FORVIA SE (FORVIA faurecia) (Formerly Faurecia SE) France Michel de Rosen (Chairman), Martin Fischer (CEO) -The Company is a major automotive technology group focused on providing solutions to improve the safety, affordability, customizability, and sustainability of mobility. Its strategy is aligned with the major trends in the current mobility market of electrification and sustainability, automated driving and safety, and digital and sustainable...

Major Suppliers  Updated at: 2025/05/09

ams-OSRAM AG Austria Aldo Kamper (CEO) -The Company is a global leader in providing optical solutions, with a particular focus on sensing and lighting technologies. It services several markets including the automotive, consumer, healthcare and industrial technology fields.-Within the automotive and mobility industries, the Company provides lighting, sensing and visualization technologies and systems. These include driver monitoring systems, gestu...

Major Suppliers  Updated at: 2025/05/01

Leapmotor Co., Ltd. Leapmotor: EV Minicar T03 (2020-), EV Minicar T03 (Comfortable Version, 2021-), C01 EV (2022-), SUV C11 EV (2021-), SUV C11 REV (2023-), C01 REV (2023-), SUV C10 EV (2024-), SUV C10 REV (2024-), SUV C16 EV (2024-), SUV C16 PHV (2024-), EV SUV B10 (2025-), EV B01 (2025-planning); Traction motor, Battery Pack, Electronic Control Systems etc; Leapmotor: EV Coupe Leap S01 (2019-2022); Leapmotor's Jinhua Plant in Zhejiang Provin...

OEM Plants  Updated at: 2025/04/17

Zhejiang Leapmotor Technology Co., Ltd. Headquarters of Leapmotor Leapmotor's Output : Vehicle 280,022 units ( 2024 ) Vehicle 144,888 units ( 2023 ) Vehicle 113,505 units ( 2022 ) Vehicle 45,055 units ( 2021 ) Vehicle 11,199 units ( 2020 ) Leapmotor's Production Capacity Plants units/year Production Capacity Note Plan Note Jinhua Plant 200,000 360,000 Qiantang Plant - 400,000 Planned to achieve mass production in 2026 Total 200...

OEM Plants  Updated at: 2025/03/04

China Automotive Semiconductor Development Trends From FAW Group, Dongfeng Motor, and Chery presentations Summary FAW Group : Current Status and Development Needs of the Automotive Semiconductor Industry Dongfeng Motor Corporation: Development Trends of E-Drive Systems and Power Semiconductors Chery : Semiconductor Ecosystem Development Trends for Intelligent Cars World Automotive Chip Innovation Conference(Source: WACIC)   The 2024 Wor...

Market & Tech Reports  Updated at: 2025/02/18

imec, Belgium signs European firms for automotive chiplet program On October 10, imec, a research and innovation center in nanoelectronics and digital technologies, announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Siemens, SiliconAuto, Synopsys, Tenstorrent, and Valeo are the first participants in its Automotive Chiplet Program (ACP). The ACP aims to identify chiplet architectures and packaging technologies that meet automotive ...

News  Updated at: 2024/10/14

2024 China Auto Forum: High-level Autonomous Driving From presentations by Avatr Technology, SAIC Intelligent Technology, and Reach Automotive Summary Avatr Technology: New Luxury through Advanced Intelligent Driving SAIC Intelligent Technology: Technology Evolution and R&D Challenges of Autonomous Driving Reach Automotive: Vehicle and Cloud Integration Contribution to Mass Production of Advanced Autonomous Driving 2024 China Auto Forum ...

Market & Tech Reports  Updated at: 2024/08/26

Garrett Motion Inc. (Formerly Honeywell Turbo Technologies Inc.) Switzerland Olivier Rabiller (Director, President & CEO) -The Company designs, manufactures and sells highly engineered turbocharger, air and fluid compression, high-speed electric motor, and connected vehicle technologies for OEMs and distributors. -The Company is a global technology leader in delivering products for internal combustion engines (ICE) using gasoline, diesel, natural...

Major Suppliers  Updated at: 2024/03/29

Ansys, Intel Foundry collaborate on multiphysics solution for EMIB 2.5D assembly On February 22, Ansys and Intel Foundry announced they are collaborating to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology by providing multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology.  Intel's 2.5D chip assembly uses EMIB technology to connect the d...

News  Updated at: 2024/02/23

Infineon, Germany presents family of automotive microcontrollers with new graphic engine On October 23, Infineon Technologies AG (Infineon) announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. With a small footprint, it simplifies OEM integration and reduces BOM costs, making them an ideal solution for advanced smart mobility instrument clusters and heads-up display systems for automobiles, m...

News  Updated at: 2023/10/25

ams OSRAM reveals new ALIYOS LED-on-foil technology for automotive lighting ams-OSRAM AG (ams OSRAM) launched its ALIYOS LED-on-foil technology. The advantages of the ALIYOS technology are transparency, thinness, and 2.5D bendability. This will enable car makers to create their brand personality through exterior and interior lighting, as well as to introduce new 3D lighting and animation effects for displaying dynamic individual messages and info...

News  Updated at: 2023/09/26

Analysis Report: Cockpit Modules (European Market) Development of 3D displays and larger IVI displays List of Suppliers Ⅰ. Introduction II. Cockpit module trends III. Cockpit module configuration IV. Overview of major cockpit module suppliers V. Cockpit module component suppliers and their customers VI. Installation status of cockpit modules from major suppliers by model Grupo Antolin-Irausa, S.A. Continental AG Dräxlmaier Group (Fritz Drä...

Market & Tech Reports  Updated at: 2023/09/14

Analysis Report: Cockpit Modules (European Market) Business Trends of Major Suppliers List of Suppliers Ⅰ. Introduction II. Cockpit module trends III. Cockpit module configuration IV. Overview of major cockpit module suppliers V. Cockpit module component suppliers and their customers VI. Installation status of cockpit modules from major suppliers by model Grupo Antolin-Irausa, S.A. Continental AG Draexlmaier Group (Fritz Draexlmaier G...

Market & Tech Reports  Updated at: 2022/08/04

Automotive Interiors Expo 2021 Europe Innovative materials, smart surfaces, lighting technologies, HMI concepts Summary AGC Automotive: Ultra-thin glass, smart door, and cover glass for car-mounted displays Walter Pack/Grupo Antolin: smart cockpit, and capacitive pad for seat adjustment Faurecia designLED & IRYStec: light tiles, active grille, and perceptual display KURZ: overhead light console, HMI panel, and self-healing front panel Forciot: s...

Market & Tech Reports  Updated at: 2021/12/09

Pricol, India announces a strategic alliance with Candera, Austria for HMI On August 25, Pricol Limited announced a strategic partnership with Candera, a leading Human-Machine Interface (HMI) tool provider and development partner for worldwide automotive and industrial customers. This strategic technology partnership with Candera will enable Pricol to get access to global HMI solutions for their range of Next Generation Connected Driver Inform...

News  Updated at: 2021/08/25

Analysis Report: Cockpit Module (European Market) Business Trends of Major Suppliers List of Suppliers Ⅰ. Introduction II. Cockpit module trends III. Cockpit module configuration IV. Overview of major cockpit module suppliers V. Cockpit module component suppliers and their customers VI. Installation status of cockpit modules from major suppliers by model Grupo Antolin-Irausa, S.A. Continental AG Draexlmaier Group (Fritz Draexlmaier GmbH & Co...

Market & Tech Reports  Updated at: 2021/06/10

Leapmotor releases first self-developed automotive-standard AI chip On October 29, 2020, the Chinese EV startup Zhejiang Leapmotor Technology Co., Ltd. (Leapmotor) released its first independently-developed intelligent driving chip. Leapmotor claimed that the chip, dubbed Lingxin 01 in Chinese, is close to Mobileye chips in terms of processing performance. The chip adopts a core CPU processor called Xuantie C860 supplied by PingTouGe Semiconduct...

News  Updated at: 2020/11/03

SAIC Motor launches Roewe RX5 ePLUS plug-in hybrid SUV with retail price starting from CNY 152,800 On September 23, SAIC Motor Passenger Vehicle Company, a wholly owned subsidiary of SAIC Motor Corporation Limited (SAIC Motor), released the all-new 3.0T plug-in hybrid technology and launched the Roewe RX5 ePLUS, the first SUV using the technology. The vehicle is available in two versions at a starting retail price of CNY 152,800. For the all-new ...

News  Updated at: 2020/09/25

SAIC Motor begins preorders of Roewe RX5 PLUS On May 4, the Roewe brand of SAIC Motor Corporation Limited (SAIC Motor) officially began the preorders of the RX5 PLUS SUV, a face-lifted model of the RX5. The vehicle is available in three versions and retails for between CNY 122,800 and CNY 139,800. The vehicle is 4,571mm long, 1,855mm wide and 1,719mm high with a wheelbase of 2,708mm. The vehicle is equipped with a 1.5L turbocharged direct inject...

News  Updated at: 2020/05/11

Casio Computer to offer 2.5D print system for automotive industry Casio Computer Co., Ltd. (Casio Computer) has developed a Mofrel 2.5-dimensional printing system that creates projections and depressions on the surface of special paper, and will offer it for the automotive industry. The system reproduces the texture of materials like leather, fabric, and strings, and Casio Computer expects it to be used for the development of automotive seats and...

News  Updated at: 2017/11/17