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X2F, US and Covestro, Germany partner for thermally conductive automotive heat-sink
On September 27, X2F announced a collaboration with Covestro to develop a thermally conductive automotive heat-sink with in-mold electronics using X2F’s transformative controlled viscosity molding technology. Application samples will be displayed at Covestro’s booth (Hall 6/A75-1/A75-2) during the K 2022 exhibition o....
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