Nexperia, Netherlands, presents new MJD-style BJTs in clip-bonded FlatPower packaging On July 16, Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering, released as the MJPE-series, addresses the ongoing industry demand for more power-efficient and cost-effective designs in both industrial and automotive applications....

News  Updated at: 2025/07/18

Tata Electronics, India and Bosch to collaborate on semiconductor manufacturing and EMS On July 17, Tata Electronics and Robert Bosch GmbH signed a memorandum of understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries. Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test unit in Assam and the foundry in Gujarat. A...

News  Updated at: 2025/07/17

Tata Steel UK secures funding for AI-powered research to develop low-CO2 automotive steel On July 9, Tata Steel UK announced a new research initiative, ADAPT-EAF (Accelerating the Development of Automotive and Packaging steel Technology for Electric Arc Furnace production) aimed at developing a new generation of advanced steel products from its EAF. It will address controlling residual elements in high-recycled-content steel for demanding applica...

News  Updated at: 2025/07/11

ght response from 154 stakeholders from varied industry groups and countries that submitted statements related to the ongoing U.S. Commerce Department Section 232 investigation of whether to place tariffs on chips.  In its submission, TSMC highlighted plans for six advanced semiconductor fabs, two packaging facilities, and a research center as part of a USD 165 billion investment in Arizona, yet warned about tariffs making it harder to deliver t...

News  Updated at: 2025/06/27

ecialty semiconductors. The joint lab is focused on device innovations for chipmakers serving ICAPS markets (IoT, Communications, Automotive, Power, and Sensors). Applied and CEA-Leti plan to expand the lab with new equipment and capabilities.  Additionally, the lab would be equipped with advanced packaging tools to support the heterogeneous integration of chips across different wafer types and process nodes. The joint facility features several ...

News  Updated at: 2025/06/18

re resistance, are expected to effectively reduce reliance on lithium resources and build a safer and more low-carbon new battery industrial ecosystem. According to relevant regulations, before sodium-ion batteries are exported, China Customs shall conduct on-site inspection and assessment of their packaging applicability, compliance, and safety. Only after passing the inspection and assessment and being issued a related certificate can the expor...

News  Updated at: 2025/06/13

GlobalFoundries announces USD 16 billion total investment for U.S. semiconductor production and research On June 4, 2025, GlobalFoundries announced plans to invest USD 16 billion to expand its semiconductor manufacturing and advanced packaging capabilities in its facilities in New York and Vermont. The investment is in response to the rapid growth in demand for next-generation semiconductors as artificial intelligence applications become more pre...

News  Updated at: 2025/06/07

en as domestic and tourism-related slowdowns persist. The company continues to see robust demand for its plastic components in both the automotive and medical sectors and is actively pursuing new orders from auto parts manufacturers. It also maintains its supply of lubricant containers and consumer packaging. While the rise of electric vehicles could eventually impact lubricant container sales, PJW believes that the early stage of EV adoption in ...

News  Updated at: 2025/06/05

ted, allowing the electric motor to have a larger gear ratio and thus, be smaller than would otherwise be possible, without including in the hybrid transaxle the number, size, and weight of components necessary to provide multiple gear ratios or a variable drive ratio for the electric motor.” The packaging of this hybrid system could be compact enough for use in smaller vehicles, like compact or subcompact crossovers, and possibly even sedans a...

News  Updated at: 2025/06/05

d for extrusion and injection molding applications. These materials enable accurate liquid level detection as well as safer handling, transport, and storage by protecting against uncontrolled electrostatic discharges (ESD&Ex), critical requirements for diagnostics, electronics, chemical, industrial packaging, and other high-performance applications.  Founded in Finland in 1983, Premix Group is a global leader in the development and manufacturing...

News  Updated at: 2025/05/28

on in areas such as application of Chinese chips, construction of supply chain resources, tackling of technologies, establishment of a chip industrial ecosystem, and mutual market assistance. They will co-build an automotive-grade chip industrial ecosystem covering chip design, wafer manufacturing, packaging and testing, selection and application, and systematic solutions. From an FAW Group press release...

News  Updated at: 2025/05/20

ed its local EV manufacturing at HMMI with the all-new KONA Electric, the first EV in Indonesia to reach 80% Domestic Component Level (TKDN).  HLI Green Power produces battery cells for both local use and global export, while HEI handles battery module and system assembly, including configuration, packaging, welding, and rigorous testing to meet global standards. (From Hyundai Indonesia press release and social media updates)...

News  Updated at: 2025/05/20

Nexperia, Netherlands launches 1200 V silicon carbide MOSFETs in D2PAK-7 packaging On May 6, Nexperia introduced a range of highly efficient and robust automotive-qualified silicon carbide (SiC) MOSFETs with RDS(on) values of 30, 40, and 60 mΩ. These devices were previously offered in industrial grade and have now been awarded AEC-Q101 certification. This makes them suitable for automotive applications like onboard chargers (OBC) and traction in...

News  Updated at: 2025/05/06

Nexperia, Netherlands offers automotive planar Schottky diodes in CFP2-HP packaging On April 29, Nexperia announced that it is now offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrials as well as eight AEC-Q101-qualified products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged ...

News  Updated at: 2025/05/05

on Seiki, in the Sricity Industrial Park, Andhra Pradesh, India. The construction is set to begin in the summer of 2025, with operations starting in the fall of 2026 and full-scale mass production expected in 2027. The shifting of TFT LCD module production from overseas to India will reduce tariff, packaging, and transportation costs, enhancing Nippon Seiki's price competitiveness. Additionally, EDT and Nippon Seiki also signed a business partner...

News  Updated at: 2025/04/30

pared before the rules take effect. De Minimis: small shipments with low emissions should be exempt from reporting. Default Values: ACEA supports using default emission values without restrictions. Group Reporting: companies operating in multiple EU countries should be allowed to report as a group. Packaging Exemption: reused packaging reimported into the EU should not be subject to CBAM. Automatisation: reporting should be partly automated using...

News  Updated at: 2025/04/29

y achieved a USD 60 per kWh reduction in battery pack costs and is targeting a further USD 30 cut by the end of 2025. New lithium iron phosphate (LFP) battery chemistry is expected to play a role in these cost-reduction efforts, while new prismatic cells offer higher energy density and more compact packaging. (Ultium Cells and other sources on April 20, 2025)...

News  Updated at: 2025/04/26

design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven design solutions to the TSMC ecosystem for multiple horizontal applications from chiplets and SoCs to advanced packaging and 3D-ICs.  Cadence and TSMC are extending tool certification for newly announced TSMC N3C technology based on available N3P design soluti...

News  Updated at: 2025/04/26

Innoviz, Israel partners with Fabrinet, Thailand to produce InnovizTwo LiDAR platform for automotive OEMs On April 22, Innoviz Technologies Ltd. partnered with Fabrinet, a leading provider of advanced optical packaging and precision manufacturing services. In the partnership, Fabrinet will act as the chosen manufacturing partner for the InnovizTwo LiDAR product platform, including both the InnovizTwo Long-Range and Short- to Mid-Range solutions....

News  Updated at: 2025/04/23

it will be permitted to import will be reduced, Canada’s Finance Department said in a news release. The government also said it will provide a tariff reprieve for six months on imports of components or goods from the U.S. that are used in Canadian manufacturing, processing, and food and beverage packaging, as well as for certain items related to public health and national security objectives. Most of the cars and trucks made in Canada are ship...

News  Updated at: 2025/04/16