and road features detection).
ELIV (Electronics In Vehicles) 2019
R-CAR perception quick start software
Software to that uses the unique hardware acceleration in R-Car (camera object detection and road features detection).
electronica China 2018
Integrated cockpit solution
electronica China 2018
Integrated cockpit solution
electronica China 2018
3D virtual instrument solution
electronica China 2018
3D virtual instrument solution
electronica China 2018
Vehicle network technology
electronica China 2018
3D vision parking assist system
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Renesas autonomy fleet testing and development vehicle
-Lincoln "MKZ" test vehicle features low-cost sensing architecture, nine cameras, lidar systems, architecture with failsafes against camera and processor faults and OTA updates of HD maps.
CES 2018
Autonomous testing and development vehicle developed in conjunction with AutonomouStuff
-Lincoln MKZ autonomous test vehicle developed with AutonomouStuff, a startup focusing on supplying components for autonom systems; AutonomouStuff provided a customized research development platform for the ADAS systems used in the vehicle; the Company provided the R-Car H3 ADAS controller used in the vehicle.
electronica China 2017
Vehicle network technology
electronica China 2017
Vehicle network technology
electronica China 2017
ADAS view
electronica China 2017
ADAS view
electronica China 2017
Integrated cockpit solution
electronica China 2017
Integrated cockpit solution
electronica China 2017
New energy vehicle motor control program
electronica China 2017
New energy vehicle motor control program
Automotive World 2017
Microcomputer RH850/F1x
Demonstration to open doors with gesture recognition, exhibited at Tokai Electronics booth.
Automotive World 2017
Microcomputer RH850/F1x
Demonstration to open doors with gesture recognition, exhibited at Tokai Electronics booth.
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2017
Microcomputer RH850/F1K series
CAN FD evaluation board, a next-generation automotive LAN communication standard
Automotive World 2016
<Automotive computing solutions> R-Car H3 platform
Automotive World 2016
<Automotive computing solutions> Next generation integrated cockpit
Automotive World 2016
<Safety technologies> R-Car T2 SoC for Ethernet network camera
Automotive World 2016
<Eco-car / Fuel efficiency> HEV/EV inverter solution
Automotive World 2016
Inverter for HEV/EV drive motor
Automotive World 2016
Model-based IP solution
Automotive World 2016
Multicore/Model-based environment
Automotive World 2016
<Maintenance improvement> Safe & secure software update service
Automotive World 2016
<Maintenance improvement> Automotive functional safety e-learning service

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