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Stellantis expands Mistral AI, France partnership to increase AI integration across vehicle operations
troubleshooting, or warnings and get instant, natural-language responses. The assistant will be continuously updated and customized for different Stellantis brands and models, ensuring a smooth and intuitive experience. Both companies are working on several AI projects such as: Bill of Materials (BOM) Data Intelligence: an AI tool that helps engineers analyze and optimize component selection for better reuse and efficiency. Vehicle Feedback Ana...
News Updated at: 2025/02/07
Tata Technologies, India updates about new business wins
sen by a North American Tier-1 supplier for software platform development and embedded testing. Tata Technologies has been selected by a North American OEM to streamline engineering processes in their PLM cloud application, including vehicle data management, data security, product definition, and BOM structure. (From a press release dated January 21, 2025)...
News Updated at: 2025/01/22
Audi uses NXP’s Trimension NCJ29Dx family in its new UWB platform
y Audi as part of its new platform. The Trimension NCJ29Dx family enables UWB-based fine-ranging capabilities and complies with IEEE 802.15.4, CCC, and FiRa standards. It delivers high localization resolution and power optimization for battery-powered devices such as key fobs, while also minimizing BOM costs. It maximizes protection against car theft through relay attacks and includes on-chip support for a wide range of cryptographic operations. ...
News Updated at: 2024/10/23
Infineon and MediaTek, Taiwan announce easy-to-use cockpit solution
Infineon and MediaTek, Taiwan announce easy-to-use cockpit solution On July 13, Infineon Technologies AG announced that it has developed an easy-to-use cockpit solution with MediaTek and its design house partners. It is based on Infineon's TRAVEO CYT4DN MCU family and an entry-level MediaTek Dimensity Auto SoC solution that reduces system BOM costs for hardware and software. This new cockpit solution supports a resolution of 1920 x 720 pixels for...
News Updated at: 2024/07/16
hofer powertrain, Germany presents ONEboard+ for advance inverter control
or a second inverter in a single layout. The new solution also plays a crucial role in the implementation of torque vectoring. Compliance with the latest cybersecurity standards is ensured using the latest microcontroller technology. The ONEboard+ now supports up to three independent CAN nodes. The BOM costs can be significantly reduced compared to the previous solution by incorporating the electrical drive for EESM as an integrated solution rath...
News Updated at: 2024/06/04
Microchip Technology launches 10 multi-channel remote temperature sensors
tance error correction and beta compensation, eliminating the need for additional configuration for improved accuracy. Monitoring temperatures at multiple locations with a single, integrated temperature sensor reduces board complexity and size and simplifies design for a lowered bill of material (BOM). Microchip Technology is a leading provider of smart, connected and secure embedded control solutions, headquartered in Chandler, Arizona. (Micro...
News Updated at: 2024/01/19
Infineon, Germany presents family of automotive microcontrollers with new graphic engine
Infineon, Germany presents family of automotive microcontrollers with new graphic engine On October 23, Infineon Technologies AG (Infineon) announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. With a small footprint, it simplifies OEM integration and reduces BOM costs, making them an ideal solution for advanced smart mobility instrument clusters and heads-up display systems for automobiles, m...
News Updated at: 2023/10/25
XPeng holds first global partners conference in Zhaoqing, Guangdong
e based on the Fuyao architecture by the end of 2026. With the support of the Fuyao architecture, the development cycles of future new XPeng models will be shortened by 20%, and the universalization rates of parts for the architecture will reach up to 80%, significantly reducing the development and BOM costs of the new models. XPeng plans to officially launch high-speed NGP 2.0 in June and is expected to realize less than one takeover per 1,000km...
News Updated at: 2023/05/29
Kautex adopts life cycle assessments with D2CO2 app for its sustainable products
Kautex adopts life cycle assessments with D2CO2 app for its sustainable products Kautex Textron GmbH & Co., KG (Kautex) announced that it has utilized life cycle assessments (LCAs) with its easy-to-use tool, the D2CO2 app for its sustainable products. The D2CO2 app allows the user to input various elements of the product including BOM, material, weights, production method, and other elements to output an overall kg of CO2 emission. The app lets t...
News Updated at: 2023/05/02
Daimler Truck partners with Siemens for integrated digital engineering platform
bally across Daimler Trucks’ engineering hubs, brands, and business segments. The new digital platform will expand Daimler Truck’s adoption of the Xcelerator portfolio through the implementation of Teamcenter software for “Product Lifecycle Management” (PLM), extended with bill of material (BOM) management as its future standard PLM solution. It integrates Daimler Truck teams’ workflows, systems, and their associated mechanical design, ...
News Updated at: 2023/03/28
CISSOID, Belgium and Silicon Mobility, France partner for modular SiC inverter reference design
D will also sell and deliver Silicon Mobility’s OLEA APP INVERTER Software for electric vehicle powertrain control providing the customer with a development platform ready for integration work. Once the design is completed, the customer can choose to purchase the entire inverter bill-of-material (BOM) from CISSOID or just the SiC intelligent power module (IPM) and control board, while purchasing other components and Inverter housing from their ...
News Updated at: 2023/03/21
EcoVadis, France supports ACC for responsible sourcing
EcoVadis, France supports ACC for responsible sourcing On March 15, Automotive Cells Company (ACC) announced that all its BOM (Bill of Materials) suppliers were assessed by EcoVadis, the CSR and sustainable procurement performance assessment platform, by the end of 2022. 100% of them will have to meet ACC’s CSR requirements for the BBD1 plant’s start of production by the second half of 2023. For materials considered as priorities on sustainab...
News Updated at: 2023/03/16
hofer, Germany develops battery safety solution “iBDU”
hofer, Germany develops battery safety solution “iBDU” On March 2, hofer powertrain unveiled the "Intelligent Battery Disconnect Unit" (iBDU), an optimized battery safety solution. By using the iBDU, automobile manufacturers and Tier1 suppliers can significantly reduce their development and component costs, material costs (BOM), and the number of required components - currently there are cost savings of up to 12% at the BDU level and space ...
News Updated at: 2023/03/03
TactoTek, Finland announces IMSE LightChannels to create programmable light structures
mixing while eliminating unwanted light bleed. Like all IMSE solutions, IMSE LightChannels structures are extremely thin, eliminate air gaps, and simplify construction. It also offers significant cost advantages over traditional electronics and smart surface construction techniques by optimizing BoM and eliminating separate illumination structures. IMSE LightChannels platform supports up to seven different types of dynamic and static illuminat...
News Updated at: 2023/02/20
Solar EV Start-up Lightyear, Netherlands raises EUR 81 million investment
Solar EV Start-up Lightyear, Netherlands raises EUR 81 million investment On September 6, Lightyear announced that it has raised a total investment of EUR 81 million, which includes capital from the public consortium consisting of Invest-NL, the province of North Brabant, and regional development agencies for the provinces of North Brabant and Limburg (BOM and LIOF). The funds received will ensure the Company advances in the production of Lightye...
News Updated at: 2022/09/06
Hailo, Israel partners Renesas for ADAS solutions
, while delivering best-in-class TOPS/W. It is the highest performing solution available today in the automotive market, ranging from 60 TOPS to over 170 TOPS for multi-sensor perception and fusion. It delivers Best-in-class power efficiency, enabling ECUs to be passively cooled, which reduces the BOM and system cost. The joint Hailo-Renesas solution is available for customer evaluations and demonstrations. It will be showcased live at Automob...
News Updated at: 2022/06/27
Qt, Finland partners with Bosch for HMI design and development
environment, including the likes of INTEGRITY RTOS, QNX Neutrino RTOS, Android Automotive OS, and Automotive Grade Linux (AGL), as well as the newest addition to the Qt offering, AUTOSAR CLASSIC. OEMs can maximize the efficiency of graphics computing and safety while reducing the bill of material (BOM) cost. The collaboration eliminates the need to buy additional hardware as all features such as heating, ventilation, air conditioning (HVAC), and...
News Updated at: 2022/06/22
Fablink, UK establishes new division for low volume manufacturing solutions
ble to electrically powered vehicles, where lightweight components are of vital importance to battery range, vehicle performance, and environmental impact. Streamline Automotive will also provide customers with fundamental support through purchasing and the supply chain including Bill of Materials (BOM) establishment and sourcing strategies across a range of relevant commodities, including EV powertrain systems and batteries. Fablink Group press ...
News Updated at: 2022/05/11
Infineon launches new generation of OptiMOS SD power MOSFETs
rce-Down (SD) power MOSFETs. They come in a PQFN 3.3 x 3.3 square mm package and a wide voltage class ranging from 25 V up to 100 V. This package sets a new standard in power MOSFET performance, offering higher efficiency, higher power density, superior thermal management and low bill-of-material (BOM). The PQFN addresses applications including motor drives, SMPS for server and telecom and OR-ing, as well as battery management systems. I...
News Updated at: 2022/01/10
IAA 2021:Intel CEO predicts chips to be more than 20% of premium car cost by 2030
IAA 2021:Intel CEO predicts chips to be more than 20% of premium car cost by 2030 On September 7, Intel CEO Pat Gelsinger predicted that semiconductors will account for more than 20% of the total premium vehicle bill of materials (BOM) by 2030, representing a staggering 5X growth rate over 2019’s 4% figure, and coming amid increasing demand for semiconductors generally. Gelsinger predicted the total addressable market (TAM) for automotive sem...
News Updated at: 2021/09/09