of new 300 mm wafer manufacturing capacity by adjusting and expanding its existing site in Dresden. X-FAB is constructing a new open foundry facility at its existing site in Erfurt. It will focus on combining existing capabilities (so-called micro-electromechanical systems, or MEMS) with innovative packaging and integration processes. These chip technologies are crucial for applications in the automotive, AI, and medical sectors.  Based on Europ...

News  Updated at: 2025/12/17

Toyota launches all-new RAV4 in Japan On December 17, Toyota Motor launched the all-new RAV4 in Japan. The 6th generation RAV4 is a compact SUV built on the idea that "Life is an Adventure". While maintaining the RAV4's signature solid and powerful design and packaging, it has been developed around the keywords Diversification, Electrification, and Intelligence. Under Diversification, three distinct styles are offered: the sophisticatedly styled ...

News  Updated at: 2025/12/17

oversee chip manufacturing directly. The move highlights a collaboration that extends beyond a traditional customer–supplier arrangement into a business model in which the client participates in every stage of the process, from chip design to plant construction, production line configuration and packaging, to speed up feedback cycles. The meeting took place as Samsung prepares to start full-scale production of advanced chips at the KRW 50 tril...

News  Updated at: 2025/12/16

manufacture GaN power devices by utilizing Innoscience’s 200mm GaN-on-silicon process. They will collaborate to supply high-performance GaN power devices for electric vehicles (EVs) and other applications. They intend to flexibly meet customer needs by combining ON Semiconductor’s expertise in packaging, drivers, ad system integration, with Innoscience’s wafer production capacity. They will first accelerate the deployment of 40-200V GaN po...

News  Updated at: 2025/12/12

ships participated in our dealer engagement program to improve their environmental performance, reducing their use of electricity from non-renewable sources by 20% Circular Economy  • Reduced single-use plastics at on-site food service by over 75% as of FY2025  • Reduced the use of single-use packaging materials by almost 31% compared to FY2018 Water  • Achieved a 6.7% decrease in the current year for the number of gallons of water withd...

News  Updated at: 2025/12/06

are being developed together under a shared philosophy centered on three key elements: a low center of gravity, low weight with high rigidity, and the pursuit of aerodynamic performance. The GR GT was conceptualized and developed as a road-legal race car. Centered on front-engine, rear-wheel-drive packaging, it features a thoroughly low center of gravity and adopts Toyota’s first all-aluminum body frame to achieve low weight with high rigidity...

News  Updated at: 2025/12/05

nd for flexible production platforms in emerging markets. The project involves CNC Worldwide and over 40 parts suppliers that contribute to the vehicle’s production in Uzbekistan. Logistics operations are coordinated from Mexico, creating new industrial opportunities for companies specializing in packaging, inventory management, and international supply chains. The partnership with Hyundai Glovis México reinforces the country’s strategic rol...

News  Updated at: 2025/12/03

ve interior lighting. Through this agreement, Inova secures a new Samsung Foundry base to expand its global ISELED supply network, while CoAsia Semi gains the ability to independently develop and produce ISELED based automotive LEDs. By combining CoAsia Semi’s chip technology with ITSWELL’s LED packaging and module manufacturing, the CoAsia Group has established a vertically integrated ISELED value chain, from wafer to finished module. Both c...

News  Updated at: 2025/11/20

Wolfspeed launches 1200V silicon carbide power modules for E-mobility propulsion systems On November 17, Wolfspeed announced its new 1200V SiC six-pack power modules that set performance benchmarks for high-power inverters. By combining its latest advanced Gen 4 SiC MOSFET technology and new packaging, Wolfspeed’s modules deliver three times more power cycling capability at operating temperature than competing solutions, and 15% higher inverter...

News  Updated at: 2025/11/19

th OEMs. We are totally familiar with and understand automobiles. This makes it possible for us to make product proposals on motors that are optimal for each vehicle. In developing products for next-generation vehicles, we want to be sure to stay focused on core competency, which is "gear and motor packaging." Our strength lies in our software-based system package also, which allows us to control everything by bundling everything in a total packa...

News  Updated at: 2025/11/14

ss grille. Flush door handles, as offered on the Kia EV6 and EV9 models, lend to a clean and modern appearance. The Telluride X-Pro has blacked-out trim, all-terrain tires and 9.1 inches of ground clearance. Due to its increased overall length and height, the 2027 Telluride offers improved interior packaging with increased headroom and enhanced access for easier entry and exit into the second and third rows.  (Kia release on November 10, 2025)...

News  Updated at: 2025/11/11

n expected to begin in 2026. BorgWarner’s dual inverter adopts a highly integrated design, enabling the synchronous control and drive of two motors through a single controller, along with double-sided cooling that includes the newest generation of Viper power switch. The technology allows for the packaging of different types of semiconductor dies within modules of the same size, ensuring compliance with increasingly stringent China light-duty v...

News  Updated at: 2025/11/01

ct electric vehicle (EV). Featuring a sleek and sophisticated design unique to Honda 0 Series and original proportions that express the dynamic nature of SUVs, the Honda 0 α will blend beautifully with both urban and natural environments, supporting people’s lives in every situation. By applying packaging design based on the “Thin” approach, styling with a low vehicle height was achieved without compromising ground clearance, creating a th...

News  Updated at: 2025/10/30

responses to safeguard production continuity. The disruption comes despite repeated requests by suppliers to diversify sourcing and production locations. Nexperia operates in Europe, but a structural imbalance remains. Decisions taken over the years have left Europe without sufficient semiconductor packaging capacity. This situation is a clear reminder of the strategic need to strengthen local capabilities.  Suppliers are hit first and hardest b...

News  Updated at: 2025/10/28

’ Penang Plant in Malaysia. The two companies will strengthen their cooperative relationship through joint investment and a long-term supply agreement. Analog Devices’ Penang Plant was established in 1994. Through the acquisition, ASE Technology will expand global networks for its semiconductor packaging and test businesses and strengthen its supply chains. The two companies plan to conclude a final agreement in the fourth quarter of 2025. (F...

News  Updated at: 2025/10/27

official record of 59 kW/kg i.e., a 40% improvement. The motor also delivers 350–400 kW of continuous power. It is developed at YASA’s Oxford Innovation Centre in UK. The motor is a fully functional prototype, not a digital concept. It uses axial flux technology, advanced cooling, and efficient packaging to deliver performance without exotic materials. The project is supported by the UK’s Advanced Propulsion Centre. YASA’s engineers are n...

News  Updated at: 2025/10/23

imec, Belgium, opens office in Germany to focus on advancements in automotive chiplet On October 16, imec inaugurated an office in the IPAI campus in Heilbronn, Germany, just months after unveiling plans for a new automotive chiplet innovation hub in Baden-Württemberg. imec’s Heilbronn hub is dedicated to cutting-edge chiplet design, advanced packaging, system integration, sensing, and (edge) AI – as part of imec’s broader Automotive Chipl...

News  Updated at: 2025/10/17

seamlessly integrated into the sophisticated compute systems of software-defined vehicles.  Imec’s ACP brings together key stakeholders from across the automotive and semiconductor ecosystems in a pre-competitive research initiative aimed at accelerating the adoption of chiplet architectures and packaging technologies in next-generation vehicles, meeting automotive-grade requirements for safety and reliability. As a foundry partner, GF will pr...

News  Updated at: 2025/10/15

Microchip’s THB 2 billion BOI-approved expansion strengthens Thailand’s semiconductor hub Announced on October 14, 2025, the Board of Investment (BOI) approved incentives for Microchip Technology (Thailand) Co., Ltd.’s expansion of wafer testing, IC packaging, and testing operations, with an investment of approximately THB 2 billion. This brings the company’s total BOI-promoted projects to 12, with cumulative investments exceeding THB 38 ...

News  Updated at: 2025/10/15

dia Private Limited, will be incorporated with Gabriel India holding a 49% stake and SK Enmove retaining 51%. Gabriel India will invest up to INR 294 million in the JV’s equity, in one or more tranches. The JV will focus on engineering, manufacturing (including third-party and contract blending), packaging, import, assembly, marketing, and export of engine oils (including motorcycle oil, passenger car motor oil, heavy-duty diesel oil), e-fluids...

News  Updated at: 2025/10/07