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ESMC holds groundbreaking ceremony for its first semiconductor fab in Dresden, Germany
On August 20, 2024, European Semiconductor Manufacturing Company GmbH (ESMC), a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. held a groundbreaking ceremony to mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.
The fab....
The fab....
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