Henkel introduces thermal interface material (TIM)
On June 10, Henkel announced the debut of its latest thermal interface material (TIM) innovation, Bergquist Gap Filler TGF 7000 (image). It effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 grams per second, a combination which is currently the only one of its kind. ....
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