has been set up with an investment of over INR 1.5 billion. It is spread over 57,000 sq. ft. and equipped with Class 10K and 100K cleanrooms. The facility will package memory chips for products such as Micro SD and flash storage, along with LED driver ICs, eSIMs, and RFID products. It has an annual packaging capacity of 60 million semiconductor units with SPECS-supported projected capacity of about 43 million units. It has plans to scale up to ne...

News  Updated at: 2026/05/19

KD, Spain, secures investment to launch its packaging and testing facility On May 14, KD secured a new strategic financing round with the participation of AXIS, the venture capital arm of the ICO Group. It will invest EUR 3.6 million in KD to support its growth and strengthen its industrial capabilities. The technology developed by KD enables the reliable and efficient transmission of large volumes of data in harsh environments, such as the autom...

News  Updated at: 2026/05/15

rsen & Toubro (L&T), announced that it has joined the imec ‘Automotive Chiplet Program’ (ACP), a pre-competitive research initiative uniting stakeholders across the global automotive value chain. The ‘Automotive Chiplet Program’ leverages imec’s world-leading expertise in advanced 2.5D/3D packaging and its broad ecosystem. ACP evaluates chiplet architectures and advanced packaging technologies to meet automakers’ requirements. Through...

News  Updated at: 2026/05/04

arkets including the United Arab Emirates and Saudi Arabia and placing pressure on related manufacturing sectors. Supply chain disruptions, including higher freight rates, war-risk premiums, and backlogs, contributed to delays in exports, while shortages of key materials (plastic resins, chemicals, packaging, aluminum) raised production costs and pressured price adjustments. The automotive sector received partial short-term support from domestic ...

News  Updated at: 2026/04/24

Government of India breaks ground on first advanced 3D chip packaging plant in Odisha On April 19, the Ministry of Electronics and IT announced that the foundation stone for India's first advanced 3D chip packaging facility was laid at Info Valley, Bhubaneswar. The project is being implemented by 3D Glass Solutions Inc. (USA) through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt. Ltd. in Khordha district. To...

News  Updated at: 2026/04/20

ts paints, coatings and specialty products portfolio, reflecting the company’s desire to maintain a reliable supply of its high-performance products amid a rapidly evolving global cost environment. To ensure continuity of supply in the face of higher costs for raw materials, energy, logistics and packaging across the coatings value chain, PPG has begun implementing price increases of up to 20% across all product lines and services on a customer...

News  Updated at: 2026/04/17

to drive the development of next-generation vehicles. Silicon Box will support the ACP’s research initiative with its end-to-end know-how in chiplet interconnection, from consulting on optimal chiplet architecture for sustainable and scalable technology roadmaps to turnkey solutions for advanced packaging and testing.  Through imec’s Automotive Chiplet Program, Silicon Box will draw on its proprietary advanced packaging capabilities and cap...

News  Updated at: 2026/04/16

s to vehicle-cloud integrated applications; development and mass production of cockpit-driving integrated chips, modules, and complete machine solutions; and establishment of a product verification platform and research of links along the automotive chip industry chain, such as EDA, IP, wafers, and packaging and testing. The aim is to support the application of related solutions to production vehicle models. (From a Unisoc press release dated Ap...

News  Updated at: 2026/04/13

Adient launches StepJoy in-vehicle foot massage system, debuts on NIO ES9 On April 10th, Adient introduced StepJoy, a new in-vehicle foot massage system designed to enhance cabin comfort, debuting on NIO’s ES9 model. The system uses a cam-based mechanism with synchronized modules to deliver a targeted massage across the forefoot and arch, balancing performance with compact packaging and cost efficiency. StepJoy features a space-saving design th...

News  Updated at: 2026/04/11

nector engineering can intersect to create innovative mmWave solutions. Their collaboration reflects a shared vision to advance high frequency connectivity technologies and expand their industrial applications. Q1. Do you foresee this compact connector and flexible waveguide technology enabling new packaging options for automotive radar, high-speed vehicle to infrastructure modules, or ADAS sensor fusion networks? A1. Yes, we believe it. By stabl...

News  Updated at: 2026/03/27

se regions.  Magna’s DHD REX offers:    • Electric driving, generating mode for efficient range extension, and optional parallel hybrid mode for improved highway performance    • Applicable to B through E segments in AWD layouts, including SUVs    • Modular, compact design simplifies packaging and supports easier adaptation across both ICE-based and BEV platforms. (Magna release on March 24, 2026)...

News  Updated at: 2026/03/25

especially for automotive uses, such as airbag tubes and rotor shafts. Production capacity will increase by about 15%. The investment will add a new production line featuring a drawbench, expanded heat treatment capacity, and advanced equipment for preparation, drawing, heat treatment, testing, and packaging. The drawbench is set to begin operations in May 2026. Currently, the site has approximately 1,100 employees and produces around 160,000 met...

News  Updated at: 2026/03/24

produce the AI5 chip for powering FSD & Optimus, AI6 for Optimus, and D3 for powering compute in space, as well as trying other types of chips in the future that push the limits of physics. As Musk said earlier in a post “The goal is to produce over a TERAWATT of compute per year (logic, memory & packaging) with ~80% for space and ~20% for the ground.” Musk did not divulge the total cost of the new Terafab, though it is estimated to be about ...

News  Updated at: 2026/03/24

ion investment will generate 30 new jobs and incorporates a European Hi-Lex patent validated for BMW project. Enhancements include a new 2,000-sqm hall with a 0.49 MW rooftop solar power system, two 1500-ton injection molding machines, a semi-automated production line, updated material handling and packaging equipment, and modernized measurement and IT infrastructure. (From HIPA press release dated March 17, 2026)...

News  Updated at: 2026/03/18

s and Micron Technology (MU) would not be able to supply sufficient chips for the company's EVs, robot and AI needs. "To remove the probable constraint in three or four years, we are going to have to build a Tesla Terafab." Elon Musk said on the call. "A very big fab that includes logic, memory and packaging, domestically." Musk had mused about the possibility of working with Intel. Taiwan Semiconductor makes Tesla's current AI4 chip with high-vo...

News  Updated at: 2026/03/17

ch use Qualcomm’s Snapdragon Digital Chassis system‑on‑chips, will be made at what Tata Electronics describes as India’s first high‑volume indigenous OSAT plant, a greenfield facility with an investment of about USD 3 billion that will focus on wire bond, flip chip, and Integrated Systems Packaging (ISP) technologies. The plant will serve applications in automotive, communications, IoT, and AI, while Qualcomm noted that a local manufact...

News  Updated at: 2026/02/20

enerator module features a permanent magnet electric machine and a dual inverter mounted directly to an internal combustion engine (ICE), extending the range of the vehicle platforms.  A key factor in designing these custom products was achieving the OEM’s high performance needs in a challenging packaging space shared with the ICE. The BorgWarner team achieved a high-performance, compact solution with the use of its highly efficient and torque...

News  Updated at: 2026/02/12

d range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.  Tailored to meet the OEM’s size and space requirements, this customer-specific application incorporates an updated turbine housing designed to fit the available packaging constraints and enhance transient performance.   “BorgWarner is proud to extend our long-lasting, trusted partnership with this OEM by su...

News  Updated at: 2026/02/12

uctor devices with a focus on purity, precision, and productivity, building on the Purion H line with new technologies for advanced manufacturing. Veeco, headquartered in Plainview, New York, is engaged in manufacturing semiconductor process equipment that performs a key role in the fabrication and packaging of advanced semiconductor devices, including laser annealing, ion beam deposition, and metal organic chemical vapor deposition (MOCVD).  Bo...

News  Updated at: 2026/02/10

teel. These help to avoid over 70,000 metric tons of CO2 emissions annually. The agreements with Quadra Energy, Statkraft, Centrica Energy, and Sunnic Lighthouse cover a portfolio of wind and photovoltaic installations across Germany and support more sustainable production of high-quality steel for packaging, transformers, electric motors, and precision applications. (From a press release dated February 3, 2026)...

News  Updated at: 2026/02/09