nector engineering can intersect to create innovative mmWave solutions. Their collaboration reflects a shared vision to advance high frequency connectivity technologies and expand their industrial applications. Q1. Do you foresee this compact connector and flexible waveguide technology enabling new packaging options for automotive radar, high-speed vehicle to infrastructure modules, or ADAS sensor fusion networks? A1. Yes, we believe it. By stabl...

News  Updated at: 2026/03/27

se regions.  Magna’s DHD REX offers:    • Electric driving, generating mode for efficient range extension, and optional parallel hybrid mode for improved highway performance    • Applicable to B through E segments in AWD layouts, including SUVs    • Modular, compact design simplifies packaging and supports easier adaptation across both ICE-based and BEV platforms. (Magna release on March 24, 2026)...

News  Updated at: 2026/03/25

especially for automotive uses, such as airbag tubes and rotor shafts. Production capacity will increase by about 15%. The investment will add a new production line featuring a drawbench, expanded heat treatment capacity, and advanced equipment for preparation, drawing, heat treatment, testing, and packaging. The drawbench is set to begin operations in May 2026. Currently, the site has approximately 1,100 employees and produces around 160,000 met...

News  Updated at: 2026/03/24

produce the AI5 chip for powering FSD & Optimus, AI6 for Optimus, and D3 for powering compute in space, as well as trying other types of chips in the future that push the limits of physics. As Musk said earlier in a post “The goal is to produce over a TERAWATT of compute per year (logic, memory & packaging) with ~80% for space and ~20% for the ground.” Musk did not divulge the total cost of the new Terafab, though it is estimated to be about ...

News  Updated at: 2026/03/24

ion investment will generate 30 new jobs and incorporates a European Hi-Lex patent validated for BMW project. Enhancements include a new 2,000-sqm hall with a 0.49 MW rooftop solar power system, two 1500-ton injection molding machines, a semi-automated production line, updated material handling and packaging equipment, and modernized measurement and IT infrastructure. (From HIPA press release dated March 17, 2026)...

News  Updated at: 2026/03/18

s and Micron Technology (MU) would not be able to supply sufficient chips for the company's EVs, robot and AI needs. "To remove the probable constraint in three or four years, we are going to have to build a Tesla Terafab." Elon Musk said on the call. "A very big fab that includes logic, memory and packaging, domestically." Musk had mused about the possibility of working with Intel. Taiwan Semiconductor makes Tesla's current AI4 chip with high-vo...

News  Updated at: 2026/03/17

ch use Qualcomm’s Snapdragon Digital Chassis system‑on‑chips, will be made at what Tata Electronics describes as India’s first high‑volume indigenous OSAT plant, a greenfield facility with an investment of about USD 3 billion that will focus on wire bond, flip chip, and Integrated Systems Packaging (ISP) technologies. The plant will serve applications in automotive, communications, IoT, and AI, while Qualcomm noted that a local manufact...

News  Updated at: 2026/02/20

enerator module features a permanent magnet electric machine and a dual inverter mounted directly to an internal combustion engine (ICE), extending the range of the vehicle platforms.  A key factor in designing these custom products was achieving the OEM’s high performance needs in a challenging packaging space shared with the ICE. The BorgWarner team achieved a high-performance, compact solution with the use of its highly efficient and torque...

News  Updated at: 2026/02/12

d range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.  Tailored to meet the OEM’s size and space requirements, this customer-specific application incorporates an updated turbine housing designed to fit the available packaging constraints and enhance transient performance.   “BorgWarner is proud to extend our long-lasting, trusted partnership with this OEM by su...

News  Updated at: 2026/02/12

uctor devices with a focus on purity, precision, and productivity, building on the Purion H line with new technologies for advanced manufacturing. Veeco, headquartered in Plainview, New York, is engaged in manufacturing semiconductor process equipment that performs a key role in the fabrication and packaging of advanced semiconductor devices, including laser annealing, ion beam deposition, and metal organic chemical vapor deposition (MOCVD).  Bo...

News  Updated at: 2026/02/10

teel. These help to avoid over 70,000 metric tons of CO2 emissions annually. The agreements with Quadra Energy, Statkraft, Centrica Energy, and Sunnic Lighthouse cover a portfolio of wind and photovoltaic installations across Germany and support more sustainable production of high-quality steel for packaging, transformers, electric motors, and precision applications. (From a press release dated February 3, 2026)...

News  Updated at: 2026/02/09

Pacific Industries Berhad (MPI), a supplier of Infineon. Along with the transition, Infineon secures a long-term supply agreement with MPI.  MPI is an investment holding company headquartered in Malaysia. Under the name Carsem, MPI’s subsidiaries are providing outsourced semiconductor assembly, packaging, and testing services (OSAT). MPI will assume operations with all production-related employees, providing them with an excellent long-term p...

News  Updated at: 2026/02/04

UAES achieves mass production of next-gen dual-inverter controller platform United Automotive Electronic Systems Co., Ltd. (UAES) achieved mass production of a next-generation dual-inverter controller platform. With a TPAK power module-based modular architecture, the platform offers flexible power configurations. Modular customization: The TPAK packaging technology enables adaptability to various heat sink substrate material solutions such as AMB...

News  Updated at: 2026/01/29

t cars hinted that designers and product planners are once again exploring Small Car concepts. Dacia’s Hipster concept and Citroën’s ELO—the latter of which was the first car to greet us upon entry—suggest a future where compact doesn’t mean compromised; it means more character, cleverer packaging, and more tech, without a ballooning size or price. Conclusion The Brussels Motor Show 2026 illustrated a European auto industry in transiti...

News  Updated at: 2026/01/29

Mazda announces pricing, packaging for all-new 2026 CX-5 in U.S. On January 13, Mazda North American Operations announced pricing and packaging details for the all-new, refined, third-generation 2026 Mazda CX-5. The redesigned CX-5 retains its familiar shape to previous CX-5 models, while advancing Mazda’s Kodo design with updated LED lighting, a wider stance, greatly improved rear seat and cargo space, and a refreshed color palette including a...

News  Updated at: 2026/01/17

Honda unveils Base Station Prototype as travel trailer for its SUVs On January 14, Honda revealed the Base Station Prototype, a new towable travel trailer concept from the engineers and designers at the company's U.S. R&D centers in Los Angeles and Ohio, that offers modularity, integrated smart technology, and clever packaging.  The Honda Base Station Prototype was developed to be towed behind vehicles like the  Honda CR-V, electric Honda Prolo...

News  Updated at: 2026/01/16

ecific generative AI for synthetic visual data in AI training, evaluation    • IdeAOcean: AI-driven design software, modular hardware development solution based on autonomous mechanism design    • Qunova: Quantum Application Software    • Solarstic: Solar module solutions using plastic packaging materials    • 3DC: Next-gen battery material development based on Graphene MesoSponge Since establishment in 2018, ZER01NE has invested...

News  Updated at: 2026/01/10

ned at IAA Mobility, ProLogium and Rimac have further deepened technical development. The jointly developed Superfluidized All-Inorganic Solid-State Lithium-Ceramic Battery Pack will be physically showcased at CES 2026. It will have key system-level advantages such as module-free architecture, high packaging efficiency, superior thermal management, maintenance and recycling friendly, and optimized mass production feasibility.  ProLogium will als...

News  Updated at: 2026/01/02

of new 300 mm wafer manufacturing capacity by adjusting and expanding its existing site in Dresden. X-FAB is constructing a new open foundry facility at its existing site in Erfurt. It will focus on combining existing capabilities (so-called micro-electromechanical systems, or MEMS) with innovative packaging and integration processes. These chip technologies are crucial for applications in the automotive, AI, and medical sectors.  Based on Europ...

News  Updated at: 2025/12/17

Toyota launches all-new RAV4 in Japan On December 17, Toyota Motor launched the all-new RAV4 in Japan. The 6th generation RAV4 is a compact SUV built on the idea that "Life is an Adventure". While maintaining the RAV4's signature solid and powerful design and packaging, it has been developed around the keywords Diversification, Electrification, and Intelligence. Under Diversification, three distinct styles are offered: the sophisticatedly styled ...

News  Updated at: 2025/12/17