Valeo and Calyos partner to develop passive two-phase chip cooling solutions for mobility and data centers
Valeo Group (Valeo) has signed a Memorandum of Understanding (MoU) with Calyos to develop and industrialize high-performance, standalone, passive two-phase chip cooling solutions for mobility and data center applications.
The collaboration combines Calyos’ Loop Heat Pipe expertise with Valeo’s thermal systems enginee....
The collaboration combines Calyos’ Loop Heat Pipe expertise with Valeo’s thermal systems enginee....
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