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Ansys, Intel Foundry collaborate on multiphysics solution for EMIB 2.5D assembly
On February 22, Ansys and Intel Foundry announced they are collaborating to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology by providing multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology.
Intel's 2.5D c....
Intel's 2.5D c....
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