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Sumitomo Bakelite develops next-generation 3D power module with ultra-compact size and high power density for EV
On August 18, Sumitomo Bakelite announced that it had developed a 3D SiC-MOSFET power module with a resin-insulated dual-layer structure that achieves both a compact size and high power density through joint research with Tohoku University. By optimizing the thermal expansion characteristics and elastic modulus of th....
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