i Mobis, as well as its role as the “primary tech provider for the launch of the zonal SDV architecture” at the Volkswagen Group, with Rivian playing a key role here. FIGURE 1The demo platform based on Renesas’ R-Car X5 contains a chip with 4 TFLOPS of GPU performance, 32 Arm Cortex-A720AE CPU cores, and six Cortex-R52 lockstep cores with ASIL-D support – in total, the chip delivers over 1000 kDMIPS   Renesas, in turn, presented itse...

Market & Tech Reports  Updated at: 2026/03/26

Open Datasets: 1,700 hours of driving data Vera Rubin platform • 6 new superchips to build AI supercomputers• Rubin GPU: Built for next generation of AI• Spectrum-6 Ethernet switch: 102.4 Tb/s, CPO• NVLink 6 Switch: Single Hop 3,600 GB/s • Replaces Blackwell platform chips• Vera CPU: Built for data movement in agentic AI• BlueField-4 DPU: 64C Grace CPU, CX-9 800 Gb/s• ConnectX-9: 800 Gb/s per port AI super systems •...

Market & Tech Reports  Updated at: 2026/01/30

require GPU computing power, but are processed using rules and strategies generated by the security AI. Many rules are reusable and adapt to MSP's service model. In the L2 layer, specialized domain models and AI coding handle the decision-making process and assist in the extraction of rules for the CPU from inference by the GPU. Cutting-edge technology research at the L3 layer will be realized through knowledge sharing with AI security research p...

Market & Tech Reports  Updated at: 2026/01/27

solutions to suit various intelligent driving scenarios. By the first quarter of 2025, cumulative shipments of the Journey series exceeded 8 million units.   The Journey 6P has a maximum computing power of 560 TOPS and integrates a 4-core BPU (Brain Processing Unit). It has an 18-core, 410K DMIPS CPU and 5.3 gigapixels/sec image processing power to meet the real-time inference needs of large-scale models for intelligent driving. In addition, th...

Market & Tech Reports  Updated at: 2025/10/16

k actuator that locks the left and right driveshafts. Motor housing (motor side) Center housing (differential lock actuator) e-Axle display panel BYD Yangwang U8 inverter   The inverters in the FR and RR units have a dual inverter structure, with one inverter driving two motors, and one CPU on one control board controlling two motors.   Two 6-in-1 type single-sided direct-cooled SiC power modules are mounted together with the gate dr...

Market & Tech Reports  Updated at: 2025/10/14

-, mid-, and high-level intelligent driving applications. Of these, the Journey 6P reached 560 TOPS in arithmetic processing speed and achieved groundbreaking optimizations in transcendental functions, floating-point arithmetic, and memory management. At the same time, the Journey 6P integrates the CPU, BPU, GPU, and MCU, further reducing deployment costs. Urban driving assistance system Horizon SuperDrive (HSD) HSD uses a single-stage end-to-e...

Market & Tech Reports  Updated at: 2025/08/05

Launched by Alibaba･ Deployed 2.5K+ AVs in 100 cities Other suppliers ･ Amap: Map and navigation leader･ Alipay: Top global payment platform ･ Maps & transit info on PonyPilot･ 1.4B+ global users; Founded by Alibaba Chip suppliers ･ Nvidia: Restricted China GPU sales･ AMD: GPU and CPU related chips ･ Using Nvidia Drive Orin･ China restrictions on GPUs GTMC=GAC Toyota Motor Company; JV=Joint Venture; TNC=Transport Network C...

Market & Tech Reports  Updated at: 2025/07/03

was developed for two-motor hybrid systems. It has been adopted by a European manufacturer in their hybrid vehicles.   It is water-cooled, with a maximum output current of 200A to 500A, and supports motors with a maximum output of 60kW to 200kW. The two sets of inverters are controlled by a single CPU on a single printed circuit board in the motor controller.   Schaeffler AG: 800V SiC inverter, X-in-1 controller   Schaeffler, which merged with...

Market & Tech Reports  Updated at: 2025/06/26

d on interviews)   The latest third-generation Calterah Andes product aims to promote practical use at Level 2+ and replace LiDAR through functionality expansion to 4D imaging radar.   The technical features of Andes include a 22nm CMOS process, and the SoC for 4D imaging radar has a quad-core CPU configuration that integrates an RF module and includes a DSP and RSP (dedicated radar signal processor).   The imaging radar function is realize...

Market & Tech Reports  Updated at: 2025/06/17

ith MarkLines' industry network in the Japanese market.   Products in the smart cockpit and smart drive areas   The flagship cockpit domain controller and the high-end cockpit domain controller platform were on display, including the flagship cockpit domain controller, which features a 230K DMIPS CPU and 3.0T FLOPS GPU and is capable of multi screen 3D rendering and ray tracing. In addition, this NPU (Neural Processing Unit) has 30 TOPS (INT8) ...

Market & Tech Reports  Updated at: 2025/05/28

sensors. 360-degree recognition is possible under all scenarios and operating conditions. It is equipped with Orca, a full-stack, self-developed, self-controlled high-performance computing platform developed by Didi Autonomous Driving, with a GPU processing capacity of over 2,000 TOPS and a 48-core CPU.   Trumpchi: Debut of the flagship SUV Xiangwang S9   GAC Trumpchi unveiled the Xiangwang S9, a smart electric model of the Xiangwang 9 Serie...

Market & Tech Reports  Updated at: 2025/05/20

to Software-Defined Vehicles (SDVs) and zonal architectures. Key Features of the S32K5: 16nm FinFET process and embedded MRAM (Magnetoresistive RAM)– Achieves over 15 times faster writing speeds compared to traditional flash memory, contributing to faster OTA (Over-The-Air) updates. Arm Cortex CPU core up to 800 MHz– Delivers a balance of real-time performance and low power consumption. Integrated accelerators optimize key workloads such a...

Market & Tech Reports  Updated at: 2025/05/13

2X, and a 3kW DC-DC converter. DC-DC ConverterDC-DC converter (rear side)Display panel for 300kW inverter and DC-DC converter Display of in-vehicle microcomputer (Stellar P) Display panel for in-vehicle microcomputer (Stellar P)   STMicroelectronics also has a lineup of microcontrollers (CPUs) for automotive applications.   For in-vehicle motor controllers, the candidates were Stellar P or Stellar E1 depending on the application, but ...

Market & Tech Reports  Updated at: 2025/02/27

ms such as computing power, data, and tool chains. Baidu intelligent cloud autonomous driving solutions can be categorized into the following four tiers. Level Details Cloud services infrastructure At the lowest layer are public clouds, private clouds and edge clouds, which support traditional CPU cloud services and the computing power required. AI-base Based on the AI computing power requirements of autonomous driving, Baidu will build a ...

Market & Tech Reports  Updated at: 2025/01/08

f applications, and with rapid improvements in processing power, they now have much better performance than processors used for navigation systems. Below is an example comparing the performance of a typical smartphone processor with that of a car navigation processor. Table 2: Comparison of typical CPUs for smartphones and car navigation systems Main built-in processors Smartphone CPU example Car navigation CPU example CPU operating frequency...

Market & Tech Reports  Updated at: 2024/10/03

same performance and quality was described. Specifically, the demo video explains how the same control can be performed on the back-end and on-board by introducing deterministic execution in the autonomous operation software (Autoware) to absorb differences in processing time due to differences in CPU performance and input/output performance. IoV onboard test technology(Source: Hitachi Astemo, online exhibit) IoV software platform techno...

Market & Tech Reports  Updated at: 2024/07/23

-processing (making decisions based on AI output and activating the system)   AMD Versal AI Edge Series Gen 2 Versal AI Edge Series Gen 2 ©2024 Advanced Micro Devices, Inc.; Compared to the first generation, it has up to 3x more TOPS (Terra Operations per Second) per watt and up to 10x more CPU-based scalar computing power (Arm CPU), 10x Arm Cortex-R52 real-time processors, and 8x Arm Cortex A78AE cores   Dr. Raje also introduced the ...

Market & Tech Reports  Updated at: 2024/06/03

ted continuous wave) to achieve a range of 240 m and a maximum FOV of ±60°, making it suitable for L2+ autonomous driving applications. The planned annual production volume is 500,000 units. In addition, the next-generation series Andes, which will be ready for SOP at the end of 2024, is a 4-Core CPU and has already been selected for delivery to Tier 1 suppliers in Europe as a SoC for high-performance 4D imaging radar with DSP (digital signal p...

Market & Tech Reports  Updated at: 2024/03/22

e summarized in three key words: Everything wireless, High Performance/Low Power, and Edge Intelligence (providing AI-powered edge functions).   The keywords for each of these are: 5G, Bluetooth, GNSS/Location, and providing cutting-edge technology in the C-V2X method for Everything wireless, and CPU, GPU, camera, and Computer for High Performance/Low Power. In the case of Edge Intelligence (providing AI-powered edge functions), Qualcomm will p...

Market & Tech Reports  Updated at: 2024/03/21

™, a new type of semiconductor SiC (silicon carbide) printed circuit board sealed in a top-side heat dissipation package (QDPAK). The sample is a reference design with a heat sink that serves as a case to cover the top and cools the power module by contacting the power module.   In addition, the CPU on the board is an Aurix™ TC3xx from Infineon. 7 kW single-phase OBC demo board with top-side heat dissipation SiC 7 kW single-phase OBC ...

Market & Tech Reports  Updated at: 2024/02/29