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EKPO NM12 Single PEM fuel cell stack module
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High Sound Pressure Level AMD Piezo Sounder
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On-site coverage: Subaru and Infineon announce details of collaboration on in-vehicle MCUs
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CES 2026 Launch Event: Autolink announces AI Link 3.0 Deep Fusion Electronic and Electrical Architecture
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CES 2026: Elektrobit unveils EB civion to boost SDV cockpit development
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smart launches #5 EHD plug-in hybrid electric SUV
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Siemens Expands PAVE360 technology for SDVs with AMD and Microsoft Azure
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CES 2025: smart showcases interior technology in new #5 SUV
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Ansys, USA partners with Cognata, Israel to enable automotive sensor testing
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CES 2025: Elektrobit provides SDV roadmap with open source from cloud to cockpit
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GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG Germany -AMD Inc. IC Memory (DRAM / SRAM / etc.) ISO14001 IATF16949 (Formerly ISO/TS16949) ISO9001...
Search Suppliers Updated at: 2026/02/19
AMD Plastics de México, S. de R.L. de C.V.
AMD Plastics de México, S. de R.L. de C.V. Mexico -Shareholder(s): AMD Plastics, LLC Plastic injection molding Plastic extrusion processing Foaming ISO9001...
Search Suppliers Updated at: 2025/05/15
BlackBerry Limited (BlackBerry QNX) (Formerly QNX Software Systems Ltd.)
ombining LiDAR and camera; Another demonstration highlights 13 virtualized screens, with red running on QNX OS and green running on a guest Android OS with a hypervisor; VirtIO enables communication between the QNX OS and guest OS Showcases hardware-agnostic capabilities of QNX Cabin, running on an AMD Ryzen SoC and a MediaTek SoC Demonstration is running using a dSpace simulation to communicate with the QNX Cabin instance and highlights QNX Cabi...
Search Suppliers Updated at: 2025/04/11
Autolink Information Technology Co., Ltd. (Formerly BeiJing Autolink Information Technology Co., Ltd.)
ctronic and electrical vehicle architecture designed as foundation for intelligent vehicles, with emphasis on sensor fusion, high-bandwidth communication, cross-domain data sharing, and ADAS redundancy; Features central computing platform using Qualcomm Snapdragon SA8797 SoC; zonal controllers with AMD Versal AI Edge Series Gen 2; and ReinOCS PCIe optical communication backbone network Display features Avenir SDV suite integrated with the Compan...
Search Suppliers Updated at: 2025/04/08
AMD Plastics
AMD Plastics USA Various plastic molding Plastic injection molding ...
Search Suppliers Updated at: 2025/03/12
Advanced Micro Devices Inc. (AMD)
Advanced Micro Devices Inc. (AMD) USA IC LSI Memory (DRAM / SRAM / etc.) Board mounting Various semiconductors Printed circuit board Networking technologies Tesla smart LYNK & CO Model 3+ (RR) (China) Model 3+ (4WD) (China) Model Y (RR) (China) Model Y (4WD) (China) Model X (USA) Model Y (USA) Model 3 (USA) Model 3 (4WD) (China) Model 3 (RR) (China) Model S (USA) #5 EHD (China) Z10 (4WD) (China) Z10 (RR) (China) #5 (4WD) (China) #5 (RR) (China)...
Search Suppliers Updated at: 2025/02/21
AMD Decolletage
AMD Decolletage France -Shareholder(s): Savoy International Various machining Assembly Bolt / Nut Pin Fastener ISO14001 ISO9001 IATF16949 (Formerly ISO/TS16949)...
Search Suppliers Updated at: 2024/06/06
AMD Decolletage - Site 2
AMD Decolletage - Site 2 France -Shareholder(s): Savoy International Various machining Assembly Fastener Pin Bolt / Nut ISO14001 ISO9001 IATF16949 (Formerly ISO/TS16949)...
Search Suppliers Updated at: 2024/03/22
AMD Japan Co. Ltd
AMD Japan Co. Ltd Japan -Shareholder(s): Advanced Micro Devices, Inc Various semiconductors Printed circuit board Memory (DRAM / SRAM / etc.) LSI IC Board mounting Networking technologies ...
Search Suppliers Updated at: 2021/01/19
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