he plan also includes the rollout of megawatt hypercharging (1,000 kW), while app-based payment integration for its charging ecosystem is expected to be introduced earlier, in 2026. Locally, XPeng plans to establish a dedicated R&D team in Malaysia and collaborate with MIDA and ARM on an automotive semiconductor and chip center initiative, supporting its localization strategy in advanced automotive technologies (From an article of Paul Tan on Jun...

News  Updated at: 2026/06/12

s weakest cell, each cell can contribute according to its capabilities. This can improve battery utilization and increase system robustness.  Nexperia’s bidirectional GaN device enables fast, efficient battery-cell-level switching, making the system cost-effective and practical, while additional semiconductor components support the overall design. By dynamically controlling and allocating battery sections through a software-defined architectur...

News  Updated at: 2026/06/11

indie launches edge AI SoC to power automotive, robotics perception systems On June 10, Aliso Viejo, California-based indie Semiconductor announced it has launched the iND881, a next-generation edge AI system-on-chip (SoC) designed for intelligent cameras in automotive, robotics, and physical AI applications.  Combining a Neural Processing Unit (NPU), Digital Signal Processor (DSP), quad-core ARM Cortex-A53 CPU, and indie’s low-latency multi-c...

News  Updated at: 2026/06/11

precise 15A current control, and reduces PCB size and system cost. It is a configurable platform that allows software-based adjustment of gate drive parameters, enabling design reuse across vehicle platforms, faster development, performance optimization, and compatibility with a wide range of power semiconductor technologies. Based on Skyworks Solutions, Inc. press release...

News  Updated at: 2026/06/10

oth industrial-grade and automotive-qualified variants. The portfolio offers RDS(on) options of 17, 30, 40, 60, and 80 mΩ. By enabling a direct die-to-heatsink thermal path from the top side of the package, these devices reduce reliance on the board as the primary heat-spreading path and allow the semiconductor and PCB thermal domains to be managed more independently. It is well-suited for EV onboard chargers, high-voltage DC-DC converters, EV c...

News  Updated at: 2026/06/10

Bosch introduces latest third-generation Silicon Carbide (SiC) semiconductors in India On June 10, Bosch introduced its latest third-generation Silicon Carbide (SiC) semiconductors in India. Bosch’s Gen 3 SiC technology enables more compact and efficient power electronics designs by reducing energy losses, improving thermal performance, and lowering system complexity and cooling requirements.  It delivers 20% higher performance, enabling longe...

News  Updated at: 2026/06/10

Nexperia partners with Semikron Danfoss on SiC power modules for EV applications On June 9, Nexperia signed a memorandum of understanding (MoU) with Semikron Danfoss to collaborate on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The partnership aims to combine Nexperia’s SiC semiconductor expertise with Semikron Danfoss’ power module integration capabilities to evaluate high-performance and scalable...

News  Updated at: 2026/06/10

factories SK hynix will diversify into new markets NVIDIA is creating, across AI infrastructure, personal AI and physical AI, codeveloping memory for NVIDIA Vera Rubin AI supercomputers, Vera CPUs, RTX Spark-powered PCs and Jetson Thor robotic computing platforms. The two companies will apply AI to semiconductor chip design and manufacturing, using NVIDIA CUDA-X libraries and NVIDIA PhysicsNeMo for semiconductor simulations, TCAD workflows and in...

News  Updated at: 2026/06/09

nounced the automotive industry’s first four-company demonstration of a high-speed SerDes system, powered by MIPI A-PHY, which will take place at AutoSens USA. Based on the MIPI A-PHY standard, the demonstration, taking place June 9-11, at AutoSens USA in Detroit, will feature solutions from Sony Semiconductor Solutions, Southchip Semiconductor Technology, Valens Semiconductor and Velinktech. These four A-PHY providers will contribute transmitt...

News  Updated at: 2026/06/09

Toshiba Europe launches new 40V MOSFETs for automotive applications On June 4, Toshiba Electronics Europe GmbH launched three new 40V N-channel power MOSFETs, XPMR5904PB, XPMR7404PB, and XPMR8504PB. The devices are designed for automotive applications such as inverters, semiconductor relays, load switches, and motor drives. The XPMR5904PB features Toshiba’s new SOP Advance(EWF) package which uses a copper clip to connect the chip and leads. Thi...

News  Updated at: 2026/06/08

lity consolidates four assembly and warehouse bases, which had been located apart from each other throughout the prefecture. The new plant has a floor space of 10,000 square meters and is built on a site of 40,000 square meters. igus plans to use the Tochigi Sakura Plant to customize automotive and semiconductor products manufactured in Germany and other countries for local markets and deliver the customized products in Japan. The company plans t...

News  Updated at: 2026/06/04

owo Co., Ltd. (Yokowo) announced that it had entered into a strategic business and capital alliance with Nippon Electric Glass Co., Ltd. (NEG). By combining the device development and materials development technologies of both companies, Yokowo and NEG will create new business themes, mainly in the semiconductor and information and communication fields. They will develop inspection substrates for optoelectronic devices and antennas with an eye on...

News  Updated at: 2026/06/03

Philippines’ DTI highlights MinebeaMitsumi expansion supporting automotive electronics and digital industries Announced on May 29, 2026, the Department of Trade and Industry highlighted MinebeaMitsumi Inc.’s Philippine operations, which support global semiconductor and electronics supply chains, including components used in vehicles. The firm has cumulative investments of approximately PHP 53 billion in the Philippines as of March 2026, with...

News  Updated at: 2026/06/02

TDK to build new sensor factory in Niigata using former JS Foundry facility TDK Corporation (TDK) announced the establishment of the TDK Shinano River Techno Factory in Ojiya City, Niigata Prefecture, to produce sensor products. The company will use the former JS Foundry factory site, a failed semiconductor contract manufacturer that went bankrupt. As demand for sensor technologies such as humanoid robots and autonomous driving becomes more diver...

News  Updated at: 2026/06/02

NGK announces new long-term business plan, with FY2035 sales target of JPY 1.3 trillion NGK Corporation (former NGK Insulators, Ltd.) announced on May 28 that it has formulated a new long-term business plan “2026-2035” aiming to achieve sales of JPY 1.3 trillion in the fiscal year that ends in March 2036 (FY2035). For the semiconductor and data center markets, which are rapidly growing for the proliferation of artificial intelligence (AI), as...

News  Updated at: 2026/05/29

Polar Semiconductor, US, and Nexperia, Netherlands, partner on power MOSFET manufacturing On May 27, Polar Semiconductor, LLC and Nexperia B.V. announced a partnership to manufacture next-generation power MOSFET devices at Polar Semiconductor’s US-based wafer foundry. The partnership will combine Polar’s expertise in power semiconductor manufacturing and ongoing capacity expansion with Nexperia’s power MOSFET technology. The collaboration w...

News  Updated at: 2026/05/28

GigaDevice wins multiple automotive design projects with Tury in Brazil Announced on May 27, 2026, GigaDevice has secured multiple automotive design wins with Brazilian automotive electronics manufacturer Tury, supporting its expansion in Latin America. Tury is adopting GigaDevice’s semiconductor products, including MCUs, power management devices, and analog components, for vehicle applications across control, safety, and infotainment systems. ...

News  Updated at: 2026/05/28

Infineon presents semiconductor solutions for electromobility at PCIM Europe 2026 On May 27, Infineon Technologies AG announced that it will present its comprehensive semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics, and electromobility at PCIM Europe 2026. For electromobility, it will present solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems.  It will al...

News  Updated at: 2026/05/27

Posco Future M sells all interest in Inner Mongolia Sinuo New Material Technology Posco Future M Co., Ltd. will sell all its stake (8.30%) in a Chinese artificial graphite anode maker, Inner Mongolia Sinuo New Material Technology Co., Ltd. (Inner Mongolia Sinuo). The sale is made in response to a call option exercised by Nsing Technologies Inc., a Chinese semiconductor maker and the largest shareholder of Inner Mongolia  Sinuo. In November 2021,...

News  Updated at: 2026/05/27

SEALSQ, Switzerland, completes integration of ASIC design company IC’Alps On May 20, SEALSQ Corp announced the integration of IC’Alps into its semiconductor and post-quantum technology ecosystem. By integrating IC’Alps’ ASIC engineering expertise, SEALSQ strengthens its capacity to design and control sovereign semiconductor technologies within Europe. IC’Alps specializes in custom integrated circuit development, low-power semiconductor ...

News  Updated at: 2026/05/26