will power advanced driver-assistance systems (ADAS) in multiple models launching in 2024. The EyeQ6L is already set to be installed in 46 million vehicles over the next few years. It will be followed by the EyeQ6 High advanced SoC, which is planned for early 2025. This EyeQ6L was designed with two CPU cores and five high-compute density accelerators. It provides 4.5 times more computing power than the EyeQ4M at roughly half the physical space, w...

Major Suppliers  Updated at: 2026/08/20

unction, which can be upgraded to level 3 over-the-air. On October 29, Leapmotor released its first independently-developed intelligent driving chip. Leapmotor claimed that the chip, dubbed Lingxin 01 in Chinese, is close to Mobileye chips in terms of processing performance. The chip adopts a core CPU processor called Xuantie C860 supplied by PingTouGe Semiconductor Co., Ltd., an Alibaba Group business entity specializing in semiconductor chips....

OEM Plants  Updated at: 2026/08/18

Renesas Electronics Europe Limited UK -Shareholders: Renesas Electronics Corporation (Japan) CPU Various semiconductors Microcontrollers Microprocessors ...

Search Suppliers  Updated at: 2026/08/10

Denso (China) Investment Co., Ltd. Chongqing Branch China -Shareholders: Denso Corporation. Engine ECU CPU Board mounting Other Driving Support System ECU Printed circuit board OBD Interface Self-diagnosis function ...

Search Suppliers  Updated at: 2026/08/06

recognition systems Denso upgrades automotive vision sensors to detect pedestrians at night Seven Toyota Group parts suppliers announce financial results for April-September 2016 Denso to maintain R&D spending at 9% of sales revenue Denso and Imagination Technologies to jointly research automotive CPU hardware multi-threading Toshiba's image recognition processor chosen for Denso's front camera-based safety system Denso opens new branch in Bangk...

Major Suppliers  Updated at: 2026/08/04

mmunication module supporting the domains of intelligent transportation, smart cities and autonomous driving and started mass production in July 2020. The module, compliant with 3GPP Rel.14, includes an all-in-one type of application processor and V2X protocol stack to reduce the burden on the host CPU for the onboard unit. It also has its own built-in power circuit (PMIC: Power Management IC), which facilitates system expansion of onboard units ...

Major Suppliers  Updated at: 2026/08/04

Infineon Technologies India Pvt. Ltd. India -Shareholder(s): Infineon Technologies AG -Sales office Power semiconductor Transistor LED Diode CPU Memory (DRAM / SRAM / etc.) Various sensors Power semiconductor Various semiconductors IC sensor IC for side airbag air pressure sensor IC for engine control sensor IC for tyre pressure monitoring system roll over sensor IC Throttle valve sensor ABS hall effect IC hall effect IC for crank shaft speed ...

Search Suppliers  Updated at: 2026/07/31

) (China) αS5 REEV (RR) (China) αS6 (FF) (China) αT5 (China) 5G chip AD chip (Snapdragon Ride System-on-Chip (SoC)) ADAS chip ADAS chip (8775P) ADAS chip (SA8620) ADAS chip (SA8650) ADAS chip (SA8797P) ADAS domain controller chip Cockpit MCU chip Computer with GPU for MBUX system Digital cockpit CPU (8295P) Digital cockpit platform Digital cockpit platform (SoC) Digital cockpit platform (SoC) (8155) Digital cockpit platform (SoC) (8295) Front ...

Search Suppliers  Updated at: 2026/07/29

an alert or disconnect the power supply if resistance falls under a set value. -Contactors feature extended performance impervious ceramic sealing technology to enable high-quality sealing at low cost. Third-generation system scalable for up to 1,000 V; Features dual-core lockstep CPU and is ISO 26262 ASIL-C certified System tracks insulation resistance between a vehicle's power system and chassis to issue an alert or disconnect...

Major Suppliers  Updated at: 2026/07/29

f LH series LH1010, GNSS module of LF series LF70HB/LF70HP, IMU modules/bands of STI series, high-precision positioning terminal S12, telemetics intelligent terminal T-box. The latest generation of smart cockpit domain control SoC chip AC8025 adopts an eight-core Arm Cortex-A76+A55 high-performance CPU combination and complies with AEC-Q100 and ISO 26262 ASIL B (instrument display) certification requirements; it supports 8-channel full-HD camera ...

Search Suppliers  Updated at: 2026/07/27

a battery electric platform, in Shanghai. The Elexio was developed based on the E-GMP (Electric Global Modular Platform), a manufacturing platform for premium models. At room temperature, the model delivers a range of over 700km. Technology and intelligence: With a Qualcomm SA8295 high-performance CPU, the Elexio employs a Level 2+ automatic assisted driving system, which is scheduled for Level 2+ urban automatic assisted driving features in 202...

OEM Plants  Updated at: 2026/07/20

&S’s image recognition processor processes video input from the cameras and recognizes the lane in which the vehicle is traveling, vehicles, pedestrians, signs, and headlights of oncoming vehicles. It is characterized by its ability to perform image recognition with lower power consumption than a CPU (Central Processing Unit) or GPU (Graphics Processing Unit) because the processing is performed by the hardware. (From an article in the Nikkan Ji...

Major Suppliers  Updated at: 2026/07/20

ch of its Harman Software Update Gateway product with go-to-market partner NXP Semiconductors as the latest addition to the Harman Software Management portfolio. NXP's secured gateway processors, embedded with the new Harman update management technology, will enable every ECU, regardless of memory, CPU or network resource, to benefit from secure over the air (OTA) updates. All ECUs, such as those running advanced driver assisted systems (ADAS), b...

Major Suppliers  Updated at: 2026/07/17

ms for passenger cars and motorcycles, battery management systems, lighting, and motor control. The RH850/U2C satisfies the requirements of electronic control units (ECUs) that support automotive E/E (electrical/electronic) architectures developed by automakers. It is equipped with up to four RH850 CPU cores operating at up to 320 MHz, and up to 8 megabytes of flash memory. The RH850/U2C, which has adopted 28-nanometer generation flash memory, re...

Major Suppliers  Updated at: 2026/07/15

a) Z10 (China) Z10 (RR) (China) Z20 (China) Zafira Electric (France) Zafira Life (France) Zafira-e Life (France) Zoe (France) αT5 (China) 2010 2013 2014 2015 2016 2017 2018 2020 2021 2022 2023 2024 2025 2026 AV ECU Bluetooth module Cockpit MCU chip Computer with GPU for MBUX system Digital cockpit CPU (8295P) Digital cockpit platform Digital cockpit platform (Antora 1000 Plus) Digital cockpit platform (Antora 1000 Pro) Digital cockpit platform (...

Who Supplies Whom  Updated at: 2026/07/15

om the second quarter of 2024. The goal is to realize a lightweight map solution by 2025. Including rear entertainment screen, instrument + central control integrated screen, driver monitoring system, passenger monitoring system, 360-degree panoramic image, etc. Based on the Qualcomm 8295 chip, the CPU's computing power is up to 220k DMIPS, and the NPU's computing power is up to 20-30TOPS. Efficient platform design maximizes the computing power o...

Major Suppliers  Updated at: 2026/07/09

attery module Hydrogen Type IV storage system High Pressure Hydrogen System 237L hydrogen type IV storage vessels Hydrogen type IV storage vessels Fuel cell system High pressure hydrogen vessel display Hydrogen fuel cell system 4D imaging radar solution High power battery packs Software integration CPU Trends wall Dynamic welcome light projection module Automatic Charge LID Active aerodynamics demonstration unit Front trunk cutaway Intelligent of...

Major Suppliers  Updated at: 2026/07/07

ear axle extending the driving range to up to 630km -The ADAS domain controller enables a flexible and scalable autonomous driving compute platform for different vehicle and interface requirements. Different systems (SoCs) can be integrated to enable customer-specific preferences. -Specifications: CPU computing power from 14,000 DMIPS to 300,000 DMIPS; up to 9000 GOPS for Deep Learning -Applications: with flexible vehicle network interfaces Free...

Major Suppliers  Updated at: 2026/07/07

Infineon Technologies AG Germany Various sensors Transistor Raindrop / Light sensor Diode CPU Memory (DRAM / SRAM / etc.) Power semiconductor IC LED Various semiconductors Steering angle sensor Power semiconductor ASIC Magnetic sensors Current sensors MEMS microphones Pressure sensors CO2 sensor Radar sensors ToF 3D image sensors Discrete chips for on-board chargers BMW BYD Honda Nissan Subaru Tesla Toyota Volkswagen Amaze (India) ATTO 3 (Yu...

Search Suppliers  Updated at: 2026/07/06

’s future vehicles based on the latest Snapdragon Cockpit Platform SA8295P from Qualcomm Technologies. The latest generation Snapdragon Cockpit Platform marks Qualcomm’s first automotive-grade solution utilizing 5nm processing technology. This platform leverages the 6th Generation Qualcomm Kryo CPU with high-performance computing capabilities, Qualcomm Adreno GPU with leading graphics rendering capabilities, and Qualcomm Artificial Intelligen...

OEM Plants  Updated at: 2026/07/03