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Taipei AMPA 2026: Foxconn’s EV Technology
BEVs, batteries, information and communications technology, automotive semiconductors
2026/04/28
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Summary
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BEVs
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Battery-related products (Battery cells, battery packs)
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High-Performance Computing Platform, TCU
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Automotive semiconductors
Summary
The comprehensive automobile, motorcycle, and car electronics expo “360° Mobility Mega Shows 2026”, organized by TAITRA (Taiwan External Trade Development Council) was held at the Taipei Nangang Exhibition Center from April 14th to 17th, 2026. The event consisted of three exhibitions, including the Taipei AMPA 2026 (Taipei International Automobile & Motorcycle Parts & Accessories Show), which is one of Taiwan's largest automobile and motorcycle trade shows.
The theme of this year's expo was "Empower Every Move," and it attracted visitors from 90 countries, with approximately 2,500 buyers and industry professionals in attendance. At the exhibition booths, solutions for automotive electronics, powertrain systems, and smart manufacturing were on display, reflecting the trends toward intelligent systems, electrification, and the transition to low-carbon technologies.
This report introduces the exhibits presented by the Foxconn Group (Hon Hai Group), which had the largest booth at this trade show.
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| Entrance | Foxconn Group's booth |
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