Semiconductor epitaxial wafers are used in power modules. An epitaxial wafer is a wafer before it is made into a device; it consists of a thin layer attached to a semiconductor substrate. Resonac focuses on three things: reducing defects on the epi-wafer surface, reducing defects within the epi-layer, and increasing the size of epi-wafers.
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e-Axle Bharat Mobility Global Expo 2025 Bosch (Robert Bosch GmbH)
The modular design kit and flexible manufacturing concept facilitate custom-tailored solutions in terms of power output, torque and installation space. It has system voltages up to 800 V, higher power densities through silicon carbide semiconductor technology, and efficiencies of up to 96%. It offers power range = 40-250 kW, Voltage range = 400 V/800 V, Scable torque = 1000-6000 Nm
High-speed semiconductor fuses with low energy let-through, low peak currents, low-arc voltage and high heat dissipation to protect semiconductors; Can be used in renewable energy and industrial applications such as high-power stack assemblies, inverters, and battery racks
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Silicon-carbide-frame power module on cooler The Battery Show North America 2024 Schaeffler AG
Compatible with 400 V and 800 V architectures; Features compact, optimized design for flexible inverter integration, with multiple semiconductor configurations
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PowerSentinel advanced switching solution The Battery Show North America 2024 Eberspächer Gruppe GmbH & Co. KG
Compact semiconductor switch for all vehicle types; Can carry currents up to 2,000 A for a short time and 200 A continuously; Initially designed for 12 V applications, 24 and 48 V variants available in the future
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Semiconductor in the mobility IAA Transportation 2024 Denso Corporation
- High-voltage/power supply products and low-voltage/communication products are arranged on a mock-up for future mobility. - EEDS stands for Electrical/Electronic/Distribution/System. It achieves high-power power supply and high-speed, high-performance communication processing. - High-voltage/power supply products: Highly flexible wires with improved bend-ability, space-saving battery bus bar module with integrated cell voltage detection function, high-voltage semiconductor junction box, sensors, etc. - Low-voltage/communication products: zone ECUs, sensor HUBs, high-speed communication cables, optical connector and cable assemblies, etc.
The latest generation of transfer-molded power semiconductor modules. The lineup also includes products with SiC-MOSFETs and RC-IGBTs (Si) in the same package.
A combination of electric motor, invertor and gearbox in one single system housing for hybrid or electric vehicle (compact SUVs) with system voltages up to 800 V, higher power densities through silicon carbide semiconductor technology, and efficiencies up to 96%.
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Resin semiconductor module・inverter case for power conversion 2023 JSAE Automotive Engineering Exposition Taiho Kogyo Co., Ltd
-Supports 400-800V; 2 to 5 SiC chips per phase. -The SiC chips can be configured from 2 to 5 per phase to provide scalability according to output. (The exhibited product was equipped with three SiC chips.)
-Exhibiting high voltage/power supply solutions and low voltage/communication solutions -High-voltage and power supply solutions: Highly flexible wires with 60% improved bendability, high-voltage semiconductor junction box, various high-voltage connectors, sensors, etc. -Low-voltage communication solutions: zone ECUs compatible with high-speed communication (Ethernet), high-speed communication cables, optical components, various low-voltage connectors, etc.
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