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CSA Catapult, UK and SMD, Malaysia sign MoU for chip design and manufacturing
On April 23, Compound Semiconductor Applications (CSA) Catapult and SMD Semiconductor signed a memorandum of understanding (MoU) in the House of Commons. The MoU lays the foundation for both parties to work together in the design, prototyping, and manufacturing of next-generation semiconductor and compound semiconduc....
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