zation, and industrialization of secure and scalable chiplet technology for software-defined vehicles (SDVs). Chiplet technology delivers a modular alternative to traditional monolithic SoCs. The project unites 18 members, including BMW Group, Renault/Ampere, Stellantis, Valeo, Arteris, Axelera AI, Infineon, Menta, NXP, Tenstorrent, Siemens, TTTech Auto, CEA, CHIPS-IT, imec, and Fraunhofer. It is supported by the Chips Joint Undertaking and its m...

News  Updated at: 2025/12/19

Infineon and Lenovo, China, expand cooperation for autonomous driving and SDV On December 16, Infineon Technologies AG and Lenovo expanded their collaboration to accelerate the next level of autonomous driving. Lenovo’s autonomous driving domain controller units AD1 and AH1 will take advantage of Infineon’s AURIX family of microcontrollers to supportADAS, energy efficiency, and high-speed data exchange across in-vehicle networks. The joint so...

News  Updated at: 2025/12/17

Infineon extends CoolSiC MOSFET 750 V G2 family featuring ultra-low RDS(on) and new packages On December 10, Infineon Technologies AG launched new packages for the CoolSiC MOSFET 750 V G2 technology. It is now available in a range of packages, including Q-DPAK and D2PAK, offering a portfolio with typical RDS(on) values up to 60 mΩ at 25°C.  The portfolio extension includes products for various applications in the automotive sector, telecom, an...

News  Updated at: 2025/12/11

Infineon provides high-power silicon carbide technology for Electreon in-road charging technology On December 4, Infineon Technologies AG announced that it will supply customized silicon carbide (SiC) power modules to Electreon, a leading provider of wireless charging solutions for electric vehicles (EVs), for its dynamic in-road charging technology.  Infineon's customized SiC modules are at the heart of the application and efficiently convert t...

News  Updated at: 2025/12/04

The project provides key foundations for secure communication via cellular networks for connected automated driving and includes partners such as the Daimler Center for Automotive Information Technology Innovations (DCAITI), Fraunhofer-Institut für Offene Kommunikationssysteme (FOKUS), htw saar), Infineon, TÜV SÜD, and several universities. ConnRAD created mechanisms that allow vehicles and infrastructure to assess the reliability and quality...

News  Updated at: 2025/11/17

Infineon presents advanced microcontroller for high-voltage Li-ion battery management On November 13, Infineon Technologies AG presented the PSOC 4 HVPA-SPM 1.0, an advanced microcontroller designed for high-voltage Li-ion battery management in electric vehicles (xEVs). The microcontroller combines precision, safety, and programmability, while supporting zonal architectures and the transition to Software-Defined Vehicles (SDVs). Infineon is part...

News  Updated at: 2025/11/14

Infineon and partners develop supercomputer for autonomous driving under CeCaS project On November 6, Infineon Technologies AG announced that it is leading a research project called Mannheim-CeCaS (Central Car Server) with its partners. The project was supported by the German Federal Ministry of Research, Technology, and Space (BMFTR), with EUR 88.2 million. The demonstrator was successfully presented at the project closing event in Munich. The p...

News  Updated at: 2025/11/07

Infineon expands MOTIX SoC family with new solutions for BDC and BLDC motor applications On October 31, Infineon Technologies AG announced that it is expanding its MOTIX 32-bit motor control SoC (System-on-chip) family with new solutions for both brushed (BDC) and brushless (BLDC) motor applications: TLE994x and TLE995x.  The new products are tailored for small- to medium-sized automotive motors. The three-phase TLE995x (BLDC) is ideal for pumps...

News  Updated at: 2025/10/31

Infineon announces Ultra-Wideband (UWB) Application Lab in Graz, Austria On October 30, Infineon Technologies AG announced that it has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria. Developed in collaboration with Silicon Austria Labs (SAL), the lab focuses on advancing UWB technology, exploring innovative use cases, and delivering real-world applications for automotive, industrial, IoT, and consumer markets.  By ...

News  Updated at: 2025/10/31

er 1 suppliers are actively seeking alternative chip sources to protect against any enduring supply-side disruption. The chips sourced from Nexperia for automotive use tend not to be cutting edge which suggests there should be other manufacturers that can produce them. Alternative suppliers include Infineon, ON Semiconductor and STMicroelectronics, although validation processes for new component sourcing are often lengthy and costly. While experi...

News  Updated at: 2025/10/31

Infineon, Germany expands XENSIV sensor lineup for automotive applications On October 20, Infineon Technologies AG announced the expansion of its XENSIV magnetic current sensor lineup with the introduction of the new TLE4971 and TLI4971 sensors, available in a 300-mil package. These sensors deliver greater accuracy with a total error of just 0.7% over temperature and lifetime, making them ideal for automotive applications. The new XENSIV sensors ...

News  Updated at: 2025/10/27

Infineon launches 100 v CoolGaN automotive transistor for vehicle applications On October 15, Infineon announced the launch of its CoolGaN Automotive Transistor 100 V G1 family for production and began supplying samples of its pre-production range qualified for automotive use under AEC-Q101 standards. The lineup includes high-voltage CoolGaN Automotive Transistors and bidirectional switches. GaN power devices provide higher efficiency, smaller ...

News  Updated at: 2025/10/16

GlobalFoundries, US, joins imec’s Automotive Chiplet Program (ACP), Infineon, and TIER IV to follow On October 15, imec announced that GlobalFoundries has joined imec’s Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon, Silicon Box, STATS ChipPAC, and TIER IV have also committed to join ACP. Chiplet architectures offer a scalable, flexible, and cost-effective alternative that can be seamlessly ...

News  Updated at: 2025/10/15

ntres on a 700W, 12V to 48V converter designed for electric Anti-Roll Control (eARC) systems. Paired with an ultra-efficient supercapacitor module, the solution powers fast-reacting actuators and buffers transient loads, protecting the 12V bus and ensuring consistent voltage stability. Built on the Infineon AURIX TC23X microcontroller, the system meets ASIL B functional safety and ASPICE compliance standards. Hinduja Tech’s approach included re...

News  Updated at: 2025/09/30

Infineon and ROHM sign MoU for silicon carbide (SiC) power semiconductors On September 25, Infineon Technologies AG and ROHM Co., Ltd. signed a memorandum of understanding (MoU) to collaborate on packages for silicon carbide (SiC) power semiconductors. The partners aim to enable each other as second sources of selected packages for SiC power devices. In the future, customers will be able to source devices with compatible housings from both Infine...

News  Updated at: 2025/09/25

e anticipation that zone architecture, which integrates electronic control units (ECUs) by zone, will become widespread in next-generation vehicles. Marelli Corporation (Marelli), currently undergoing business restructuring, has developed a zone control unit called “Zones” in collaboration with Infineon Technologies AG (Infineon Technologies) of Germany and unveiled it in China in 2024. Marelli aims to become one of the world’s largest supp...

News  Updated at: 2025/09/25

Malaysian Pacific Industries Bhd to take over Infineon’s Bangkok backend fab, Thailand On September 18, 2025, Infineon Technologies AG announced it will transfer its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to long-time supplier Malaysian Pacific Industries Berhad (MPI).  The Bangkok site, which serves automotive, connectivity, and IoT packages, will retain all current production employees as part of MPI. The transaction, ex...

News  Updated at: 2025/09/19

Infineon expands XENSIV MEMS microphone lineup On September 16, Infineon Technologies AG expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57). The IM72D128V is distinguished by its top-tier Signal-to-Noise Rat...

News  Updated at: 2025/09/16

Rightware’s Kanzi Micro achieves technical certification through Infineon’ HMI Tool Certification Program On September 5, Rightware announced that Kanzi Micro achieved technical certification through Infineon Technologies’ HMI Tool Certification Program. It confirms Kanzi Micro’s seamless integration with Infineon’s TRAVEO T2G series microcontrollers, enabling high-performance, memory-efficient HMI solutions for automotive digital clust...

News  Updated at: 2025/09/11

Infineon signs MoU with Lingji to develop high-performance GAN based inverters On September 9, Infineon Technologies AG and Lingji Innovation Technology Co., Ltd., a subsidiary of Ninebot, signed a memorandum of understanding (MoU) to further drive gallium nitride (GaN) technology in light electric vehicles (LEV). Infineon provides GaN products supporting Lingji to develop high-performance electric two-wheeler inverter systems.   Lingji will lev...

News  Updated at: 2025/09/09