X-FAB, Germany adds back-side illumination capability to optical sensor offering
On April 3, X-FAB Silicon Foundries SE announced a major addition to its optical sensor offering. Aimed at use in next-generation image sensor fabrication, it can now provide a back-side illumination (BSI) capability about its popular XS018 180nm CMOS semiconductor process.
Through BSI, imaging devices’ performance c....
Through BSI, imaging devices’ performance c....
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